CN103842124A - 激光切削系统和激光切削方法 - Google Patents

激光切削系统和激光切削方法 Download PDF

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CN103842124A
CN103842124A CN201280045915.3A CN201280045915A CN103842124A CN 103842124 A CN103842124 A CN 103842124A CN 201280045915 A CN201280045915 A CN 201280045915A CN 103842124 A CN103842124 A CN 103842124A
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詹姆斯·卡尔普
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
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    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
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    • A—HUMAN NECESSITIES
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    • A61C7/00—Orthodontics, i.e. obtaining or maintaining the desired position of teeth, e.g. by straightening, evening, regulating, separating, or by correcting malocclusions
    • A61C7/08—Mouthpiece-type retainers or positioners, e.g. for both the lower and upper arch
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45041—Laser cutting

Abstract

在这里描述了激光切削系统（10）和方法。一个或者多个系统包括：激光生成构件（102）、光学构件（122）、用于在零件（106）位于支撑件上的情况下保持支撑件的固定装置（104），和控制机构（128），该控制机构（128）用于调节激光生成构件（102）、光学构件（122）和固定装置（104）中的至少一个，使得施加到零件的激光能量与零件材料厚度的比率在沿着切削路径的每一个点处维持在预定的可接受范围内，以在维持支撑件的完整性的同时切穿零件。

Description

激光切削系统和激光切削方法
技术领域
本公开涉及用于激光切削的系统和方法。
背景技术
已经在很多工业中设计并且利用了激光切削系统。例如，在汽车工业中，激光切削系统用于切削在使用模具、冲压机或者其它形成工具形成的保险杠上的边缘。
一旦形成，保险杆从模具、压机等移除，但是由于模具形成过程经常在边缘周围包括的一些多余的材料。激光切削系统能够用于将这多余的材料从保险杆移除。因此，激光将材料切除并且通过手工抛光或者其它这种方式将部件的边缘抛光，以消除任何尖锐的部分并且大体上将边缘平滑处理。
在某些其它实现中，在模具上形成一种物件（item）并且使用激光将该物件从模具切除。或者，通过冲压或者另一个成型过程在模具上形成一种物件并且该物件利用某种支撑件定位。如果该物件已经得以模制，则模具可以被用作支撑件。然而，切削到支撑材料中对于所述过程是不利的。例如，当利用激光切削时，支撑材料可以与用于形成该物件的材料混合。这能够引起非期望的材料物理特性或者变色，这可能是不理想的。
切削过程自身也能够改变靠近切削路径的材料的特性。不象其它切削技术，激光切削产生足够的热以切削材料并且，同样材料与热的相互作用能够改变它的特性，例如使其更加脆性，这在某些应用中是不期望的。特别地在将以相对高的速度进行切削并且因此使用高能量激光束快速地切穿材料时会产生上述情况。
另外地，在某些实现中被切削的材料的厚度能够改变，并且同样地，切削技术的效力能够减小。例如，如果为了最有效的切削被切削的材料的一部分比用于校准激光的部分更厚，则激光可能并不完全贯穿材料地切削或者材料可能并不那么有效地汽化。
