CN100504363C - Inspection apparatus of wiring pattern, inspection method, detection apparatus, detection method - Google Patents
Inspection apparatus of wiring pattern, inspection method, detection apparatus, detection method Download PDFInfo
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- CN100504363C CN100504363C CNB2003801024272A CN200380102427A CN100504363C CN 100504363 C CN100504363 C CN 100504363C CN B2003801024272 A CNB2003801024272 A CN B2003801024272A CN 200380102427 A CN200380102427 A CN 200380102427A CN 100504363 C CN100504363 C CN 100504363C
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Abstract
A wiring pattern inspection device includes: a light source (10); a parallel light guide section for guiding light from the light source substantially parallel; and light extraction section for extracting a transversal wave light component orthogonally intersecting the guided light direction, converting the transversal wave component into a particular polarized component, applying the particular polarized component to a work (51), and extracting a longitudinal wave light component from the reflected light of the particular polarized component reflected from the work.
Description
Technical field
The present invention relates to a kind of checkout facility, inspection method, checkout equipment and detection method of wiring pattern, be used for extracting optically semiconductor packages the multilayer wiring substrate the superiors wiring pattern and by the high resolving power captured image, thereby automatically check and detect this pattern, what wherein for example have transparency on the multilayer wiring substrate of described semiconductor packages piles up a plurality of wiring patterns through polyimide insulative layer.
Background technology
Generally speaking, in being formed on for the wiring pattern on the multilayer wiring substrate that makes the littler or lighter semiconductor packages of electronic equipment, Copper Foil through adhesive phase be stacked on the polyimide film and by subtract each other technology, half-phase adds technology etc. and carries out composition/processing, and the thickness of a part is 5-15 μ m, and maximum set Cheng Du has the width of about 10 μ m.
In this composition processing step, probably can produce major defect suddenly, for example wiring pattern attenuation (splitting), wiring disconnection, short circuit and thicken (projection).Therefore, the existence of these defectives is judged by open/shorts check or visual inspection up to now.Yet the problem that visual inspection exists is to need the minimized technical ability of pattern, and because examiner's physical condition etc. produce fluctuation or defective careless omission in check result.Then, in recent years, proposed various types of automatic checkout equipments, these equipment use camera automatically to check exist (for example, the Jpn.Pat.Appln.KOKAI Publication No.10-19531 (example 1) and the Jpn.Pat.No.2962565 (Fig. 5,7)) of defective.And, can check to vision the various types of defects in the wiring pattern in the multilayer wiring substrate that is present in semiconductor packages with 10 μ m minimum widiths, but being visual inspection, the problem that exists needs a large amount of supervision time, and along with the increase product unit price of individual cost has increased.Therefore, need self-verifying.For example, in order to detect 1/3 or more defects in the 10 μ m width, must realize the imaging resolution of 1 μ m.In order to address this problem,, must seek formation method, inspection method, further disposal route etc. from the extensive viewpoint of the relation between imaging resolution and the imaging viewing field (object processing dimension).
Generally speaking, in the automatic checkout equipment that uses camera self-verifying defective to exist, in cut zone etc., utilize the mistiming to a plurality of wiring patterns imagings simultaneously on the same workpiece by a plurality of sensor camera (line CCD device, zone C CD device etc.), and discern this image.By this technology, detect such as attenuation (splitting), wiring disconnection, short circuit, thicken (projection) etc. and be present in defective in the wiring pattern.As identification technology, general method is, in advance cad data (design information) or satisfied workpiece (correctly forming the workpiece of wiring pattern on it) are registered as with reference to master image, and are judged as defective by the part that will have difference such as methods such as the contrast technology of this master image and check image (inspection object pattern image) and feature extraction technologies.Simultaneously, the reflex image, record is formed on the wiring pattern of the superiors, and in most of the cases picks up this image under the situation of any influence of not considering the internal layer wiring pattern.
Example as the reason of doing like this, in product, there is not the internal layer wiring pattern, perhaps even therein exists the imaging of the superiors' wiring pattern in the product of internal layer wiring pattern not placed the influence of insulation course substrate type between the wiring pattern, substrate thickness, substrate color, transmission/reflectance spectrum sensitivity etc. yet.Even when the internal layer wiring pattern exists and plays minimal effect, also can be when imaging passing threshold regulate and easily eliminate this influence, and reflections affect that will the internal layer wiring pattern is just regarded optical problem as from beginning.
Yet, under the situation of using routine inspection equipment, be used for the multilayer wiring substrate of semiconductor packages, when the thickness that places between the wiring pattern and have a polyimide film insulation course of transparency is about 10 to 25 μ m and very little, and when attempting utilizing high resolving power that the superiors' wiring pattern is carried out imaging, the wiring pattern that is present in the internal layer is reflected, and can not obtain only to write down the pattern image of knowing of the superiors' wiring patterns.
And optical condition is very important for using the image that is picked up by camera to carry out above-mentioned inspection.Unless can estimate defective optically, even otherwise process algorithms is very complicated exquisite also can not checking reliably.
In addition, also propose on wiring pattern and insulation course part, to use fluorescent illumination to detect the fluorescent component that produces by insulation course, extract and detect the wiring pattern part in pseudo-mode thus.Yet in this method, wherein the image that extracts the wiring pattern edge in pseudo-mode obtains by fluorescent emission.Therefore, can not detect such as the pin hole in the wiring pattern and be present in defectives such as crackle on the top side of wiring pattern.In order to ensure the quality of the multilayer wiring substrate of semiconductor packages, must record and check wiring pattern.Therefore, requiring to carry out more firmly tangible quality assurance in such a way checks as encapsulation, to such an extent as to can directly see the copper wiring case, can observe such as defective such as miniature pin hole and indenture or be used to carry out the filling quality of the through hole that interlayer is connected, and realize high speed transmission of signals.And, when carrying out the inspection record wiring pattern, check manufacturing process, and be best and can comprise the control of state of the art in order to keep manufacturing process itself by the good/bad point that monitors the wiring pattern that forms during manufacture.
