US20080298039A1 - Electron device having metallic connecting structure and method for making the same - Google Patents

Electron device having metallic connecting structure and method for making the same Download PDF

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Publication number
US20080298039A1
US20080298039A1 US11/843,668 US84366807A US2008298039A1 US 20080298039 A1 US20080298039 A1 US 20080298039A1 US 84366807 A US84366807 A US 84366807A US 2008298039 A1 US2008298039 A1 US 2008298039A1
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US
United States
Prior art keywords
metallic
bonding film
electronic device
connecting structure
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/843,668
Inventor
Jin-Gang Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZHOU, Jin-gang
Priority to US12/156,817 priority Critical patent/US8250746B2/en
Publication of US20080298039A1 publication Critical patent/US20080298039A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Definitions

  • the present invention relates, generally, to electronic devices having metallic connecting structure, and a method for making the electronic devices having metallic connecting structure.
  • the electronic devices With the development of wireless communication and information processing technologies, portable electronic devices such as notebook computers, mobile phones, and personal digital assistants (PDAs) are now in widespread use.
  • the electronic devices In order to obtain the electronic devices with a high mechanical strength and an attractive appearance, the electronic devices usually employ a housing made with metal materials, such as stainless steel, magnesium-aluminum alloy, and so on.
  • the metallic housing of the electronic device is manufactured by punching a raw metal sheet.
  • a number of clasping or latching structures are usually defined at an inner surface of the metallic housing.
  • the clasping or latching structures are configured for attaching or holding inner electronic components in the electronic device or for connecting to other parts of the metallic housing.
  • a metallic clip fixed to the inner surface of the metallic housing such that the metallic clip can be assembled to act as a restraint that presses down on some of the electronic components in the electronic device to keep them in place.
  • a number of studs formed on the inner surface of the metallic housing such that some of the electronic components can be fixed onto the metallic housing via screws engaged with the studs.
  • the metallic housing with the clasping or latching structures is difficult to be manufactured by punching.
  • the metallic clips and metallic studs are welded onto the inner surface of the metallic housing by laser.
  • an outer surface of the metallic housing may deform or change color due to the high temperature of the laser welding. Accordingly, the electronic device having the metallic housing cannot have an attractive appearance.
  • an electronic device having metallic connecting structure includes a metallic housing, at least one bonding film and at least one metallic element.
  • the metallic element is fixed to an inner surface of the metallic housing via the bonding film.
  • a method for making the electronic device described in a previous paragraph includes: providing a hot press machine having a press head; placing the one bonding film on the inner surface of the metallic housing; turning on the hot press machine and heating the press head to a first predetermined temperature of about 40° C. to about 50° C.; after heated to the first predetermined temperature, driving the press head to press the bonding film to the metallic housing for about two minutes, thereby attaching the bonding film on the metallic housing; placing the metallic element according to the corresponding bonding film of the metallic housing; heating the press head to a second predetermined temperature of about 160° C. to about 170° C.; after heated to the second predetermined temperature, driving the press head to press the metallic housing to the at least one metallic element for at least two minutes, thereby attaching the at least one metallic element on the corresponding bonding film.
  • FIG. 1 is an exploded, isometric view of an electronic device having metallic connecting structure according to a first preferred embodiment of the present invention.
  • FIG. 2 is a side view of the electronic device having metallic connecting structure of FIG. 1 .
  • FIG. 3 is a partial, cross-sectional view of an electronic device having metallic connecting structure according to a second preferred embodiment of the present invention.
  • FIG. 4 is an enlarged view of a circle portion IV of FIG. 3 .