如果材料更薄，则被切削材料的边缘的特性可能以非预期的方式改变。激光还可能贯穿正被切削的物件切削，并且切削到支撑材料中，如上所述，这可能在某些应用中是不期望的。
附图简要说明
图1示意能够在根据本公开的一个或者多个实施例中使用的系统。
图2示意根据本公开的一个或者多个实施例在模具之上应用的一片零件材料。
图3示意根据本公开的一个或者多个实施例的通过使所述一片零件材料形成在模具表面的至少一个部分上而产生的零件。
图4示意根据本公开的一个或者多个实施例的在一部分上的切削路径。
图5示意根据本公开的一个或者多个实施例的从模具正被移除的被切削的部分。
图6示意根据本公开的一个或者多个实施例的能够使用的五轴线移动类型的一个实例。
图7示意根据本公开的一个或者多个实施例的方法。
具体实施方式
在这里描述激光切削系统和方法。例如，一个或者多个系统包括激光生成构件、光学构件、用于在零件定位在支撑件上的情况下保持支撑件的固定装置，和控制机构，该控制机构用于调节激光生成构件、光学构件和固定装置中的至少一个，从而在沿着切削路径的每一个点处施加于零件的激光能量与零件材料厚度的比率维持在预定的可接受范围内，以在维持支撑件的完整性的同时切穿零件。在这里公开了其它的系统和方法。
本公开的实施例能够切穿用于形成零件的材料，而不切削到邻近于零件材料的支撑材料中。在某些实施例中，激光束能够切穿零件材料，但是并不实质性地切入到支撑材料。在这种情形中，可以提供一种被切削而且并不实质性地与支撑件的材料混合的零件和/或如果需要可以允许再次使用支撑件。
在这里提供了实施例允许零件被快速地切削，而大致不改变零件的靠近由激光束形成的切削路径的边缘的诸如零件的脆性或者变色特的性。除了其他的益处之外，实施例还能够切穿邻近于支撑件的、具有不同厚度的材料。这能够通过如在下面更加详细描述地改变激光束的一个或者多个特性而得以实现。
在以下详细说明中，对于形成其一部分的附图进行参考。附图通过示意图示出可以如何实践本公开的一个或者多个实施例。
图1示意能够根据本公开的一个或者多个实施例使用的系统。在于图1中所示的实施例中，提供了用于激光切削在模具106之上形成的来自一片零件材料的零件的系统100。
图1的系统100包括激光生成构件102、一个或者多个光学构件122、固定装置104，和定位在固定装置104上的模具106。在图1的实施例中，固定装置还包括：平台108，该平台108用于将模具106定位在其上；和旋转机构126，该旋转机构126允许零件在当从平台上方观察时的顺时针和/或逆时针方向上旋转。
在图1的实施例中，系统100还包括控制构件110。控制构件110包括处理器112、存储器114，和一个或者多个控制机构124、126和/或128。指令116能够存储在存储器114中并且由处理器112执行以控制例如保持零件的固定装置104的移动、激光生成构件102的移动、一个或者多个光学构件122的移动、由激光生成构件102产生的激光束的一个或者多个特性的调节、经由喷嘴120施加的气体的特性和/或经由管子30施加的抽吸的其它特性的调节。
这些物件能够例如经由控制构件124、126和/或128来控制，和/或经由被设置成调节一个或者多个光学构件122、调节激光生成构件102的特性、调节经由喷嘴120提供的气体的特性，和/或调节经由抽吸管子130提供的抽吸压力的机构来控制。存储器114还能够具有存储在其中的、能够如将在下面更加详细讨论地在执行指令时使用的数据118。
存储器能够是提供易失或者非易失存储器的非暂时的机器可读介质。存储器还能够是可移除的例如便携式存储器，或者不可移除的例如内部存储器。例如，存储器能够是随机访问存储器（RAM）或者只读存储器（ROM）。
在其它类型的存储器中，存储器能够例如是动态随机访问存储器（DRAM）、电可擦除可编程只读存储器（EEPROM）、闪存、相变随机访问存储器（PCRAM）、只读光盘存储器（CD-ROM）、激光盘、数字化通用磁盘（DVD）或者其它光盘存储器，和/或诸如磁带盒、磁带或者磁盘的磁性介质。
此外，虽然存储器示意为位于控制机构110中，但是本公开的实施例不受如此限制。例如，存储器还能够位于不是控制机构，而是连接到控制机构的存储器装置中。在某些实施例中，存储器能够在计算资源的内部或者外部，并且能够使机器可读指令经由诸如互联网或者其他有线或者无线连接的网络被上载和/或下载。
关于激光生成构件的控制，能够以各种方式控制激光束的能量。例如，能够调节对于激光生成构件的功率以增加所形成的光束的能量。
