WO2002019392A1 - A method and device for docking a substrate carrier to a process tool - Google Patents

A method and device for docking a substrate carrier to a process tool Download PDF

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Publication number
WO2002019392A1
WO2002019392A1 PCT/EP2000/008560 EP0008560W WO0219392A1 WO 2002019392 A1 WO2002019392 A1 WO 2002019392A1 EP 0008560 W EP0008560 W EP 0008560W WO 0219392 A1 WO0219392 A1 WO 0219392A1
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WO
WIPO (PCT)
Prior art keywords
substrate carrier
process tool
front door
clamping
docking
Prior art date
Application number
PCT/EP2000/008560
Other languages
French (fr)
Inventor
Clint Haris
Original Assignee
Motorola Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc. filed Critical Motorola Inc.
Priority to PCT/EP2000/008560 priority Critical patent/WO2002019392A1/en
Publication of WO2002019392A1 publication Critical patent/WO2002019392A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Definitions

  • the present invention generally relates to a method and device for docking a substrate carrier to a process tool.
  • process tools require a hermetic or nearly hermetic seal between the process tool and a substrate carrier (for the 300 mm generation of process tools this carrier is also called Front Opening Unified Pod or shortly FOUP) .
  • substrate carrier for the 300 mm generation of process tools this carrier is also called Front Opening Unified Pod or shortly FOUP
  • process tools include furnaces that require minimal exposure of the loadlock to the atmosphere as well as tools that utilize a nitrogen purge for said substrate carrier.
  • the substrate carriers can either be purged from nitrogen purge sockets located on the base of the substrate carrier or through the use of a nitrogen purge through the substrate carrier front door opening.
  • FIG. 1 illustrates a known device for docking a substrate carrier to a process tool.
  • reference sign 1 denotes a wafer substrate carrier containing a plurality of wafer substrates 12.
  • 2 denotes a top flange for attaching a lifting means 5 for lifting said substrate carrier 1 to another location.
  • 11 denotes the bottom of said substrate carrier 1, and 50 a conveyor means for conveying said substrate carrier 1 in the horizontal plane.
  • 8 denotes the front door of the substrate carrier.
  • 10 denotes a process tool, here an oven, to which the substrate carrier 1 is to be docked in a hermetically sealed manner by using a clamping means 200.
  • the carrier 1 is also clamped to loadport 100 using another clamping means 501. All loadports have such clamping means 501 for holding the carrier 1.
  • This clamping means 501 is intended to prevent an operator from removing the carrier while the wafers are being processed.
  • an hermetic seal in form of a compliant rubber cushion surrounds the front door 8 of the substrate carrier 1. Moreover, on the side edges of the front side, there is a lip around the door 8.
  • the clamping means 200 which is connected to the front side of the process tool 10 engages with the lip in order to clamp said substrate carrier 1 and urge it against said process tool 10 for forming a sealed connection between both of them.
  • the front door 8 of the substrate carrier 1 is opened by latch keys on the front door of the process tool 10, and a wafer substrate handling mechanism (not shown) transports the wafer substrates 12 stored in said wafers substrate carrier 1 into said process tool 10 for thermal processing.
  • FIG. 1 illustrates a known device for docking a substrate carrier to a process tool
  • FIG. 2 illustrates a first embodiment of a device for docking a substrate carrier to a process tool
  • FIG. 3 illustrates a second embodiment of a device for docking a substrate carrier to a process tool
  • FIG. 4 illustrates a bottom view of the substrate carrier of the second embodiment shown in FIG. 2;
  • FIG. 5 illustrates magnified view of the front door section of the substrate carrier and the process tool of FIGS. 3; and FIG. 6 illustrates a simplified flow-chart diagram of a method for docking a substrate carrier to a front door of a process tool in an hermetically sealed manner .
  • a method for docking a substrate carrier to a process tool comprising a case having a front door to be docked to a front door of said process tool in a hermetically sealed manner by using a clamping means for clamping said substrate carrier and urging it against said process tool, and having interposed a seal between said substrate carrier and said process tool; and said clamping means clamping said substrate carrier at either or both of a top flange and a bottom retaining feature.