And, thereby the invention described in the Jpn.Pat.Appln.KOKAI Publication No.10-19531 be wherein as dark image to the invention of wiring pattern imaging to the wiring pattern imaging.Therefore, in the method described in the Jpn.Pat.Appln.KOKAI Publication No.10-19531, can only be as dark image pickup wiring pattern, and can not realize the meticulous degree that also can observe such as miniature pin hole and defectives such as indenture or carry out the filling vias quality that interlayer is connected that is imaged onto.
In addition, in the invention described in the Jpn.Pat.No.2962565, irradiation has the laser of specific wavelength (450nm or following), and utilizes the difference between the reflectivity of the reflectivity of wiring pattern and polyimide-based dielectric film (ONAL) to pick up wiring pattern as bright image.Yet, CCD commonly used for wavelength be 450nm or following light without any sensitivity, and need special imaging system.On the other hand, it is had the wavelength (for example, approximately 550nm) of sensitivity, between the reflectivity of the reflectivity of wiring pattern and polyimide-based dielectric film (ON AL), very little difference is arranged for conventional CCD.In Jpn.Pat.No.2962565, in the disclosed method, be difficult to a wiring pattern of the imaging the superiors, and the wiring pattern of not imaging internal layer.
And, in the self-verifying of wiring pattern, must carry out imaging to having large-area wiring pattern at short notice.Yet disclosed method is so-called spot scan in Jpn.Pat.No.2962565.In the method, thus laser convergence irradiation wiring pattern, and the laser that is used to shine wiring pattern scans, and thus wiring pattern carried out imaging.Therefore, need a lot of times.In addition, further in Jpn.Pat.No.2962565 in the disclosed method, detect on the wiring pattern on all directions the intensity of laser light reflected, and obtain the information such as angle that is provided with such as wiring pattern based on detected value.Therefore, at least two detection systems must be set, and formation is complicated.In addition, owing to calculate by the detected value of each system, so that recover the wiring pattern state, so calculated amount is very big.
Summary of the invention
In view of said circumstances has been developed the present invention, and first purpose of the present invention provides a kind of checkout facility, inspection method, checkout equipment and detection method of wiring pattern, wherein optically eliminated the influence of internal layer wiring pattern about the multilayer wiring substrate of semiconductor packages, pick up the high precision image of the superiors' wiring pattern thus, and self-verifying wiring pattern very reliably.
And, second purpose of the present invention provides a kind of checkout facility, inspection method, checkout equipment and detection method of wiring pattern, even also can check and detect the superiors' wiring pattern at short notice for having large tracts of land with the superiors' wiring pattern with simple formation.
To achieve these goals, in the present invention, take down array apparatus.
In other words, according to first scheme of the present invention, a kind of wiring pattern checkout equipment is provided, it detects the superiors' wiring pattern of workpiece optically, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises: light source; The directional light guiding device, it is substantially parallel being used for the light guiding from light source; First extraction element is used for extracting first linearly polarized photon from the light of directional light guide means guide, and its electric field intensity direction and light channeling direction intersect vertically; The circularly polarized light conversion equipment, first linearly polarized photon that is used for being extracted by first extraction element converts circularly polarized light to; Irradiation unit is used to utilize the circularly polarized light irradiation workpiece by the conversion of circularly polarized light conversion equipment; Second extraction element is used for extracting second linearly polarized photon from the reflected light that is obtained by the circularly polarized light of irradiation unit emission by the workpiece reflection, and its electric field intensity direction and first linearly polarized photon intersect vertically; And image pick-up device, be used for second linearly polarized photon that is extracted by second extraction element is carried out imaging.
Therefore, when in the wiring pattern checkout equipment of the present invention's first scheme, taking said apparatus, the light from light source is converted to circularly polarized light, and can shine workpiece with this circularly polarized light.In addition, can extract second linearly polarized photon from reflected light, so that captured image by the reflection of irradiation workpiece.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to alternative plan of the present invention, a kind of wiring pattern checkout equipment is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises: light source; The directional light guiding device, it is substantially parallel being used for the light guiding from light source; Polarizing beam splitter, be used for extracting first linearly polarized photon from the light of directional light guide means guide, its electric field intensity direction and light channeling direction intersect vertically, and first linearly polarized photon that guiding is extracted on this polarizing beam splitter direction of also being used for intersecting vertically at the light channeling direction with the electric field intensity direction of first linearly polarized photon; Quarter wave plate is used for first linearly polarized photon by the polarizing beam splitter guiding is converted to circularly polarized light; Irradiation unit is used to the circularly polarized light irradiation workpiece by the quarter wave plate conversion; And image pick-up device.
And, make by the circularly polarized light of irradiation unit emission anti-phase by workpiece, thereby make the sense of rotation counter-rotating, transmit by quarter wave plate afterwards, extract second linearly polarized photon by polarizing beam splitter, its electric field intensity direction and first linearly polarized photon intersect vertically, and by image pick-up device second linearly polarized photon that extracts are carried out imaging.