例如，能够通过调制激光束的功率、调节光学构件（例如，一个或者多个镜子和/或透镜）和/或基于零件特性和所期切削路径控制固定装置的速度和/或激光生成构件相对于固定装置的速度，在预定范围内控制将被施加于零件的能量。能够根据系统的特性和/或所被切削的材料的特性来改变这些因素的组合。例如，如果系统并不具有关于其能量能够被调节的激光生成构件，则能够调节固定装置和/或激光生成构件和/或一个或者多个光学构件的移动速度。
如以上讨论地，能够进行的调节是与所使用的光学构件相关的。通过改变构件（例如，切换透镜）或者调节该构件（例如，改变焦距和/或移动光学构件），由激光生成构件产生的能量能够随着其穿过或者由一个或者多个光学构件引导而改变。
这些移动能够由在图1中所示的一个或者多个控制机构和/或利用存储在存储器中的可执行指令来控制。例如，可以使用五英寸焦距，但是该焦距可以被调节为更短或者更长的长度。对于诸如切削牙科器械的应用，这个焦距能够是有益的，因为它允许良好的可变量并且能够在焦点处维持足够高的激光能量以充分地汽化零件材料。
控制构件110能够包括调节固定装置的速度的固定装置控制部（例如，软件和电气和/或机械致动器），并且其中在沿着激光束将切削零件的切削路径的多个点处，控制构件接收关于零件材料厚度的数据，并且基于厚度数据调节经过激光束的零件的移动速度，从而使施加到零件的激光能量与零件材料厚度的比率维持在预定的可接受范围内。
在这种实施例中，该比率能够被预先设定或者基于在切削过程期间获取的厚度数据和/或激光功率数据动态地确定。该比率的可接受范围是基于激光能量，该激光能够需要切穿零件材料，而不切削到支撑材料中，或者在某些情形中，不会在损坏支撑件或者促进支撑材料与零件材料混合的这种程度上切削到支撑材料中。
如在这里所使用地，支撑材料能够包括在其上模制物件、在其内模制物件、在其之下模制物件，或者在模制之后在其上定位物件的材料，该材料诸如用于保持切削的零件的支持材料。能够例如基于一个或者多个零件材料特性和支持材料的一个或者多个特性中的至少一个确定该比率。在某些这样实施例中，零件、支撑件和/或支持材料特性例如可以包括材料组成和/或材料厚度中的至少一个。
在某些实施例中，零件材料可以包括多个部分（例如，层材料）。例如，该多个部分可以被结合到一起或者粘附到一起。例如，零件可以在支撑件（例如，模具）和校准器材料之间包括中间层（例如，光粘结剂或者硅）以允许材料（例如，热形成的材料）成形并且固化或者在固化之后移除。在某些实施例中，中间层能够用作缓冲厚度和/或对于激光提供不同的反应，以确保仅零件材料而非支撑件受到切削。
以下提供在实践中可以如何应用比率的一个实例。关于具有9.3微米波长、设定为在15，000到25，000的范围中的重复速率并且具有在1-4mm的范围中的输出光束尺寸的激光，该激光具有在8到15瓦特之间的期望输出范围，这是因为未聚焦的输出功率的该范围允许切削零件材料，而不通过向零件下面的支撑材料施加过多的激光能量而使得材料变色。例如，当使用快速成型材料（例如，SLA材料）作为模具材料时，模具材料和激光束的相互作用能够引起模具材料与零件材料混合。在某些情形中，这可以导致变色。
控制构件110能够包括激光功率调节控制部，在沿着激光束将切削零件的切削路径的多个点处，该激光功率调节控制部接收关于零件材料厚度的数据，并且基于厚度数据调节激光生成构件的功率，从而使施加到零件的激光能量与零件材料厚度的比率如上所讨论地维持在预定的可接受范围内。
控制构件110能够包括光学控制器，该光学控制部调节该多个光学构件中的一个或者多个的位置，其中在沿着激光束将切削零件的切削路径的多个点处，该控制构件接收关于零件材料厚度的数据，并且基于厚度数据调节该多个光学构件中的一个或者多个的位置，从而使施加到零件的激光能量与零件材料厚度的比率如上所讨论地维持在预定的可接受范围内。
能够利用单一的控制构件来控制所有的以上功能，或者这些功能能够由多个构件（例如，处理器）控制。在某些实施例中，在零件能够沿着至少三个移动轴线移动并且基于有关零件材料、支撑件和衬底材料中的至少一个的一个或者多个特性的信息激光束的功率控制在给定范围内的同时，在切削位置处的零件相对于在切削位置处的激光束的速度能够维持基本恒定。
这些特性能够经由存储器提供给控制构件的处理器，和/或能够由使用者经由与控制构件通信的用户接口提供。在各种实施例中，控制构件能够调节固定装置的速度从而在维持支撑件的完整性的同时使激光能量在沿着零件上的切削路径的每一个点处汽化全部的零件材料。
在某些实施例中，用于调节激光能量的控制构件提供用于调节激光生成构件功率、激光生成构件移动、光学构件类型、光学构件移动、固定装置移动、气体类型、气体压力、气体温度和抽吸中的至少一个的机构，从而使施加到零件的激光能量与零件材料厚度的比率维持在预定的可接受范围内。