  • a device for docking a substrate carrier to a process tool comprising a case having a front door to be docked to a front door of said process tool in a hermetically sealed manner, said device comprising a clamping means for clamping said substrate carrier and urging it against said process tool, and a seal between said substrate carrier and said process tool; said clamping means being designed for clamping said substrate carrier at either or both of a top flange and a bottom retaining feature.
  • the general idea underlying the present invention is to utilize a clamping means to a standardized substrate carrier feature, particularly the top robotic flange or the bottom kinematic coupling plate, with which the substrate carrier is pressed against the seal located at the load port.
  • the present invention solves the problem of having to change tool and loadport design as one changes from one substrate carrier manufacturer to another.
  • said bottom retaining feature comprises at least one of a bottom recess and a bottom conveyor rail hole.
  • said substrate carrier is for carrying* semiconductor wafer substrates .
  • said top flange is also used for attaching a lifting means for lifting said substrate carrier.
  • said seal surrounds said front door of a process tool loadport.
  • FIG. 2 illustrates a first embodiment of a device for docking a substrate carrier to a process tool.
  • reference sign 100 denotes a loadport to a process tool 10 in form of a furnace.
  • the wafer substrate carrier 1 containing the wafer substrates 12 has been brought forward to the loadport by the conveyor means 50. Before, the wafer substrate carrier 1 has been set onto the conveyor means 50 by the lifting means 5 which engages with the top flange 2.
  • the clamping means 20 provided at the loadport and connected to the process tool 10 is moved to the top flange 2 of the substrate carrier 1 and clamped thereon (cf. 310 in FIG. 6).
  • the clamping means 20 will be retracted to the process tool 10 and therefore means 20 pulls the wafer substrate carrier 1 with its front door 8 to the front door 15 of the process tool 10.
  • the hermetic seal 7 surrounding the front door 15 of the process tool 10 (also cf . FIG. 4) is urged against the front wall of the substrate carrier 8 in order to establish hermetically sealed state.
  • the door 8 of the substrate carrier 1 and door 15 of the process tool 10 are opened, and the wafers 12 are transported to the process tool 10, as already explained above in connection with FIG. 1.
  • the clamping means 20 engages with the standardized top flange 2 of the wafer carrier which allows that substrate carriers of different manufacturers are used at the same time in the line.
  • FIG. 3 illustrates a second embodiment of a device for docking a substrate carrier to a process tool.
  • the clamping means 20' is attached to the loadport 100 basis and engages with standardized retaining features at the bottom plate 11 of the substrate carrier 1. As may be obtained from FIG. 1, there are different standardized retaining features in the bottom plain of the substrate carrier 1.
  • FIG. 4 illustrates magnified view of the front door section of the substrate carrier 1 and the process tool
  • a hermetic seal 7 in form of a compliant rubber cushion surrounds the front door 8 of the substrate carrier 1.
  • the seal 7 is located at the side of the tool 10. Moreover, on the side edges of the front side of the carrier 1, there is a lip 9 around the door 8.
  • clamping means 200 used in the prior art; as well as the mentioned latch keys in front door 15 of tool 10.
  • FIG. 5 illustrates a bottom view of the substrate carrier of the second embodiment shown in FIG. 3.
  • the clamping means includes two clamping mechanisms, namely one engaging with the top flange 2 and the other one engaging with the bottom plate retaining features 18 and/or 19 and/or 17a and /of 17b.
  • FIG. 6 illustrates a simplified flow-chart diagram of method 300 for docking a substrate carrier 1 having a case with a front door 8 to a front door 15 of a process tool 10 in a hermetically sealed manner (cf. FIGS. 2-5).
  • Method 300 comprises the steps of: clamping 310 substrate carrier 1 by using a clamping means 20, 20' at ' either or both of a top flange 2 and a bottom retaining feature (cf. FIG. 5, 17a, 17b; 18; 19) and moving 320 substrate carrier 1 against process tool 10 (cf. the horizontal arrows in FIGS. 2-3), thereby having interposed seal 7 between substrate carrier 1 and said process tool (10) substrate carrier (1).
  • the bottom retaining feature (17a, 17b; 18; 19) has at least one of a bottom recess (18; 19) and a bottom conveyor rail hole (17a, 17b) .
  • seal 7 surrounds front door 8 of said substrate carrier 1.