Therefore, when taking said apparatus in the wiring pattern checkout equipment at alternative plan of the present invention, quarter wave plate is converted to circularly polarized light to the light from light source, and can shine workpiece with this circularly polarized light.In addition, can extract second linearly polarized photon from reflected light by quarter wave plate and polarizing beam splitter, so that captured image by the reflection of irradiation workpiece.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to third party's case of the present invention, a kind of wiring pattern checkout equipment is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises: light source; The directional light guiding device, it is substantially parallel being used for the light guiding from light source; First polarizing beam splitter is used for extracting first linearly polarized photon from the light of directional light guide means guide, and its electric field intensity direction and light channeling direction intersect vertically; Second polarizing beam splitter, first linearly polarized photon that guiding is extracted by first polarizing beam splitter on its direction that intersects vertically at the light channeling direction with the electric field intensity direction of first linearly polarized photon; Quarter wave plate is used for first linearly polarized photon by the guiding of second polarizing beam splitter is converted to circularly polarized light; Irradiation unit is used to the circularly polarized light irradiation workpiece by the quarter wave plate conversion; And image pick-up device.
And, circularly polarized light by the irradiation unit emission is reflected by workpiece, thereby make the sense of rotation counter-rotating, transmit by quarter wave plate afterwards, extract second linearly polarized photon by second polarizing beam splitter, its electric field intensity direction and first linearly polarized photon intersect vertically, and by image pick-up device second linearly polarized photon that extracts are carried out imaging.
Therefore, when taking said apparatus in the wiring pattern checkout equipment in third party's case of the present invention, in a single day light from light source be converted to first linearly polarized photon, and quarter wave plate just is converted to circularly polarized light to this first linearly polarized photon, and can shine workpiece with this circularly polarized light.In addition, can extract second linearly polarized photon from the reflected light of illuminated workpiece reflection, thus captured image.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to cubic case of the present invention, a kind of wiring pattern checkout equipment is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises: light source; The directional light guiding device, it is substantially parallel being used for the light guiding from light source; Polarization plates is used for extracting first linearly polarized photon from the light of directional light guide means guide, and its electric field intensity direction and light channeling direction intersect vertically; Polarizing beam splitter, first linearly polarized photon that guiding is extracted by polarization plates on its direction that intersects vertically at the light channeling direction with the electric field intensity direction of first linearly polarized photon; Quarter wave plate will be converted to circularly polarized light by first linearly polarized photon of polarizing beam splitter guiding; Irradiation unit is used to the circularly polarized light irradiation workpiece by the quarter wave plate conversion; And image pick-up device.
And, circularly polarized light by the irradiation unit emission is reflected by workpiece, thereby make the sense of rotation counter-rotating, transmit by quarter wave plate afterwards, extract second linearly polarized photon by polarizing beam splitter, its electric field intensity direction and first linearly polarized photon intersect vertically, and by image pick-up device second linearly polarized photon that extracts are carried out imaging.
Therefore, when in the wiring pattern checkout equipment of the cubic case of the present invention, taking said apparatus, by polarization plates, polarizing beam splitter and quarter wave plate the light from light source is converted to circularly polarized light, and can shines workpiece with this circularly polarized light.In addition, can extract second linearly polarized photon from reflected light by the reflection of irradiation workpiece, thus captured image.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to the 5th scheme of the present invention, a kind of wiring pattern checkout equipment is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises: light source; The directional light guiding device, it is substantially parallel being used for the light guiding from light source; First extraction element is used for extracting first linearly polarized photon from the light of directional light guide means guide, and its electric field intensity direction and light channeling direction intersect vertically; The polarized component extraction element is used for obtaining the predetermined polarisation component through the polarization plates with predetermined angular from first linearly polarized photon that is extracted by first extraction element; Irradiation unit is used to the polarized component irradiation workpiece that is obtained by the polarized component extraction element; Second extraction element is used for extracting second linearly polarized photon from the reflected light that is obtained by the polarized component of irradiation unit emission by the workpiece reflection; Its electric field intensity direction and first linearly polarized photon intersect vertically; Image pick-up device is used for second linearly polarized photon that is extracted by second extraction element is carried out imaging.
Therefore, when in the wiring pattern checkout equipment of the present invention's the 5th scheme, taking said apparatus, the light from light source is converted to polarized component, and shines workpiece with this polarized component.In addition, can extract second linearly polarized photon from the reflected light of illuminated workpiece reflection, thus captured image.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to the 6th scheme of the present invention, a kind of wiring pattern checkout equipment is provided, can learn the superiors' wiring pattern of going up the detection workpiece by veiling glare, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises: light source; The directional light guiding device, it is substantially parallel being used for the light guiding from light source; Polarizing beam splitter, be used for from the light of directional light guide means guide, extracting first linearly polarized photon, its electric field intensity direction and light channeling direction intersect vertically, and first linearly polarized photon that guiding is extracted on this polarizing beam splitter direction of also being used for intersecting vertically at the light channeling direction with the electric field intensity direction of first linearly polarized photon; The polarized component extraction element is used for obtaining predetermined polarized component through the polarization plates with predetermined angular from first linearly polarized photon by the polarizing beam splitter guiding; Irradiation unit is used to the polarized component irradiation workpiece that is obtained by the polarized component extraction element; And image pick-up device.
And, extract second linearly polarized photon by polarizing beam splitter from the reflected light that the polarized component of being launched by irradiation unit by the workpiece reflection obtains, its electric field intensity direction and first linearly polarized photon intersect vertically, and by image pick-up device second linearly polarized photon that extracts are carried out imaging.