在某些这种实施例中，在零件以恒定或者基本恒定的进给速率移动时，维持施加到零件厚度的激光能量。除了其他益处之外，这能够有益于在激光束沿着切削路径前进时，使进行切削的激光能量基本以均匀的方式分布。基本恒定进给速率的一个实例能够例如是1000-1500mm/sec。另一个实例包括使用能够以5-10W运行并且具有在1500和2000mm/sec之间的恒定进给速率的10.6微米波长激光。在某些应用中，这种配置可以允许减小在切削路径的边缘处的脆性。
在某些实施例中，通过增加激光生成构件功率来维持施加到零件厚度的激光能量。除了其它益处之外，这能够有益于固定装置和/或激光束的移动速度不能调节的情况。
在某些实施例中，能够通过调节光学构件以形成施加到零件的更强或者更弱的激光能量而维持施加到零件厚度的激光能量。这能够是有益的，例如，因为除了其它益处之外，与诸如激光器和/或固定装置的移动的其它布置相比，光学构件的移动能够是用于调节激光能量的、更加成本有效的方案。
此外，在某些实施例中，如果与它的输出电势相比较，激光的总体功率是低的，则能够利用光束分路器提升由激光生成构件产生的功率的输出百分比。在某些情形中，这能够允许激光生成构件能够操作在与它的占空比相关的更加稳定的范围中。在某些应用中，通过在其中间功率范围中（例如，40-60%，而由于光束的分路，传递到切削位置的功率可以低至10%）操作激光，这可以增加系统的耐久性。在某些情形中，这个布置的另一个益处能够是减小激光脉冲（即，激光能量的波动），因为激光不在低功率下操作。
另外地，关于切削位置使用较低的能量能够减小引起脆性的几个现象的存在。例如，重整被加热的零件材料（即，由于熔化和冷却平滑并且有光泽的、接近切削边缘的区域）、堆起或者镶边（即，形成升高的、平滑并且有光泽的楔边的、接近切削边缘的区域），以及重铸（即，粗糙的并且当熔融材料的残余被来自如果使用的气体喷嘴的气体吹离它的静止点时具有熔融材料的残余的边缘）。
用于调节系统的各种构件的控制机构能够是任何适当的机构。例如，它们能够是关于系统100的另一个构件移动一个构件的电和/或机械致动器。例如，在图1的实施例中，控制机构128能够用于移动激光生成构件102、光学构件122，和气体喷嘴120而更加靠近或者更加远离平台108，并且由此更加靠近或者更加远离模具106。
这种移动能够改变所产生的激光束的特性、光学装置如何与所产生的光束互相作用，以及所施加的气体。在某些实施例中，喷嘴120、光学构件122，和激光生成构件每个都能够相对于彼此独立地移动。
控制机构124能够例如是在多个方向上移动固定装置的机械致动器。例如，在图1的实施例中，机构24能够关于激光生成构件102水平地移动零件并且还能够当从平台104的一侧（例如，从图1的抽吸管子130的角度）观察时顺时针和/或逆时针旋转固定装置104。在图1的实施例中，如将在下面更加详细讨论地，机构24的移动和机构126的移动的组合允许固定装置关于激光生成构件102沿着五个移动轴线移动。
在一个或者多个实施例中，用于操纵零件的固定装置能够例如包括自动抽吸和/或夹压机构以在激光切削过程期间紧固和/或移动支撑件和/或零件。
如在图1中所示，在某些实施例中，该系统能够包括配送气体或者抽吸气体的一个或者多个气体喷嘴（例如，喷嘴120）。在各种实施例中，该一个或者多个喷嘴能够指向激光能量接触零件的点。气体能够是任何适当类型的气体，包括致冷的、加热的和/或室温气体（例如，一种类型用于一个喷嘴并且另一种类型用于另一个喷嘴）。除了其他的以外，实例能够包括空气、氧气和/或氮气。
由于多个原因，这能够是有益的。例如，除了其它益处之外，气体能够用于加热或者冷却零件、耗散从激光产生的热、在切削区域处改变气体（例如，空气）的化学组成，和/或如果碎屑未在切削过程中汽化，则从切削路径抽吸或者吹走碎屑。
在各种实施例中，能够根据气体和激光束定向的方向减小受到热影响的区域。例如，当激光束与所引导的气体共线地行进时可能减小热影响的区域，并且当与从喷嘴的顶端离开的气体的路径交叉地行进时可能增加热影响的区域。
在某些实施例中，喷嘴在远离激光生成构件的位置处并且与朝向零件引导激光能量的激光束方向成角度地定位。这种实施例在图1中示出，其中喷嘴120相对于由激光生成构件102产生的激光束以一定角度定向。在某些实施例中，这能够是有益的，例如，因为气体能够用于从切削路径区域吹走碎屑。
其它益处包括：通过在适度速率下吹送气体，使切削表面得以改进，以及减少了切削过程引起的云雾。除了其它益处之外，这能够例如移动通过切削过程产生的沉重的颗粒达远离切削边缘。