Abstract

The invention provides a method and device for docking a substrate carrier (1) to a process tool (10), said substrate carrier (1) comprising a case having a front door (8) to be docked to a front door (15) of said process tool in a hermetically sealed manner by using a clamping means (20, 20') for clamping said substrate carrier (1) and urging it against said process tool (10), and having interposed a seal (7) between said substrate carrier (1) and said process tool (10); and said clamping means (20, 20') clamping said substrate carrier (1) at either or both of a top flange (2) and a bottom retaining feature (17a, 17b; 18; 19).

Description

A METHOD AND DEVICE FOR DOCKING A SUBSTRATE CARRIER TO A
PROCESS TOOL
Field of the Invention
The present invention generally relates to a method and device for docking a substrate carrier to a process tool.
Background of the Invention
In semiconductor technology, some process tools require a hermetic or nearly hermetic seal between the process tool and a substrate carrier (for the 300 mm generation of process tools this carrier is also called Front Opening Unified Pod or shortly FOUP) . These process tools include furnaces that require minimal exposure of the loadlock to the atmosphere as well as tools that utilize a nitrogen purge for said substrate carrier. In nitrogen purge applications, the substrate carriers can either be purged from nitrogen purge sockets located on the base of the substrate carrier or through the use of a nitrogen purge through the substrate carrier front door opening.
FIG. 1 illustrates a known device for docking a substrate carrier to a process tool. In FIG. 1, reference sign 1 denotes a wafer substrate carrier containing a plurality of wafer substrates 12. 2 denotes a top flange for attaching a lifting means 5 for lifting said substrate carrier 1 to another location. 11 denotes the bottom of said substrate carrier 1, and 50 a conveyor means for conveying said substrate carrier 1 in the horizontal plane. 8 denotes the front door of the substrate carrier. 10 denotes a process tool, here an oven, to which the substrate carrier 1 is to be docked in a hermetically sealed manner by using a clamping means 200. In addition, the carrier 1 is also clamped to loadport 100 using another clamping means 501. All loadports have such clamping means 501 for holding the carrier 1. This clamping means 501 is intended to prevent an operator from removing the carrier while the wafers are being processed.
Preferably, an hermetic seal in form of a compliant rubber cushion surrounds the front door 8 of the substrate carrier 1. Moreover, on the side edges of the front side, there is a lip around the door 8. The clamping means 200 which is connected to the front side of the process tool 10 engages with the lip in order to clamp said substrate carrier 1 and urge it against said process tool 10 for forming a sealed connection between both of them.
Once such a hermetically sealed condition has been established, the front door 8 of the substrate carrier 1 is opened by latch keys on the front door of the process tool 10, and a wafer substrate handling mechanism (not shown) transports the wafer substrates 12 stored in said wafers substrate carrier 1 into said process tool 10 for thermal processing.
Unfortunately, these front door features which are suited for connecting to the clamping means are not standardized in thickness or size, and it is also possible for obstructions to be on the lip, e.g. the latch holes are on the door lip. This has resulted in tool loadport designs that must be changed as one changes the substrate carrier manufacturer and thus invalidates the concept of having interchangeable substrate carrier and loadport designs. All known prior art operators use the substrate carrier front frame to clamp and press. Thus the prior art fails by preventing the usage of substrate carriers from different suppliers or designs to the same time in the manufacturing line. The present invention seeks to provide to a method and device for docking a substrate carrier to a process tool which mitigate or avoid these and other disadvantages and limitations of the prior art.