Therefore, when in the wiring pattern checkout equipment of the present invention's the 6th scheme, taking said apparatus, the light from light source is converted into polarized component, and can shines workpiece with this polarized component.In addition, can extract second linearly polarized photon from the reflected light of illuminated workpiece reflection, so that captured image.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to the 7th scheme of the present invention, a kind of wiring pattern checkout equipment is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises: light source; The directional light guiding device, it is substantially parallel being used for the light guiding from light source; First polarizing beam splitter is used for extracting first linearly polarized photon from the light of directional light guide means guide, and its electric field intensity direction and light channeling direction intersect vertically; Second polarizing beam splitter, first linearly polarized photon that guiding is extracted by first polarizing beam splitter on its direction that intersects vertically at the light channeling direction with the electric field intensity direction of first linearly polarized photon; The polarized component extraction element is used for obtaining predetermined polarized component through the polarization plates with predetermined angular from first linearly polarized photon by the guiding of second polarizing beam splitter; Irradiation unit is used to the polarized component irradiation workpiece that is obtained by the polarized component extraction element; And image pick-up device.
And, extract second linearly polarized photon by second polarizing beam splitter from the reflected light that the polarized component of being launched by irradiation unit by the workpiece reflection obtains, its electric field intensity direction and first linearly polarized photon intersect vertically, and by image pick-up device second linearly polarized photon that extracts are carried out imaging.
Therefore, when in the wiring pattern checkout equipment of the present invention's the 7th scheme, taking said apparatus, in case the light from light source is converted to first linearly polarized photon, just this first linearly polarized photon is converted to polarized component, and can shines workpiece with this polarized component.In addition, can extract second linearly polarized photon from the reflected light of illuminated workpiece reflection, thus captured image.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to all directions of the present invention case, a kind of wiring pattern checkout equipment is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises: light source; The directional light guiding device, it is substantially parallel being used for the light guiding from light source; Polarization plates is used for extracting first linearly polarized photon from the light of directional light guide means guide, and its electric field intensity direction and light channeling direction intersect vertically; Polarizing beam splitter, first linearly polarized photon that guiding is extracted by polarization plates on the direction that is used for intersecting vertically at the light channeling direction with the electric field intensity direction of first linearly polarized photon; The polarized component extraction element is used for obtaining predetermined polarized component through the polarization plates with predetermined angular from first linearly polarized photon by the polarizing beam splitter guiding; Irradiation unit is used to the polarized component irradiation workpiece that is obtained by the polarized component extraction element; And image pick-up device.
And, extract second linearly polarized photon that intersects vertically with first linearly polarized photon from the reflected light that obtains by the workpiece reflection polarized component by the irradiation unit emission,, and second linearly polarized photon that extracts is carried out imaging by image pick-up device.
Therefore, when in the wiring pattern checkout equipment of the present invention all directions case, taking said apparatus, the light from light source is converted to polarized component, and can shines workpiece with this polarized component.In addition, can extract second linearly polarized photon from the reflected light of illuminated workpiece reflection, thus captured image.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to the 9th scheme of the present invention, according to first to the from all directions in any one wiring pattern checkout equipment in the case, image pick-up device comprises line sensor, this line sensor is connected to each other to the predetermined range of linearity continuous imaging in the workpiece and with the range of linearity of continuous imaging, and the plane domain to workpiece carries out imaging thus.
Therefore, when in the wiring pattern checkout equipment of the present invention's the 9th scheme, taking said apparatus, can the line sweep workpiece, captured image thus, and therefore compare captured image at short notice with the spot scan workpiece.
According to the tenth scheme of the present invention, in according to any one wiring pattern checkout equipment in first to the 9th scheme, the directional light guiding device comprises: the light guide, and guiding is from the light of light source; Diffusing panel makes the light diffusion from light source keep intensity distributions constant simultaneously; The parallelization device is used to make the light by the diffusing panel diffusion substantially parallel; And the device that is used to guide the directional light that produces by the parallelization device.
Therefore, when in the wiring pattern checkout equipment of the present invention's the tenth scheme, taking said apparatus, can make light diffusion keep intensity distributions constant simultaneously, can under fully without any heteropical situation, utilize the high resolving power captured image from light source.
According to the 11 scheme of the present invention, in the wiring pattern checkout equipment in the tenth scheme, the infrared filter of removing infrared composition from the light from light source is set between light source and light guide or between light guide and diffusing panel.
Therefore, when in the wiring pattern checkout equipment of the present invention's the 11 scheme, taking said apparatus, prevent that infrared ray from entering the directional light guiding device to such an extent as to can interrupt constituting the infrared ray of thermal source by this way, can forbid that therefore the temperature of directional light guiding device raises.
According to the 12 scheme of the present invention, also comprise according to any one wiring pattern checkout equipment in the first to the 11 scheme: the cooling device that is used to cool off the directional light guiding device.
Therefore, when in the wiring pattern checkout equipment of the present invention's the 12 scheme, taking said apparatus, can cool off the directional light guiding device.
According to the 13 scheme of the present invention, also comprise according to any one wiring pattern checkout equipment in the first to the 12 scheme: selecting arrangement, be used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value; And selected wavelength light divides amount guide device, is used for the wavelength region may direct light component of selecting by selecting arrangement.
Therefore, in the wiring pattern checkout equipment of the present invention's the 13 scheme, take said apparatus, and correspondingly in second linearly polarized photon, select wavelength region may, difference between the reflection light quantity of the pattern in this wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern is greater than predetermined value, and can pick up the image that is made of the light component in the selected wavelength region may.Thereby, can obtain to be visualized as the image of the superiors' wiring pattern.
According to the of the present invention the tenth cubic case, in the wiring pattern checkout equipment of the 13 scheme, selected wavelength light divides amount guide device to comprise that one or two or a plurality of lens, these lens and image pick-up device guide the light component in the wavelength region may of being selected by selecting arrangement abreast.