  • the metallic connecting structure 20 includes a metallic housing 21 , a bonding film 23 , and a metallic clip 25 .
  • the metallic clip 25 is fixed to an inner surface of the metallic housing 21 via the bonding film 23 .
  • the metallic connecting structure 20 may be part of a housing of the electronic device.
  • the metallic housing 21 is a curved sheet.
  • the bonding film 23 is a thermoplastic adhesive bonding film.
  • the metallic clip 25 includes a base 251 and a U-shaped elastic portion 252 .
  • the U-shaped elastic portion 252 has a pair of leg portions (not labeled) extending from the base 251 and bending up and outwards.
  • a shape of the base 251 is similar to that of the bonding film 23 such that the base 251 can substantially adheres to the bonding film 23 , thus, improving the bonding strength between the metallic clip 25 and the metallic housing 21 .
  • a method for making the metallic connecting structure 20 of the electronic device includes the following steps.
  • a hot press machine (not shown) having a press head is provided.
  • the bonding film 23 is placed on the inner surface of the metallic housing 21 .
  • the hot press machine is turned on and the press head is heated to a first predetermined temperature of about 40° C. to about 50° C.
  • the press head is driven to press the bonding film 23 for about two minutes, thereby attaching the bonding film 23 on the metallic housing 21 .
  • the metallic clip 25 is positioned tightly on the bonding film 23 of the metallic housing 21 .
  • the temperature of the press head is then raised to a second predetermined temperature of about 160° C. to about 170° C. After heated to the second predetermined temperature, the press head is driven to press the metallic housing 21 to the metallic clip 25 for at least two minutes, thereby attaching the metallic clip 25 on the bonding film 23 of the metallic housing 21 .
  • the metallic connecting structure 30 includes a metallic housing 31 , a bonding film 33 , and a metallic stud 35 .
  • the bonding film 33 is a thermoplastic adhesive bonding film.
  • the metallic housing 31 is substantially a flat sheet.
  • a circular depression 32 is defined in an inner surface of the metallic housing 31 .
  • a size and a shape of the circular depression 32 are configured to correspond to a size and a shape of a base of the metallic stud 35 .
  • the bonding film 33 adheres to a bottom surface of the circular depression 32 and the metallic stud 35 adheres to the bonding film 33 in the circular depression 32 correspondingly. Accordingly, the metallic stud 35 is fixed to an inner surface of the metallic housing 31 via the bonding film 33 . It should be pointed out that it is better for the depth of the circular depression 32 to be greater than the thickness of the bonding film 33 .
  • a similar method for making the metallic connecting structure 30 of the electronic device includes the following steps.
  • a hot press machine (not shown) having a press head is provided.
  • the bonding film 33 is placed on the bottom surface of the circular depression 32 .
  • the hot press machine is turn on and the press head is heated to a first predetermined temperature of about 40° C. to about 50° C.
  • the press head is driven to press the bonding film 33 to the metallic housing 31 for about two minutes, thereby attaching the bonding film 33 on the metallic housing 31 .
  • the metallic stud 35 is positioned according to the bonding film 33 of the metallic housing 31 tightly.
  • the temperature of the press head is then increased to a second predetermined temperature of about 160° C. to about 170° C.
  • the press head After heated to a second predetermined temperature of about 160° C. to about 170° C., the press head is driven to press the metallic housing 31 to the metallic stud 35 for at least two minutes, thereby attaching the metallic stud 35 on the corresponding bonding film 33 of the metallic housing 31 .
  • a circular depression 32 of the metallic housing 31 can have other shapes as long as the shape of the circular depression 32 confirms to the shape of the base of the stud 35 . It should be pointed out that, the circular depression 32 can be omitted. That is, the metallic stud 35 can be directly fixed to the inner surface of the metallic housing 31 via the bonding film 33 anywhere on the metallic housing 31 .
  • the methods for making the metallic connecting structures 20 , 30 of the electronic devices are simple and can further decrease manufacture cost because of the use of the hot press machine instead of welding.
  • a working temperature of the methods for making the metallic connecting structures 20 , 30 of the electronic device is lower, thus the electronic device made by the methods is less likely to deform and/or change color easily due to high heating.