Brief Description of the Drawings
FIG. 1 illustrates a known device for docking a substrate carrier to a process tool FIG. 2 illustrates a first embodiment of a device for docking a substrate carrier to a process tool; FIG. 3 illustrates a second embodiment of a device for docking a substrate carrier to a process tool; FIG. 4 illustrates a bottom view of the substrate carrier of the second embodiment shown in FIG. 2;
FIG. 5 illustrates magnified view of the front door section of the substrate carrier and the process tool of FIGS. 3; and FIG. 6 illustrates a simplified flow-chart diagram of a method for docking a substrate carrier to a front door of a process tool in an hermetically sealed manner .
Detailed Description of a Preferred Embodiment
In accordance with one aspect of the present invention, a method for docking a substrate carrier to a process tool is provided, said substrate carrier comprising a case having a front door to be docked to a front door of said process tool in a hermetically sealed manner by using a clamping means for clamping said substrate carrier and urging it against said process tool, and having interposed a seal between said substrate carrier and said process tool; and said clamping means clamping said substrate carrier at either or both of a top flange and a bottom retaining feature.
In accordance with another aspect of the present invention, a device for docking a substrate carrier to a process tool is provided, said substrate carrier comprising a case having a front door to be docked to a front door of said process tool in a hermetically sealed manner, said device comprising a clamping means for clamping said substrate carrier and urging it against said process tool, and a seal between said substrate carrier and said process tool; said clamping means being designed for clamping said substrate carrier at either or both of a top flange and a bottom retaining feature.
The general idea underlying the present invention is to utilize a clamping means to a standardized substrate carrier feature, particularly the top robotic flange or the bottom kinematic coupling plate, with which the substrate carrier is pressed against the seal located at the load port. Advantageously, the present invention solves the problem of having to change tool and loadport design as one changes from one substrate carrier manufacturer to another.
In the case of a clamp to the bottom kinematic coupling plate, it is possible that additional force may be applied to ensure that the substrate carrier remains firmly seated on the load ports kinematic coupling pins. This can for example be achieved by having said clamping means clamping at both of said top flange and said bottom plate. According to a preferred embodiment, said bottom retaining feature comprises at least one of a bottom recess and a bottom conveyor rail hole.
According to another preferred embodiment, said substrate carrier is for carrying* semiconductor wafer substrates . According to another preferred embodiment, said top flange is also used for attaching a lifting means for lifting said substrate carrier.
According to another preferred embodiment, said seal surrounds said front door of a process tool loadport. Throughout the figures, the same reference signs denote the same or equivalent parts.
FIG. 2 illustrates a first embodiment of a device for docking a substrate carrier to a process tool. In FIG. 2, reference sign 100 denotes a loadport to a process tool 10 in form of a furnace. The wafer substrate carrier 1 containing the wafer substrates 12 has been brought forward to the loadport by the conveyor means 50. Before, the wafer substrate carrier 1 has been set onto the conveyor means 50 by the lifting means 5 which engages with the top flange 2.
