WO2012138584A3 - Diode-laser illuminator with interchangeable modules for changing irradiance and beam dimensions - Google Patents

Diode-laser illuminator with interchangeable modules for changing irradiance and beam dimensions Download PDF

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Publication number
WO2012138584A3
WO2012138584A3 PCT/US2012/031732 US2012031732W WO2012138584A3 WO 2012138584 A3 WO2012138584 A3 WO 2012138584A3 US 2012031732 W US2012031732 W US 2012031732W WO 2012138584 A3 WO2012138584 A3 WO 2012138584A3
Authority
WO
WIPO (PCT)
Prior art keywords
diode
laser
slow
laser illuminator
interchangeable modules
Prior art date
Application number
PCT/US2012/031732
Other languages
French (fr)
Other versions
WO2012138584A2 (en
Inventor
S. Krishna KUCHIBHOTLA
Xing Ming ZHENG
Original Assignee
Coherent, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coherent, Inc. filed Critical Coherent, Inc.
Priority to EP12717938.0A priority Critical patent/EP2695255A2/en
Priority to CN201280016412.3A priority patent/CN103650265A/en
Publication of WO2012138584A2 publication Critical patent/WO2012138584A2/en
Publication of WO2012138584A3 publication Critical patent/WO2012138584A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers
    • H01S5/405—Two-dimensional arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • G02B19/0057—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode in the form of a laser diode array, e.g. laser diode bar
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905—Dividing and/or superposing multiple light beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Lenses (AREA)
  • Laser Beam Processing (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Projection apparatus for projecting a radiation spot on a working plane includes a plurality of stacks of diode-laser bars. Each stack provides a beam of laser radiation. The diode-laser bars in each stack are arranged one above another in the fast-axis direction of the diode-laser bars. A corresponding plurality of beam-expanders expands the beam from the corresponding diode-laser bar stack in the slow-axis direction of the diode laser bars only. A focusing lens collects the slow-axis expanded beams and projects the slow-axis expanded beams into the working plane to form the radiation spot.
PCT/US2012/031732 2011-04-07 2012-03-30 Diode-laser illuminator with interchangeable modules for changing irradiance and beam dimensions WO2012138584A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP12717938.0A EP2695255A2 (en) 2011-04-07 2012-03-30 Diode-laser illuminator with interchangeable modules for changing irradiance and beam dimensions
CN201280016412.3A CN103650265A (en) 2011-04-07 2012-03-30 Diode-laser illuminator with interchangeable modules for changing irradiance and beam dimensions

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/082,171 US8602592B2 (en) 2011-04-07 2011-04-07 Diode-laser illuminator with interchangeable modules for changing irradiance and beam dimensions
US13/082,171 2011-04-07

Publications (2)

Publication Number Publication Date
WO2012138584A2 WO2012138584A2 (en) 2012-10-11
WO2012138584A3 true WO2012138584A3 (en) 2012-11-29

Family

ID=46022643

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/031732 WO2012138584A2 (en) 2011-04-07 2012-03-30 Diode-laser illuminator with interchangeable modules for changing irradiance and beam dimensions

Country Status (4)

Country Link
US (1) US8602592B2 (en)
EP (1) EP2695255A2 (en)
CN (1) CN103650265A (en)
WO (1) WO2012138584A2 (en)

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JP6285650B2 (en) * 2013-07-03 2018-02-28 浜松ホトニクス株式会社 Laser equipment
US10156488B2 (en) 2013-08-29 2018-12-18 Corning Incorporated Prism-coupling systems and methods for characterizing curved parts
WO2015056380A1 (en) * 2013-10-17 2015-04-23 ソニー株式会社 Light-source device, light-source unit, and image display device
US9983064B2 (en) 2013-10-30 2018-05-29 Corning Incorporated Apparatus and methods for measuring mode spectra for ion-exchanged glasses having steep index region
CN106471408B (en) 2014-04-23 2019-10-18 康宁股份有限公司 The method for proposing the contrast in heavily stressed prism-coupled measurement
US9377611B2 (en) 2014-05-16 2016-06-28 Coherent, Inc. Light-source including a planar array of diode-laser bars
US9919958B2 (en) 2014-07-17 2018-03-20 Corning Incorporated Glass sheet and system and method for making glass sheet
US9660418B2 (en) 2014-08-27 2017-05-23 Align Technology, Inc. VCSEL based low coherence emitter for confocal 3D scanner
US10247952B2 (en) 2015-03-04 2019-04-02 Coherent Lasersystems Gmbh & Co. Kg Polarization-controlled laser line-projector
CN108886232B (en) * 2015-12-25 2021-08-17 鸿海精密工业股份有限公司 Wire harness light source, wire harness irradiation device, and laser lift-off method
US10539805B2 (en) 2016-01-27 2020-01-21 Coherent, Inc. Aberration compensated diode-laser stack
CN108845331B (en) * 2018-06-28 2021-01-12 中国电子科技集团公司信息科学研究院 Laser radar detection system
CN109164668A (en) * 2018-09-30 2019-01-08 青岛海信激光显示股份有限公司 A kind of laser light source and laser projection system
WO2020071003A1 (en) * 2018-10-05 2020-04-09 パナソニックＩｐマネジメント株式会社 Light source device, projection device using same, and fluorescence excitation device
JP2021152567A (en) * 2020-03-24 2021-09-30 株式会社島津製作所 Light source device, projector, and machining device
JP2021167911A (en) * 2020-04-13 2021-10-21 株式会社島津製作所 Light source device, projector, and machining device
CN113655487A (en) * 2021-09-16 2021-11-16 中国电子科技集团公司第四十四研究所 Front-end device for continuous field-of-view laser short-range detection

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Also Published As

Publication number Publication date
EP2695255A2 (en) 2014-02-12
WO2012138584A2 (en) 2012-10-11
US20120257387A1 (en) 2012-10-11
CN103650265A (en) 2014-03-19
US8602592B2 (en) 2013-12-10

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