基于其中使用喷嘴的应用，喷嘴能够具有各种形状和尺寸。例如，能够调节喷嘴的内径、喷嘴顶角、喷嘴相对于切削位置的总体角度，和喷嘴顶端形状。
喷嘴还能够在关于切削位置不同的位置中定向。例如，为了移除碎屑，使用带有1.7mm内径的管子，喷嘴可以以32度的角度定向。在某些实施例中，管子能够由黄铜制成，其顶端被挤压成从开口大致1mm高度的扇形。这些特征是作为实例提供的并且不应该限制在这里的权利要求，因为能够在各种实施例中使用其它材料、形状和定向。
在某些实施例中，该系统包括邻近于激光能量接触零件的位置定位的抽吸机构，以移除当激光能量接触零件时形成的碎屑。例如，一种这样的实施例在图1中示出。除了其它益处之外，在某些实施例中，这能够是有益的，例如，因为抽吸机构（例如，抽吸管子130）能够用于从切削路径区域抽走碎屑。这能够与一个或者多个喷嘴相组合地使用，在某些情形中，例如，通过朝向抽吸机构吹送碎屑，这能够更好地从该区域移除碎屑。
另一个系统实施例包括：用于产生激光束的激光生成构件；固定装置，该固定装置用于保持带有将被激光束切削的零件的支撑件，其中零件位于支撑件上；光学构件，该光学构件用于聚焦激光束以在切削路径处形成预定范围的能量，以在并不实质性地切削支撑件（维持支撑件的完整性）的同时切穿零件；以及控制器，该控制器用于调节施加到零件厚度的激光能量，其中在沿着切削路径的多个点处，该控制器接收关于零件材料厚度的数据，并且调节施加到零件的激光能量和零件材料厚度的比率，以在预定的可接受范围内维持该比率。
图2示出根据本公开的一个或者多个实施例的在模具之上施加的一片零件材料。关于本公开的范围，模具能够具有任何适当的形状。例如，在图2中所示的实施例中，模具206具有将要利用牙科校准器械治疗的患者的下颌的一副牙齿的形状。
所述零件通过使用材料片208形成在模具206之上。在此情形中，该材料是聚亚安酯材料，但是为了在模具上将零件成形，能够利用其它适当的零件材料。
图3示出根据本公开的一个或者多个实施例通过在模具表面的至少一个部分之上形成所述一片零件材料而生产的零件。例如，图3示出由所述材料片208生成的零件形成在模具206之上。这种方法能够由诸如、例如在前地结合图1描述的系统100执行的一种系统。
在图3的实施例中，所述材料片308已经形成在模具之上以生成零件332（例如，牙科器械）。图3还示出激光束已经从所述材料片308切削零件的切削路径334和器械的特性（例如，正方形窗口）已经切削到零件332中的切削路径336。
在牙科器械领域，可以通过使用旋转切削刀具切削零件，并且这样仅可以实现沿着零件的边缘的切削并且所实现的切削具有粗糙的边缘，该粗糙的边缘在能够将其发送给患者之前需要通过手工或者利用抛光工艺抛光。除了其它益处之外，本公开的实施例允许在零件上的其它位置中进行切削（例如，产生诸如窗口336的特性）并且减少或者消除对于后切削抛光的需要。
图4是根据本公开的一个或者多个实施例示意在零件上的切削路径的、在切削路径处截取的剖面顶视图。在于图4中所示的实施例中，用于生成零件的所述材料片432位于模具406之上，由此形成将成为牙科器械的顶部和侧部。在这个视图中，示出了与模具的侧表面相邻地形成的侧部。如在图2中进一步所示，模具206和406具有患者的牙齿的形状，并且在修剪多余材料之后的所得零件是一种牙科校准器械532（见图5）。在图4的实施例中，示出切削路径434，其中激光束已经沿着切削路径部分地切削所述材料片432。斜线标记区域代表在切削路径下面的所述材料片。在该实施例中，切削路径434已经切穿所述材料片432，但是没有切削到模具406的表面438中。
在某些应用中，诸如当材料片形成在模具上时，由于它符合于模具形状，所以它可以改变所述片的某些部分的厚度。在这种情形中，为了提供适当量的激光束能量以切穿所述材料片，但是并不切削模具材料或者以实质性的方式切削到模具材料中（例如，激光能量能够用于切穿零件材料并且切削到模具材料的外表面中，但是并不切穿模具，由此维持模具的完整性），能够测量或者估计沿着切削路径的材料的厚度（例如，通过形成过程的虚拟建模）。
例如，在某些实施例中，能够使用扫描装置动态地（即，刚好在切削之前和/或在切削正在进行时）在它被切削之前提供零件（例如，所述材料片）的厚度。在各种实施例中，传感器能够用于沿着切削路径434测量和/或感测零件的厚度。沿着切削路径测量零件的厚度的传感器能够例如被定位在一位置处，该位置紧位于在该位置处切削零件激光束之前。还能够利用传感器动态地在它被切削之前提供零件的厚度。