Now, in this position, the clamping means 20 provided at the loadport and connected to the process tool 10 is moved to the top flange 2 of the substrate carrier 1 and clamped thereon (cf. 310 in FIG. 6). In a next step, (cf. 320 in FIG. 6), the clamping means 20 will be retracted to the process tool 10 and therefore means 20 pulls the wafer substrate carrier 1 with its front door 8 to the front door 15 of the process tool 10. Then, the hermetic seal 7 surrounding the front door 15 of the process tool 10 (also cf . FIG. 4) is urged against the front wall of the substrate carrier 8 in order to establish hermetically sealed state. In this state, the door 8 of the substrate carrier 1 and door 15 of the process tool 10, are opened, and the wafers 12 are transported to the process tool 10, as already explained above in connection with FIG. 1.
Here, in contrast to the state of the art, the clamping means 20 engages with the standardized top flange 2 of the wafer carrier which allows that substrate carriers of different manufacturers are used at the same time in the line.
FIG. 3 illustrates a second embodiment of a device for docking a substrate carrier to a process tool.
According to the second embodiment shown in FIG. 3, the clamping means 20' is attached to the loadport 100 basis and engages with standardized retaining features at the bottom plate 11 of the substrate carrier 1. As may be obtained from FIG. 1, there are different standardized retaining features in the bottom plain of the substrate carrier 1.
FIG. 4 illustrates magnified view of the front door section of the substrate carrier 1 and the process tool
10 of FIGS. 2-3. As shown in more detail in FIG. 4, a hermetic seal 7 in form of a compliant rubber cushion surrounds the front door 8 of the substrate carrier 1.
Preferably, the seal 7 is located at the side of the tool 10. Moreover, on the side edges of the front side of the carrier 1, there is a lip 9 around the door 8.
Illustrated for convenience is also clamping means 200 used in the prior art; as well as the mentioned latch keys in front door 15 of tool 10.
FIG. 5 illustrates a bottom view of the substrate carrier of the second embodiment shown in FIG. 3.
Particularly, there are two recesses 18 and 19, with which the clamping means 20' can be engaged. Moreover, there are rails 16a, 16b, for the conveying means 50, said rails including holes 17a, 17b into which the clamping means 20' can be inserted.
With regard to said second embodiment it should be noted that clamping at the bottom plate 11 could result in a slanting of the wafer substrate carrier 1 at the loadport. Thus, in order to prevent such slanting, according to third not illustrated embodiment the clamping means includes two clamping mechanisms, namely one engaging with the top flange 2 and the other one engaging with the bottom plate retaining features 18 and/or 19 and/or 17a and /of 17b.
FIG. 6 illustrates a simplified flow-chart diagram of method 300 for docking a substrate carrier 1 having a case with a front door 8 to a front door 15 of a process tool 10 in a hermetically sealed manner (cf. FIGS. 2-5).
Method 300 comprises the steps of: clamping 310 substrate carrier 1 by using a clamping means 20, 20' at' either or both of a top flange 2 and a bottom retaining feature (cf. FIG. 5, 17a, 17b; 18; 19) and moving 320 substrate carrier 1 against process tool 10 (cf. the horizontal arrows in FIGS. 2-3), thereby having interposed seal 7 between substrate carrier 1 and said process tool (10) substrate carrier (1). Preferably, in clamping step 310, the bottom retaining feature (17a, 17b; 18; 19) has at least one of a bottom recess (18; 19) and a bottom conveyor rail hole (17a, 17b) . Preferably, in moving step 320, seal 7 surrounds front door 8 of said substrate carrier 1.
While the invention has been described in terms of particular structures, devices and methods, those of skill in the art will understand based on the description herein that it is not limited merely to such examples and that the full scope of the invention is properly determined by the claims that follow.