Therefore, when in the wiring pattern checkout equipment of the present invention's the tenth cubic case, taking said apparatus, suitably use one or two or a plurality of lens and image pick-up device to guide the light component of selected wavelength region may abreast.The result is to pick up the precise image that is visualized as the superiors' wiring pattern.
According to the 15 scheme of the present invention, in the wiring pattern checkout equipment according to the of the present invention the 13 or the tenth cubic case, basement membrane is formed by polyimide resin, and wiring pattern is formed by copper, selecting arrangement selects to comprise the wavelength region may of 550nm, and image pick-up device comprises CCD.
Therefore, in the wiring pattern checkout equipment of the present invention's the 15 scheme, take said apparatus, and correspondingly can detect the superiors' wiring pattern that relates to the workpiece that forms by polyimide resin and copper with good degree of accuracy, wherein polyimide resin and copper all are the typical materials of basement membrane and wiring pattern.
According to the 16 scheme of the present invention, in any one wiring pattern checkout equipment in first to the tenth cubic case, with elliptically polarized light rather than circularly polarized light irradiation workpiece.
Therefore, when in the wiring pattern checkout equipment of the present invention's the 16 scheme, taking said apparatus, not only can but also can use elliptic polarization rayed workpiece with circularly polarized light.
According to the 17 scheme of the present invention, in any one wiring pattern checkout equipment in the first to the 16 scheme, light source comprises white light source.
Therefore, when taking said apparatus in the wiring pattern checkout equipment of the present invention's the 17 scheme, white light source can be used as light source and need not use any special light sources.
According to the tenth all directions case of the present invention, a kind of wiring pattern checkout facility is provided, comprise: testing fixture, be used for comparing, check thus whether the superiors' wiring pattern is satisfactory by the image pick-up device image that picks up and the satisfied image of being scheduled to of any one wiring pattern checkout equipment of the first to the 17 scheme according to the present invention.
Therefore, when in the wiring pattern checkout facility of the present invention's the tenth all directions case, taking said apparatus, can whether satisfactory with good accuracy checking the superiors wiring pattern.
According to the 19 scheme of the present invention, a kind of wiring pattern detection method is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this method comprises: the light guiding is substantially parallel directional light guiding step; Extract first extraction step of first linearly polarized photon from the light of directional light guiding step guiding, the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically; To be converted to the circularly polarized light switch process of circularly polarized light by first linearly polarized photon that first extraction step extracts; Use irradiating step by the circularly polarized light irradiation workpiece of circularly polarized light switch process conversion; Extract second extraction step of second linearly polarized photon from the reflected light that is obtained by the circularly polarized light of irradiating step emission by the workpiece reflection, the electric field intensity direction and first linearly polarized photon of this second linearly polarized photon intersect vertically; And the image pickup step that second linearly polarized photon that is extracted by second extraction step is carried out imaging.
When in the wiring pattern detection method of the present invention's the 19 scheme, taking said apparatus, the light from light source is converted to circularly polarized light, and shines workpiece with this circularly polarized light.In addition, the reflected light that reflects from illuminated workpiece extracts second linearly polarized photon, and imaging.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to the 20 scheme of the present invention, a kind of wiring pattern detection method is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, this method comprises: the directional light guiding device is used for the light guiding for substantially parallel; Extract the step of first linearly polarized photon by polarization plates from the light of directional light guide means guide, the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically; Use the step of guiding first linearly polarized photon on the direction that polarizing beam splitter intersects vertically at the light channeling direction with the direction of the electric field intensity of first linearly polarized photon; Utilize quarter wave plate will be converted to the step of circularly polarized light by first linearly polarized photon of polarizing beam splitter guiding; Use step by the circularly polarized light irradiation workpiece of quarter wave plate conversion; And be transmitted into the circularly polarized light of workpiece so that the sense of rotation counter-rotating by workpiece reflection, afterwards by quarter wave plate transmission polarized light, thereby and extract and first linearly polarized photon step that second linearly polarized photon carries out imaging to second linearly polarized photon that extracts that intersects vertically by polarizing beam splitter.
Therefore, when in the wiring pattern detection method of the present invention's the 20 scheme, taking said apparatus, by polarization plates, polarizing beam splitter and quarter wave plate the light from light source is converted to circularly polarized light, and can shines workpiece with this circularly polarized light.In addition, can extract second linearly polarized photon from reflected light by the reflection of irradiation workpiece, and imaging.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to the 21 scheme of the present invention, a kind of wiring pattern detection method is provided, can optically detect the superiors' wiring pattern of workpiece, this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this method comprises: be used for the light guiding is substantially parallel directional light guiding step; Extract first extraction step of first linearly polarized photon from the light of directional light guiding step guiding, the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically; From first linearly polarized photon that extracts by first extraction step, obtain the polarized component extraction step of predetermined polarized component through polarization plates with predetermined angular; Irradiating step with the polarized component irradiation workpiece that obtains by the polarized component extraction step; Extract second extraction step of second linearly polarized photon from the reflected light that is obtained by the polarized component of irradiating step emission by the workpiece reflection, the electric field intensity direction and first linearly polarized photon of this second linearly polarized photon intersect vertically; And the image pickup step that second linearly polarized photon that is extracted by second extraction step is carried out imaging.
Therefore, when in the wiring pattern detection method of the present invention's the 21 scheme, taking said apparatus, the light from light source is converted to polarized component, and can shines workpiece with this polarized component.。In addition, can extract second linearly polarized photon from reflected light by the reflection of irradiation workpiece, and imaging.This second linearly polarized photon comprises the information about the superiors' wiring pattern.