Abstract

An exemplary electronic device having a metallic connecting structure includes a metallic housing, at least one bonding film and at least one metallic clip. The at least one metallic clip includes a base and a U-shaped elastic portion, the U-shaped elastic portion having a pair of feet portions extending from the base and bending up and outwards. The metallic clip is fixed to an inner surface of the metallic housing via the bonding film.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates, generally, to electronic devices having metallic connecting structure, and a method for making the electronic devices having metallic connecting structure.
  • 2. Discussion of the Related Art
  • With the development of wireless communication and information processing technologies, portable electronic devices such as notebook computers, mobile phones, and personal digital assistants (PDAs) are now in widespread use. In order to obtain the electronic devices with a high mechanical strength and an attractive appearance, the electronic devices usually employ a housing made with metal materials, such as stainless steel, magnesium-aluminum alloy, and so on.
  • Typically, the metallic housing of the electronic device is manufactured by punching a raw metal sheet. A number of clasping or latching structures are usually defined at an inner surface of the metallic housing. The clasping or latching structures are configured for attaching or holding inner electronic components in the electronic device or for connecting to other parts of the metallic housing. For example, a metallic clip fixed to the inner surface of the metallic housing such that the metallic clip can be assembled to act as a restraint that presses down on some of the electronic components in the electronic device to keep them in place. A number of studs formed on the inner surface of the metallic housing such that some of the electronic components can be fixed onto the metallic housing via screws engaged with the studs.
  • Generally, because the clasping or latching structures of the metallic housing are complicated, the metallic housing with the clasping or latching structures is difficult to be manufactured by punching. Nowadays, the metallic clips and metallic studs are welded onto the inner surface of the metallic housing by laser. However, an outer surface of the metallic housing may deform or change color due to the high temperature of the laser welding. Accordingly, the electronic device having the metallic housing cannot have an attractive appearance.
  • What is needed, therefore, is an electron device having metallic connecting structures that overcomes the above mentioned disadvantages. Methods for making the electron device are also desired.
    • SUMMARY
  • In one aspect, an electronic device having metallic connecting structure according to a preferred embodiment includes a metallic housing, at least one bonding film and at least one metallic element. The metallic element is fixed to an inner surface of the metallic housing via the bonding film.
  • In another aspect, a method for making the electronic device described in a previous paragraph includes: providing a hot press machine having a press head; placing the one bonding film on the inner surface of the metallic housing; turning on the hot press machine and heating the press head to a first predetermined temperature of about 40° C. to about 50° C.; after heated to the first predetermined temperature, driving the press head to press the bonding film to the metallic housing for about two minutes, thereby attaching the bonding film on the metallic housing; placing the metallic element according to the corresponding bonding film of the metallic housing; heating the press head to a second predetermined temperature of about 160° C. to about 170° C.; after heated to the second predetermined temperature, driving the press head to press the metallic housing to the at least one metallic element for at least two minutes, thereby attaching the at least one metallic element on the corresponding bonding film.
  • Other advantages and novel features will become more apparent from the following detailed description of the preferred embodiments, when taken in conjunction with the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present electronic device having metallic connecting structures and method for making the electronic device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views, and all the views are schematic.
  • FIG. 1 is an exploded, isometric view of an electronic device having metallic connecting structure according to a first preferred embodiment of the present invention.
  • FIG. 2 is a side view of the electronic device having metallic connecting structure of FIG. 1.
  • FIG. 3 is a partial, cross-sectional view of an electronic device having metallic connecting structure according to a second preferred embodiment of the present invention.
  • FIG. 4 is an enlarged view of a circle portion IV of FIG. 3.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Reference will now be made to the drawings to describe preferred embodiments of the present electronic device having metallic connecting structure and methods for making the electronic device, in detail.