如果估计厚度，则它能够基于例如虚拟建模和/或存储在存储器中的试验数据的。在某些实施例中，能够对于沿着切削路径的每一个点确定，对于沿着切削路径的某个长度（例如，1mm的线段）估计或者对于切削路径的全部长度估计沿着切削路径的厚度。在某些实施例中，已经在切削操作开始之前虚拟地或者通过使用接触或者非接触厚度测量工具测量零件的实际厚度而预先确定了零件沿着切削路径的厚度。因此，在这里讨论的各种实施例（可能希望添加某些实例）的范围内能够利用任何适当的测量工具。
图5示意根据本公开一个或者多个实施例的正被从模具移除的被切削零件。在于图5中所示的实施例中，已经沿着切削路径534切削零件532，特性536已经被切削到零件532中，并且已经从模具506移除该零件。模具没有被激光束切削，并且因此如果需要它能够被再次使用。
图6示意根据本公开一个或者多个实施例的能够使用的五个轴线移动类型的一个实例。在该示意图中，示意了在图1的实施例中提供的移动的五个轴线。
例如，控制机构128提供沿着方向644的移动，控制机构124提供沿着方向640和646的移动，并且控制机构126提供沿着方向648的移动。在某些实施例中，控制机构能够实现以提供沿着方向642的移动。这个移动可以例如由控制机构122、124和/或128提供，或者能够由未示出的另一个机构提供。
图7示意根据本公开一个或者多个实施例的方法。能够利用诸如、例如在前地结合图1描述的系统100的一种系统执行这种方法。
在图7的实施例中，该方法包括：在方框750，形成专用模具和位于该模具上的专用零件的虚拟版本。在某些实施例中，形成用于形成将位于模具上的专用零件的专用模具包括形成虚拟项目开发计划或者治疗计划，其中模具是在虚拟开发或者治疗计划期间的模具的形状因素的表示。在某些实施例中，该方法包括基于虚拟治疗计划或者开发计划形成虚拟模具，并且其中对于沿着虚拟切削路径的多个点的多个零件材料厚度估计值是基于虚拟模具的分析确定的。
某些方法实施例能够包括形成多个专用模具，每一个专用模具代表在虚拟项目开发计划或者治疗计划的各个部分内的唯一的零件。例如，某些方法包括形成多个专用模具，其中每一个专用模具代表沿着用于逐渐地移动牙齿的治疗计划的牙齿唯一的布置。在具有多个专用模具的某些实施例中，该方法包括基于虚拟治疗计划形成多个虚拟模具，并且其中基于每一个虚拟模具的分析各自地为每一个虚拟模具确定关于沿着虚拟切削路径的多个点的多个零件材料厚度估计值。
该方法还包括：在方框752，定义虚拟切削路径，激光生成构件将在该虚拟切削路径引导能量以切削专用零件。在某些实施例中，该方法包括定义多个切削路径，其中该多个切削路径中的一个代表沿着患者的龈线的路径的一部分。方法实施例还能够包括定义多个切削路径，其中该多个切削路径中的一个代表不沿着患者龈线的零件上的切削。
在方框754，该方法包括为沿着虚拟切削路径的多个点确定多个零件材料厚度估计值。该方法还包括：在方框756，定义用于调节激光生成构件、光学构件和保持专用模具的固定装置中的至少一个的一组调节指令，使得施加到零件的激光能量与零件材料厚度的比率在沿着实际切削路径的每一个点处维持在预定的可接受范围内，以在维持支撑件的完整性的同时切穿零件。
在具有多个专用模具的各种实施例中，定义该组调节指令能够包括为每一个虚拟模具定义一组移动和速度调节指令。在某些实施例中，定义该组调节指令包括定义用于在零件位于模具上的情况下移动固定装置的一组移动和速度调节指令，其中这些指令基于确定的零件材料厚度估计值调节零件经过激光束的移动速度，从而使施加到零件的激光能量与零件材料厚度的比率维持在预定的可接受范围内。在某些这种实施例中，定义该组移动和速度调节指令能够包括定义固定装置在五个轴线中与激光生成构件的取向相关的移动和速度。
足够详细地描述了这些实施例以使得本领域普通技术人员能够实施本公开的一个或者多个实施例。应该理解，可以利用其它实施例并且可以在不偏离本公开的范围的情况下实现过程、电气和/或结构改变。
如将会认识到地，在这里在各种实施例中示出的元件能够被添加、交换、组合和/或移除，从而提供本公开的多个另外的实施例。在图中设置的元件的比例和相对尺度旨在示意本公开的实施例，而不应该以限制性的意义理解。
如在这里所使用地，“一个”或者“多个”某种事物能够参考一个或者多个的这种事物。例如，“多个支撑件”能够参考一个或者多个支撑件。
虽然已经在这里示意并且描述了具体实施例，但是本领域普通技术人员将会理解，设计用于实现相同的技术的任何布置均能够替代所示出的具体实施例。本公开旨在涵盖本公开的各种实施例的任何和所有的调整或者变化。
应该理解，已经以示意性的方式而非限制性的方式给出以上说明。在阅读以上说明时，对于本领域技术人员而言，将显而易见的是以上实施例和未在这里具体描述的其它实施例的组合。