According to the 22 scheme of the present invention, in any one wiring pattern detection method in the 19 to the 21 scheme, use line sensor that the predetermined range of linearity in the workpiece is carried out imaging continuously, and the range of linearity by continuous imaging is connected to each other, and the plane domain to workpiece carries out imaging thus.
Therefore, when in the wiring pattern detection method of the present invention's the 22 scheme, taking said apparatus, can the line sweep workpiece, therefore captured image compares captured image at short notice with the spot scan workpiece thus.
According to the 23 scheme of the present invention, in any one wiring pattern detection method in the 19 to the 22 scheme, directional light guiding step comprises: make light diffusion keep the constant diffusion step of intensity distributions simultaneously; Make by the substantially parallel parallelization step of the light of diffusion step diffusion; With the step of guiding by the directional light of parallelization step generation.
Therefore, when in the wiring pattern detection method of the present invention's the 23 scheme, taking said apparatus, can make light diffusion keep intensity distributions constant simultaneously from light source, and can be with the high resolving power captured image under fully without any heteropical situation.
According to the of the present invention the 20 cubic case, in the wiring pattern detection method of the 23 scheme of the present invention, directional light guiding step also comprises: the infrared ray of removing infrared composition before the diffusion step from light is removed step.
Therefore, when in the wiring pattern checkout equipment of the present invention's the 20 cubic case, taking said apparatus, prevent that infrared ray from entering the directional light guiding device to such an extent as to can interrupt constituting the infrared ray of thermal source by this way, can forbid that therefore the temperature of light guide member raises.
According to the 25 scheme of the present invention, any one wiring pattern detection method in the 19 to the 20 cubic case also comprises: select the selection step of wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value; And guiding is in the selected wavelength light component guiding step by the light component in the wavelength region may of selecting step to select.
Therefore, in the wiring pattern detection method of the present invention's the 25 scheme, take said apparatus, and correspondingly in second linearly polarized photon, select wavelength region may, difference between the reflection light quantity of the pattern in this wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern is greater than predetermined value, and can pick up the image that is made of the light component in the selected wavelength region may.Thereby, can obtain to be visualized as the image of the superiors' wiring pattern.
According to the 26 scheme of the present invention, in the wiring pattern detection method of the present invention's the 25 scheme, basement membrane is formed by polyimide resin, and wiring pattern is formed by copper, select step to select to comprise the wavelength region may of 550nm, and the image pickup step is come captured image by CCD.
Therefore, in the wiring pattern detection method of the present invention's the 26 scheme, take said apparatus, and correspondingly can relate to the superiors' wiring pattern of the workpiece that forms by polyimide resin and copper with good accuracy detection, wherein said polyimide resin and copper all are the typical materials of basement membrane and wiring pattern.
According to the 27 scheme of the present invention, the 19 or twentieth wiring pattern detection method in, replace circularly polarized light irradiation workpiece with elliptically polarized light.
Therefore, when in the wiring pattern detection method of the present invention's the 27 scheme, taking said apparatus, not only can but also can shine workpiece with circularly polarized light with elliptically polarized light.
According to the 20 all directions case of the present invention, in any one wiring pattern detection method in the 19 to 27 scheme, light source comprises white light source.
Therefore, when taking said apparatus in the wiring pattern detection method of the present invention's the 20 all directions case, white light source can be used as light source and does not use any special light sources.
According to the 29 scheme of the present invention, a kind of wiring pattern inspection method is provided, comprising the steps: will be by comparing according to any one wiring pattern detection method image that picks up and the gratifying image of being scheduled in the 19 to the 20 all directions case, so that check whether the superiors' wiring pattern is gratifying.
Therefore, when in the wiring pattern inspection method of the present invention's the 29 scheme, taking said apparatus, can whether satisfactory with good accuracy checking the superiors wiring pattern.
Brief description of drawings
Fig. 1 is the formation key diagram that illustrates according to an example of the wiring pattern checkout facility of first embodiment;
Fig. 2 is the formation key diagram that illustrates according to an example of the inspection unit in the wiring pattern checkout facility of first embodiment;
Fig. 3 is illustrated in the irradiation area in the workpiece and the synoptic diagram of the relation between the range of linearity;
Fig. 4 A is the synoptic diagram that the principle of the wiring pattern image that is used to obtain wherein to make the superiors' wiring pattern information imagery is shown;
Fig. 4 B is the synoptic diagram that the principle of the wiring pattern image that is used to obtain wherein to make the superiors' wiring pattern information imagery is shown;
Fig. 4 C is the synoptic diagram that the principle of the wiring pattern image that is used to obtain wherein to make the superiors' wiring pattern information imagery is shown;
Fig. 4 D is the synoptic diagram that the principle of the wiring pattern image that is used to obtain wherein to make the superiors' wiring pattern information imagery is shown;
The rotation angle that Fig. 5 A is illustrated in Polarization filter in the inspection unit shown in Fig. 2 is set to the captured image of the wiring pattern under the situation of 0 degree;
The rotation angle that Fig. 5 B is illustrated in Polarization filter in the inspection unit shown in Fig. 2 is set to the captured image of the wiring pattern under the situations of 10 degree;
The rotation angle that Fig. 5 C is illustrated in Polarization filter in the inspection unit shown in Fig. 2 is set to the captured image of the wiring pattern under the situations of 45 degree;
The rotation angle that Fig. 5 D is illustrated in Polarization filter in the inspection unit shown in Fig. 2 is set to the captured image of the wiring pattern under the situations of 80 degree;