  • Referring to FIGS. 1 and 2, a metallic connecting structure 20 of an electronic device (for example, a MP3) in accordance with a first preferred embodiment of the present invention is shown. The metallic connecting structure 20 includes a metallic housing 21, a bonding film 23, and a metallic clip 25. The metallic clip 25 is fixed to an inner surface of the metallic housing 21 via the bonding film 23. The metallic connecting structure 20 may be part of a housing of the electronic device. In this embodiment, the metallic housing 21 is a curved sheet. The bonding film 23 is a thermoplastic adhesive bonding film. The metallic clip 25 includes a base 251 and a U-shaped elastic portion 252. The U-shaped elastic portion 252 has a pair of leg portions (not labeled) extending from the base 251 and bending up and outwards. A shape of the base 251 is similar to that of the bonding film 23 such that the base 251 can substantially adheres to the bonding film 23, thus, improving the bonding strength between the metallic clip 25 and the metallic housing 21.
  • A method for making the metallic connecting structure 20 of the electronic device includes the following steps. A hot press machine (not shown) having a press head is provided. The bonding film 23 is placed on the inner surface of the metallic housing 21. The hot press machine is turned on and the press head is heated to a first predetermined temperature of about 40° C. to about 50° C. After heated to the first predetermined temperature, the press head is driven to press the bonding film 23 for about two minutes, thereby attaching the bonding film 23 on the metallic housing 21. The metallic clip 25 is positioned tightly on the bonding film 23 of the metallic housing 21. The temperature of the press head is then raised to a second predetermined temperature of about 160° C. to about 170° C. After heated to the second predetermined temperature, the press head is driven to press the metallic housing 21 to the metallic clip 25 for at least two minutes, thereby attaching the metallic clip 25 on the bonding film 23 of the metallic housing 21.
  • Referring to FIGS. 3 and 4, a metallic connecting structure 30 of an electronic device in accordance with a second preferred embodiment of the present invention is shown. The metallic connecting structure 30 includes a metallic housing 31, a bonding film 33, and a metallic stud 35. In the second preferred embodiment, the bonding film 33 is a thermoplastic adhesive bonding film. The metallic housing 31 is substantially a flat sheet. A circular depression 32 is defined in an inner surface of the metallic housing 31. A size and a shape of the circular depression 32 are configured to correspond to a size and a shape of a base of the metallic stud 35. The bonding film 33 adheres to a bottom surface of the circular depression 32 and the metallic stud 35 adheres to the bonding film 33 in the circular depression 32 correspondingly. Accordingly, the metallic stud 35 is fixed to an inner surface of the metallic housing 31 via the bonding film 33. It should be pointed out that it is better for the depth of the circular depression 32 to be greater than the thickness of the bonding film 33.
  • A similar method for making the metallic connecting structure 30 of the electronic device includes the following steps. A hot press machine (not shown) having a press head is provided. The bonding film 33 is placed on the bottom surface of the circular depression 32. The hot press machine is turn on and the press head is heated to a first predetermined temperature of about 40° C. to about 50° C. After heated to the first predetermined temperature, the press head is driven to press the bonding film 33 to the metallic housing 31 for about two minutes, thereby attaching the bonding film 33 on the metallic housing 31. The metallic stud 35 is positioned according to the bonding film 33 of the metallic housing 31 tightly. The temperature of the press head is then increased to a second predetermined temperature of about 160° C. to about 170° C. After heated to a second predetermined temperature of about 160° C. to about 170° C., the press head is driven to press the metallic housing 31 to the metallic stud 35 for at least two minutes, thereby attaching the metallic stud 35 on the corresponding bonding film 33 of the metallic housing 31.
  • It is to be understood that, a circular depression 32 of the metallic housing 31 can have other shapes as long as the shape of the circular depression 32 confirms to the shape of the base of the stud 35. It should be pointed out that, the circular depression 32 can be omitted. That is, the metallic stud 35 can be directly fixed to the inner surface of the metallic housing 31 via the bonding film 33 anywhere on the metallic housing 31.
  • The methods for making the metallic connecting structures 20, 30 of the electronic devices are simple and can further decrease manufacture cost because of the use of the hot press machine instead of welding. In addition, when compared with the welding method, a working temperature of the methods for making the metallic connecting structures 20, 30 of the electronic device is lower, thus the electronic device made by the methods is less likely to deform and/or change color easily due to high heating.
  • In addition to the metallic clip 25 and the metallic stud 35, many other metallic elements can be fixed to the metallic housing via the bonding film by hot press method.
  • Finally, while the present invention has been described with reference to particular embodiments, the description is illustrative of the invention and is not to be construed as limiting the invention. Therefore, various modifications can be made to the embodiments by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.