本公开的各种实施例的范围包括其中使用以上结构和方法的任何其它应用。因此，应该连同这种权利要求能够具有的等价形式的全部范围一起地参考所附权利要求确定本公开的各种实施例的范围。
在前面的详细说明中，为了使得本公开是流畅的，在图中所示的示例性实施例中各种特征被一起地分组。这种公开方法不应该被解释成反映与在每一个权利要求中叙述的相比本公开的实施例要求更多的特征的意图。
实际上，如以下权利要求反映地，创造性主题并非包括所公开的单一实施例的全部的特征。因此，以下权利要求由此结合到详细说明中，其中每一项权利要求自身代表一个独立的实施例。

Claims (37)

1.一种激光切削系统，包括：
激光生成构件；
光学构件；
固定装置，该固定装置用于保持支撑件，一零件定位在该支撑件上；以及
控制机构，该控制机构用于调节所述激光生成构件、所述光学构件和所述固定装置中的至少一个，使得在沿着切削路径上的每一点处，施加到所述零件的激光能量的比率被维持在预定的可接受范围内，以在维持所述支撑件的完整性的同时切穿所述零件厚度。
2.根据权利要求1所述的系统，其中，
所述控制机构包括：固定装置控制部，该固定装置控制部调节所述固定装置的速度，并且
其中，所述控制构件接收沿着所述激光束切削所述零件的切削路径上的多个点处的关于所述零件材料厚度的数据，并且所述控制构件基于所述厚度数据调节经过所述激光束的所述零件的移动速度，使得施加到所述零件的激光能量与所述零件材料厚度的比率被维持在所述预定的可接受范围内。
3.根据权利要求1和2中任何一项所述的系统，其中，
所述控制机构包括激光功率调节控制部，该激光功率调节控制部接收沿着所述激光束切削所述零件的所述切削路径上的多个点处的关于所述零件材料厚度的数据，并且该激光功率调节控制部基于所述厚度数据调节所述激光束的功率，使得施加到所述零件的所述激光能量与所述零件材料厚度的所述比率被维持在所述预定的可接受范围内。
4.根据权利要求1至3中任何一项所述的系统，其中，所述控制机构包括光学控制部，该光学控制部调节所述多个光学构件中的一个或者多个的位置，并且其中，所述控制构件接收沿着所述激光束切削所述零件的切削路径上的多个点处的关于所述零件材料厚度的数据，并且该光学控制部基于所述厚度数据调节所述多个光学构件中的一个或者多个的位置，使得施加到所述零件的所述激光能量与所述零件材料厚度的所述比率被维持在所述预定的可接受范围内。
5.根据权利要求1至4中任何一项所述的系统，其中，所述系统包括气体喷嘴，该气体喷嘴指向所述激光能量接触所述零件的点。
6.根据权利要求5所述的系统，其中，所述气体喷嘴是气体配送喷嘴。
7.根据权利要求1至5中任何一项所述的系统，其中，所述系统包括抽吸机构，该抽吸机构定位成靠近所述激光能量接触所述零件的位置，以移除当所述激光能量接触所述零件时产生的碎屑。
8.根据权利要求1所述的系统，其中，所述固定装置能够沿着至少三条移动轴线相对于所述激光束的所述切削位置移动。
9.根据权利要求1所述的系统，其中，在所述零件能够沿着至少三条移动轴线移动并且基于有关所述零件材料或者模具或者支持材料中的至少一个的一个或者多个特性的信息使所述激光束的所述功率控制在给定范围内的同时，在所述切削位置处的所述零件相对于在所述切削位置处的所述激光束的所述速度维持基本恒定。
10.一种激光切削方法，包括：
形成专用支撑件和定位在所述支撑件上的专用零件的虚拟版本；
定义虚拟切削路径，激光生成构件将在该虚拟切削路径引导能量以切削所述专用零件；
为沿着所述虚拟切削路径的多个点确定多个零件材料厚度估计值；以及
定义一组调节指令，该调节指令用于调节所述激光生成构件、光学构件和保持所述专用模具的固定装置中的至少一个，使得在沿着实际切削路径的每一个点处，施加到所述零件的激光能量与所述零件材料厚度的比率维持在预定的可接受范围内，以在维持所述支撑件的完整性的同时切穿所述零件。
11.根据权利要求10所述的方法，其中，定义所述一组调节指令的步骤包括：定义一组用于在所述零件位于所述模具上的情况下移动所述固定装置的移动和速度调节指令，其中所述指令基于确定的所述零件材料厚度估计值调节经过所述激光束的所述零件的移动速度，使得施加到所述零件的激光能量与所述零件材料厚度的所述比率被维持在所述预定的可接受范围内。
12.根据权利要求11所述的方法，其中，定义所述一组移动和速度调节指令的步骤包括：定义所述固定装置在与所述激光生成构件的取向相关的五个轴线中的移动和速度。
13.根据权利要求10所述的方法，其中，所述支撑件是用于形成所述零件的模具。
14.根据权利要求10所述的方法，其中，形成所述专用模具的步骤包括：形成虚拟项目开发计划或者治疗计划，其中所述模具是在所述虚拟开发或者治疗计划期间所述模具的形状因素的表示，所述专用模具用于形成位于所述模具上的所述专用零件。