Claims

Claims
1. A method for docking a substrate carrier (1) to a process tool (10) , said substrate carrier (1) comprising a case having a front door (8) to be docked to a front door (15) of said process tool in a hermetically sealed manner by using a clamping means (20, 20' ) for clamping said substrate carrier (1) and urging it against said process tool (10) , and having interposed a seal (7) between said substrate carrier (1) and said process tool (10) ; and said clamping means (20, 20') clamping said substrate carrier (1) at either or both of a top flange (2) and a bottom retaining feature (17a, 17b; 18; 19).
The method according to claim 1, wherein said bottom retaining feature (17a, 17b; 18; 19) comprises at least one of a bottom recess (18; 19) and a bottom conveyor rail hole (17a, 17b) .
The method according to claim 1, wherein said substrate carrier (1) is for carrying semiconductor wafer substrates (12).
4. The method according to claim 1, wherein said top flange (2) is also used for attaching a lifting means for lifting said substrate carrier (1) .
5. The method according to claim 1, wherein said seal (7' surrounds said front door (8) of said substrate carrier (1) .
6. A device for docking a substrate carrier (1) to a process tool (10) , said substrate carrier (1) comprising a case having a front door (8) to be docked to a front door (15) of said process tool in a hermetically sealed manner, said device comprising a clamping means (20, 20') for clamping said substrate carrier (1) and urging it against said process tool (10), and a seal (7) between said substrate carrier (1) and said process tool (10); said clamping means (20, 20' ) being designed for clamping said substrate carrier (1) at either or both of a top flange (2) and a bottom retaining feature (17a, 17b; 18; 19) .
7. The device according to claim 6, wherein said bottom retaining feature (17a, 17b; 18; 19) comprises at least one of a bottom recess (18; 19) and a bottom conveyor rail hole (17a, 17b) .
8. The device according to claim 6, wherein said substrate carrier (1) is for carrying semiconductor wafer substrates (12).
9. The device according to claim 6, wherein said top flange (2) is designed for attaching a lifting means for lifting said substrate carrier (1).
10. The device according to claim 6, wherein said seal (7) surrounds said front door (8) of a process tool (10) loadport.
11. A method (300) for docking a substrate carrier (1) having a case with a front door (8) to a front door (12) of a process tool (10) in a hermetically sealed manner, said method comprising the steps of: clamping (310) said substrate carrier (1) by using a clamping means (20, 20') at either or both of a top flange (2) and a bottom retaining feature (17a, 17b; 18; 19) ; and moving (320) said substrate carrier (1) against said process tool (10) , thereby having interposed a seal (7) between said substrate carrier (1) and said process tool (10) substrate carrier (1).
12. The method according to claim 11, wherein in said clamping step, said bottom retaining feature (17a, 17b; 18; 19) has at least one of a bottom recess (18; 19) and a bottom conveyor rail hole (17a, 17b) .
13. The method according to claim 11, wherein in said moving step (320), said seal (7) surrounds said front door (8) of said substrate carrier (1) .
PCT/EP2000/008560 2000-09-01 2000-09-01 A method and device for docking a substrate carrier to a process tool WO2002019392A1 (en)

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Cited By (12)

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EP1450399A1 (en) * 2003-01-27 2004-08-25 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US7673735B2 (en) 2002-08-31 2010-03-09 Applied Materials, Inc. System for transporting substrate carriers
US7684895B2 (en) 2002-08-31 2010-03-23 Applied Materials, Inc. Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7792608B2 (en) 2002-08-31 2010-09-07 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7930061B2 (en) 2002-08-31 2011-04-19 Applied Materials, Inc. Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback
US8297319B2 (en) 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
US8672121B2 (en) 2007-10-22 2014-03-18 Applied Materials, Inc. Methods and apparatus for transporting substrate carriers
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod

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WO1999065803A1 (en) * 1998-06-17 1999-12-23 Genmark Automation, Inc. Automated opening and closing of ultra clean storage containers
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EP0987750A1 (en) * 1998-04-06 2000-03-22 Dainichi Shoji K.K. Container
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7673735B2 (en) 2002-08-31 2010-03-09 Applied Materials, Inc. System for transporting substrate carriers
US7792608B2 (en) 2002-08-31 2010-09-07 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7930061B2 (en) 2002-08-31 2011-04-19 Applied Materials, Inc. Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US7299831B2 (en) 2002-08-31 2007-11-27 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7684895B2 (en) 2002-08-31 2010-03-23 Applied Materials, Inc. Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US7711445B2 (en) 2003-01-27 2010-05-04 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
EP1450399A1 (en) * 2003-01-27 2004-08-25 Applied Materials, Inc. Overhead transfer flange and support for suspending a substrate carrier
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
CN100397607C (en) * 2003-01-27 2008-06-25 应用材料有限公司 Overhead transferring flange for hanging substrate carrier and supporting piece
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US8297319B2 (en) 2006-09-14 2012-10-30 Brooks Automation, Inc. Carrier gas system and coupling substrate carrier to a loadport
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod
US8672121B2 (en) 2007-10-22 2014-03-18 Applied Materials, Inc. Methods and apparatus for transporting substrate carriers

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