Claims (3)

1. An electronic device having a metallic connecting structure, the electronic device comprising:
a metallic housing;
at least one bonding film; and
at least one metallic clip comprising a base and a U-shaped elastic portion, the U-shaped elastic portion having a pair of feet portions extending from the base and bending up and outwards, wherein the at least one metallic clip is fixed to an inner surface of the metallic housing via the bonding film.
2-6. (canceled)
7. The electronic device having metallic connecting structure according to claim 1, wherein the bonding film is a thermoplastic adhesive bonding film.
US11/843,668 2007-05-30 2007-08-23 Electron device having metallic connecting structure and method for making the same Abandoned US20080298039A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/156,817 US8250746B2 (en) 2007-05-30 2008-06-05 Method for making electronic device having metallic connecting structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200710200720.2A CN101316487A (en) 2007-05-30 2007-05-30 Electronic product with metal connecting structure and method for producing the same
CN200710200720.2 2007-05-30

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Publication number Priority date Publication date Assignee Title
CN111526678B (en) * 2020-04-28 2021-06-15 维沃移动通信(重庆)有限公司 Electronic equipment's casing and electronic equipment

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US5835006A (en) * 1996-05-22 1998-11-10 Moorola, Inc. Vibrator assembly
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US6377475B1 (en) * 2001-02-26 2002-04-23 Gore Enterprise Holdings, Inc. Removable electromagnetic interference shield
US6538197B1 (en) * 2001-11-05 2003-03-25 Kitigawa Industries Co., Ltd. Conductive member
US6544047B2 (en) * 2001-03-30 2003-04-08 Intel Corporation Dual-swiping interconnection clip, and hook and slot arrangement for printed circuit board (PCB) attachment
US7030333B2 (en) * 2004-01-22 2006-04-18 Bradley David A Method of joining plates with weld fastened studs
US7085139B2 (en) * 2003-11-25 2006-08-01 Research In Motion Limited Surface mountable clip suitable for use in a mobile communication device

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US6409859B1 (en) * 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
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Publication number Priority date Publication date Assignee Title
US4359813A (en) * 1976-12-10 1982-11-23 Usm Corporation Method of fastening
US5393164A (en) * 1991-08-02 1995-02-28 Emhart Inc. Arc welded joint between a carrier and a component rigidly connected to it
US5366186A (en) * 1993-08-19 1994-11-22 Ford Motor Company Module retention spring clip
US5579986A (en) * 1993-10-29 1996-12-03 Avdel Systems Limited Dual-function fastener and method of use
US5756185A (en) * 1994-01-28 1998-05-26 A. Raymond & Gmbh & Co. Kg Gluable fixing element for holding structural or functional components on carrier parts
US5835006A (en) * 1996-05-22 1998-11-10 Moorola, Inc. Vibrator assembly
US6051781A (en) * 1997-09-24 2000-04-18 Autosplice, Inc. Surface mount electromagnetic frequency interference shield clip
US6359215B1 (en) * 2000-06-06 2002-03-19 Chin Fu Horng Elastomer device for preventing electromagnetic interference of a computer central processing unit
US6377475B1 (en) * 2001-02-26 2002-04-23 Gore Enterprise Holdings, Inc. Removable electromagnetic interference shield
US6544047B2 (en) * 2001-03-30 2003-04-08 Intel Corporation Dual-swiping interconnection clip, and hook and slot arrangement for printed circuit board (PCB) attachment
US6538197B1 (en) * 2001-11-05 2003-03-25 Kitigawa Industries Co., Ltd. Conductive member
US7085139B2 (en) * 2003-11-25 2006-08-01 Research In Motion Limited Surface mountable clip suitable for use in a mobile communication device
US7030333B2 (en) * 2004-01-22 2006-04-18 Bradley David A Method of joining plates with weld fastened studs

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Publication number Publication date
US8250746B2 (en) 2012-08-28
US20080295316A1 (en) 2008-12-04
CN101316487A (en) 2008-12-03

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