15.根据权利要求14所述的方法，其中，所述方法包括：形成多个专用模具的步骤，每一个该专用模具代表在所述虚拟项目开发计划或者治疗计划的对应部分内的唯一的零件。
16.根据权利要求14所述的方法，其中，所述方法包括：基于所述虚拟治疗计划或者开发计划形成虚拟模具，并且其中基于所述虚拟模具的分析确定沿着所述虚拟切削路径的多个点的所述多个零件材料厚度估计值。
17.根据权利要求14所述的方法，其中，所述方法包括：基于所述虚拟治疗计划形成多个虚拟模具，并且其中基于每一个虚拟模具的分析，分别为每一个虚拟模具确定沿着所述虚拟切削路径的多个点的所述多个零件材料厚度估计值。
18.根据权利要求14所述的方法，其中，定义所述一组调节指令的步骤包括为每一个虚拟模具定义一组移动和速度调节指令。
19.根据权利要求14所述的方法，其中，所述方法包括：形成多个专用模具，并且其中每一个专用模具代表沿着用于逐渐地移动牙齿的治疗计划的牙齿的唯一的布置。
20.根据权利要求19所述的方法，其中，所述方法包括：定义多个切削路径，其中所述多个切削路径中的一个代表所述零件沿着患者的龈线的一部分。
21.根据权利要求19所述的方法，其中，所述方法包括定义多个切削路径，其中所述多个切削路径中的一个代表不沿着患者龈线的所述零件上的切削。
22.一种激光切削系统，包括：
用于产生激光束的激光生成构件；
固定装置，该固定装置用于保持将被所述激光束切削的零件；
光学构件，该光学构件用于聚焦所述激光束以在切削路径处形成预定范围的能量，以在获得所期边缘条件或者边缘特性中的至少一个的同时切穿所述零件；以及
控制器，该控制器用于调节施加到零件材料厚度的激光能量，其中所述控制器接收沿着所述切削路径的多个点处关于所述零件材料厚度的数据，并且所述控制器调节施加到所述零件的所述激光能量和所述零件材料厚度的比率，以将所述比率维持在预定的可接受范围内。
23.根据权利要求22所述的系统，其中，所述激光能量切穿所述零件并且切削到用于所述零件的支撑件的外表面中，但是并不切穿所述支撑件。
24.根据权利要求22所述的系统，其中，所述控制机构调节所述固定装置的速度，使得在获得所期边缘条件或者边缘特性中的至少一个的同时，所述激光能量在沿着所述零件上的切削路径的每一个点处将所述零件的全部的材料汽化。
25.根据权利要求22所述的系统，其中，用于调节所述激光能量的所述控制器设置有一机构，该机构用于调节激光生成构件功率、激光生成构件移动、光学构件类型、光学构件移动、固定装置移动、气体类型、气体压力、气体温度和抽吸中的至少一个，使得施加到所述零件的激光能量与零件材料厚度的比率被维持在预定的可接受范围内。
26.根据权利要求22所述的系统，其中，在所述零件以恒定的进给速率移动时，维持施加到所述零件厚度的所述激光能量。
27.根据权利要求22所述的系统，其中，通过增加所述激光生成构件功率，维持施加到所述零件厚度的激光能量。
28.根据权利要求22所述的系统，其中，通过调节所述光学构件以形成施加到所述零件的更强或者更弱的激光能量，而维持施加到所述零件厚度的所述激光能量。
29.根据权利要求22所述的系统，其中，基于一个或者多个零件材料特性和用于所述零件的支撑件的一个或者多个特性中的至少一个来确定所述比率。
30.根据权利要求29所述的系统，其中所述零件、支撑件和支持材料特性由所述材料成分和所述零件材料厚度中的至少一个组成。
31.根据权利要求22所述的系统，其中，通过基于所述零件特性和所期望的切削路径控制所述固定装置和/或所述激光生成构件相对于所述固定装置的速度和/或调制所述激光束的所述功率，使施加到所述零件的所述能量控制在预定范围内。
32.根据权利要求22所述的系统，还包括扫描装置，该扫描装置用于在所述零件被切削之前动态地提供所述零件材料厚度。
33.根据权利要求22所述的系统，还包括传感器，该传感器用于沿着所述切削路径测量或者感测所述零件材料厚度。
34.根据权利要求33所述的系统，还包括存储装置，该存储装置用于存储沿着所述切削路径的关于所述零件材料厚度的信息。
35.根据权利要求33所述的系统，其中，沿着所述切削路径的所述零件材料厚度在切削操作开始之前预先确定。
36.根据权利要求21所述的系统，其中，沿着所述切削路径测量所述零件材料厚度的所述传感器被定位在一位置处，该位置紧位于在该位置处切削所述零件的所述激光束之前。
37.根据权利要求1、21或者22所述的系统，其中，所述支撑件是用于形成所述零件的模具。
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