DE60204849D1 - Verfahren und einrichtung zur lageerfassung der anschlusskontakte elektronischer bauelemente - Google Patents

Verfahren und einrichtung zur lageerfassung der anschlusskontakte elektronischer bauelemente

Info

Publication number
DE60204849D1
DE60204849D1 DE60204849T DE60204849T DE60204849D1 DE 60204849 D1 DE60204849 D1 DE 60204849D1 DE 60204849 T DE60204849 T DE 60204849T DE 60204849 T DE60204849 T DE 60204849T DE 60204849 D1 DE60204849 D1 DE 60204849D1
Authority
DE
Germany
Prior art keywords
locating
electronic components
connection contacts
image
light beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60204849T
Other languages
English (en)
Other versions
DE60204849T2 (de
Inventor
Carl Smets
Gils Karel Van
John Zabolitsky
Jurgen Everaerts
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Icos Vision Systems NV
Original Assignee
Icos Vision Systems NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Icos Vision Systems NV filed Critical Icos Vision Systems NV
Publication of DE60204849D1 publication Critical patent/DE60204849D1/de
Application granted granted Critical
Publication of DE60204849T2 publication Critical patent/DE60204849T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
DE60204849T 2000-12-29 2002-01-02 Verfahren und einrichtung zur lageerfassung der anschlusskontakte elektronischer bauelemente Expired - Lifetime DE60204849T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00204761 2000-12-29
EP00204761A EP1220596A1 (de) 2000-12-29 2000-12-29 Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente
PCT/BE2002/000001 WO2002054849A1 (en) 2000-12-29 2002-01-02 A method and an apparatus for measuring positions of contact elements of an electronic component

Publications (2)

Publication Number Publication Date
DE60204849D1 true DE60204849D1 (de) 2005-08-04
DE60204849T2 DE60204849T2 (de) 2006-05-11

Family

ID=8172534

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60204849T Expired - Lifetime DE60204849T2 (de) 2000-12-29 2002-01-02 Verfahren und einrichtung zur lageerfassung der anschlusskontakte elektronischer bauelemente

Country Status (9)

Country Link
US (1) US7423743B2 (de)
EP (2) EP1220596A1 (de)
JP (1) JP2004516491A (de)
KR (1) KR100849653B1 (de)
CN (1) CN1266994C (de)
AT (1) ATE298973T1 (de)
DE (1) DE60204849T2 (de)
HK (1) HK1062106A1 (de)
WO (1) WO2002054849A1 (de)

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JP5501696B2 (ja) * 2009-08-19 2014-05-28 オリンパス株式会社 実装装置および実装方法
CA2826092C (en) * 2011-01-27 2016-08-02 Lynxrail Corporation Camera assembly for the extraction of image depth discontinuity and method of use
US9230325B2 (en) * 2011-08-19 2016-01-05 University Of Rochester Three-dimensional model acquisition using planar mirrors
JP5989443B2 (ja) * 2012-07-31 2016-09-07 公立大学法人公立はこだて未来大学 半導体集積回路および物体距離計測装置
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US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
EP3015817B1 (de) * 2014-10-27 2019-12-18 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Optisches Verfahren und Vorrichtung zum Bestimmen von Positionen und Ausrichtungen einer Vielzahl von Spiegeln im Sichtfeld eines Objektivs
CN107889522B (zh) 2015-08-26 2020-08-28 Abb瑞士股份有限公司 对象多视角检测设备及其方法
CN115500582B (zh) * 2022-08-17 2024-03-22 上海科技大学 足部三维轮廓采集系统

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Also Published As

Publication number Publication date
US7423743B2 (en) 2008-09-09
EP1220596A1 (de) 2002-07-03
US20040085549A1 (en) 2004-05-06
JP2004516491A (ja) 2004-06-03
KR100849653B1 (ko) 2008-08-01
KR20040029316A (ko) 2004-04-06
ATE298973T1 (de) 2005-07-15
DE60204849T2 (de) 2006-05-11
EP1354505A1 (de) 2003-10-22
HK1062106A1 (en) 2004-10-15
EP1354505B1 (de) 2005-06-29
CN1266994C (zh) 2006-07-26
WO2002054849A8 (en) 2003-12-24
CN1502220A (zh) 2004-06-02
WO2002054849A1 (en) 2002-07-11

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