The rotation angle that Fig. 5 E is illustrated in Polarization filter in the inspection unit shown in Fig. 2 is set to the captured image of the wiring pattern under the situations of 90 degree;
Fig. 6 A illustrates the image that passes through the superiors' wiring pattern that inspection unit according to the present invention picks up about the multilayer wiring substrate of semiconductor packages, on described substrate three layers of internal layer wiring pattern with respect to the superiors' wiring pattern through polyimide insulative layer and exist;
Fig. 6 B illustrates the image that routine techniques picks up that passes through about the multilayer wiring substrate of semiconductor packages, and three layers of internal layer wiring pattern exist through polyimide insulative layer with respect to the superiors' wiring pattern on described substrate;
Fig. 7 A illustrates the image that passes through the superiors' wiring pattern of obtaining according to inspection unit of the present invention about the multilayer wiring substrate of semiconductor packages, at described substrate last layer internal layer wiring pattern with respect to the superiors' wiring pattern through polyimide insulative layer and exist;
Fig. 7 B goes out the linear distribution of the image of corresponding Figure 15;
Fig. 8 illustrates by the scale-of-two of image shown in Figure 15 and handles the image that obtains;
Fig. 9 is illustrated in the histogrammic example of rotation angle wiring pattern image under the altered situation in according to the wiring pattern checkout facility of first embodiment of the Polarization filter of inspection unit;
Figure 10 is the skeleton view that illustrates according to the whole formation example of the polarizing beam splitter in the wiring pattern checkout facility of second embodiment;
Figure 11 is the skeleton view that illustrates according to the whole formation example of another polarizing beam splitter in the wiring pattern checkout facility of second embodiment;
Figure 12 is the distribution plan that is illustrated in the view data of picking up under the situation (c) that situation (a) that polarizing beam splitter is set separately, situation (b) that polarizing beam splitter comprises thin slice prism and half-wave plate and polarizing beam splitter comprise completely reflecting mirror and quarter wave plate along the rank difference of any row of wiring pattern part;
Figure 13 is the formation key diagram that illustrates according to an example of the inspection unit of the wiring pattern checkout facility of the 3rd embodiment;
Figure 14 is the formation key diagram that illustrates according to an example of the directional light guiding device in the inspection unit of the wiring pattern checkout facility of the 3rd embodiment;
Figure 15 A is the formation key diagram that illustrates according to an example of the part of the light extraction in the inspection unit of the wiring pattern checkout facility of the 3rd embodiment;
Figure 15 B is the formation key diagram that illustrates according to an example of the part of the light extraction in the inspection unit of the wiring pattern checkout facility of the 3rd embodiment;
Figure 15 C is the formation key diagram that illustrates according to an example of the part of the light extraction in the inspection unit of the wiring pattern checkout facility of the 3rd embodiment;
Figure 15 D is the formation key diagram that illustrates according to an example of the part of the light extraction in the inspection unit of the wiring pattern checkout facility of the 3rd embodiment;
Figure 16 is the skeleton view that the position relation between two levels of the polarizing beam splitter that series connection is provided with is shown;
Figure 17 illustrates the formation key diagram of selecting an example of part according to the wavelength in the inspection unit of the wiring pattern checkout facility of the 3rd embodiment;
Figure 18 A illustrates an image, and this image is illustrated in the example of the superiors' wiring pattern that picks up in the multilayer wiring substrate of semiconductor packages, has one deck internal layer wiring pattern on described substrate;
Figure 18 B illustrates an image, and this image is illustrated in the example of the superiors' wiring pattern that picks up in the multilayer wiring substrate of semiconductor packages, has three layers of internal layer wiring pattern on described substrate;
Figure 19 A illustrates an image, and this image is illustrated in the example of the superiors' wiring pattern that picks up in the multilayer wiring substrate of semiconductor packages, has one deck internal layer wiring pattern on described substrate;
Figure 19 B illustrates by the scale-of-two of image shown in Figure 19 A and handles the image that obtains;
Figure 20 be illustrated under the situation of two-stage polarizing beam splitter tandem compound image and in combination polarizing beam splitter and lateral wave polarization plates so that improve the example that the line on the imaging viewing field Width in the image under the situation of polarization efficiency distributes;
Figure 21 A is illustrated in the opposed end of polarizing beam splitter with respect to the figure of the incident angle that applies without any the situation (situation that the series connection of two-stage polarizing beam splitter is provided with) of skew;
Figure 21 B is at the opposed end of the polarizing beam splitter key diagram with respect to the skew (situation that the series connection of two-stage polarizing beam splitter is provided with) of the incident angle that applies;
Figure 22 A is illustrated in the opposed end of polarizing beam splitter with respect to the figure of the incident angle that applies without any the situation (situation of a polarizing beam splitter only is set) of skew;
Figure 22 B is at the opposed end of the polarizing beam splitter key diagram with respect to the skew (situation of a polarizing beam splitter only is set) of the incident angle that applies.
Implement best mode of the present invention
Embodiments of the invention are described below with reference to accompanying drawings.
First embodiment
Below with reference to Fig. 1-9 explanation first embodiment of the present invention.
Fig. 1 is the formation key diagram that illustrates according to an example of the wiring pattern checkout facility of present embodiment.
In other words, wiring pattern checkout facility 200 according to present embodiment is wiring pattern checkout facilities of optically checking the superiors' wiring pattern of workpiece 51, described workpiece 51 comprises the multilayer wiring substrate of semiconductor packages, wherein forms wiring pattern in basement membrane.This equipment comprises inspection unit 100, workpiece unwinding (wind-out) unit 110, overhead code sensing element 120, indexing unit 130, checks/examine unit 140, workpiece twines unit 150 and principal computer 160.
In workpiece unwinding unit 110, the workpiece spool 111 that twines workpiece 51 on it is set on the worktable of bottom, workpiece 51 is sent along bottom worktable workpiece path by roller 113, and by be arranged on needs/correct position on/lower limited sensor 122 adjusts the amount of unclamping.Isolation strip spool 112 twines the isolation strip 52 that is used to protect, and this isolation strip 52 twists in workpiece 51 on workpiece spool 111.The status information transmission of workpiece 51 is to principal computer 160.
Then, transmit head roll 121a, 121b by band and stablize workpiece 51 through guide roller 114,115 pinpoint accuracy ground.Under this state, workpiece is transported to overhead code sensing element 120, read overhead code (for example wherein the mark of management/coding workpiece information, etc.) by CCD camera 123, and the overhead code of reading is transferred to principal computer 160.
In addition, transmit head roll 121a, stablize workpiece 51 to the 121b pinpoint accuracy by band through guide roller 116,117.Under this state, workpiece is transported to inspection unit 100.Inspection unit 100 optically obtains the wiring pattern of the superiors of workpiece 51.And, compare with normal design wiring pattern data by the wiring pattern data that the characteristic of extracting the wiring pattern that obtains obtains, and judge whether this wiring pattern is satisfactory.And judged result flows to principal computer 160.The details of this inspection unit 100 will be explained below.
Utilize band to transmit head roll 121a, 121b and stablize its wiring pattern accurately through guide roller 118,119 and be judged as gratifying or not satisfied workpiece 51, and under this state, it is flowed to indexing unit 130 by inspection unit 100.130 pairs of workpiece 51 as the defectiveness product of indexing unit are bored a hole or are made marks so that discern defective workpiece 51.And, give principal computer 160 with this mark result transmission.It should be noted that the example of labeling method comprises stamped mark, adhesive tape (taping) and other method except perforation.
Then, checking/examining in the unit 140, not only observing wiring pattern but also examine undue quality level for confirmation.This affirmation result sends principal computer 160 to.
In addition, be provided with wiring pattern or arbitrarily during the length measurement function of parts, except detector, can also realize the linear measure longimetry unit when reexamining function such as defective FRU etc.Correspondingly, can grasp the routine information of the pattern width of a spool, and this there is contribution for feeding back at once in step.
Next, through guide roller 141,142 workpiece 51 is transferred to workpiece and twines unit 150.And, workpiece and the isolation strip that is used to protect 52 that is provided by the isolation strip spool 152 in the workpiece spool 151 are intertwined.Workpiece twines the status information transmission of the workpiece 51 in the unit 150 to principal computer 160.
The wiring pattern checkout facility 200 of Gou Chenging has the cellular construction as substrate in this way.For example, can easily carry out the interpolation/removal of unit, for example add inspection unit 100,, and consider the use in cleaning ambient and realized structure or structure so that improve processing speed.Workpiece phoresys or other structure is not limited to above-mentioned pattern.For example, this structure can be vertically to phoresy rather than laterally to phoresy and implement, and workpiece unwinding unit 110 and workpiece twine unit 150 and all be arranged on the same side, perhaps can also realize other setting.
The details of inspection unit 110 will be explained below.
As shown in Figure 2, inspection unit 100 comprises: light source 10; Light guide 11; Collector lens 12; Hot line cutting wave filter 13; Heat radiation mechanism 14; Polarizing beam splitter 21; Polarizing beam splitter 22; Sensor camera 30; CCD device 31; Bandpass filter 32; Image forms lens 33; Polarization filter 34 (polarization plates); Calculation control unit 40; And workpiece is fixed/driving mechanism 50.It should be noted that each collector lens 12 and image form lens 33 and all be not limited to single lens, and can be the lens combination that comprises a plurality of lens.
As light source 10, the highlight illumination device of the light in the whole visible range of preferred emission is as white light source and metal halide lamp.For as described later by CCD device 31 with the high resolving power captured image, then need the light of capacity.Therefore, as light source 10, for example, be that the metal halide lamp of 250W becomes the metal halide lamp that rated power is 350W with rated power.As light guide 11, thereby preferably can make up spotted type or the rod-shaped lens of exporting from end emission from the light of a plurality of light sources 10.In addition, when the quantity of the light source 10 that uses increases, light guide 11 tie up diameter or outer shape must be amplified, therefore need design collector lens 12.Must also adopt the hot measure that produces from the infrared light in the light of light source 10 by being included in.
When launching the light time from light source 10, light enters polarizing beam splitter 21 through light guide 11, collector lens 2 and hot line cutting wave filter 13.The light that hot line cutting wave filter 13 interrupts on long wavelength's one side (for example, 700nm or above wavelength), and allow other light to enter polarizing beam splitter 21.
From the what is called of the light component that only has a lot of directions of light source 10 emission light at random.It should be noted that in this case " light channeling direction " is defined as in the drawings horizontal direction from right to left.Polarizing beam splitter 21 extracts linearly polarized photon (the preceding and rear among the figure is to being the electric field intensity direction) the light at random from this.Therefore, must fully take into account applicable wavelengths zone, extinction ratio, polarisation and select suitable polarizing beam splitter than, the outer shape size etc. that can shine the whole work-piece visual field or form image.Polarizing beam splitter 21 obtains linearly polarized photon in this manner, but needn't extract 100% linearly polarized photon, in addition, also comprises its electric field intensity front/rear direction in the drawings a little light component in addition.
It should be noted that polarizing beam splitter 21 and hot line cutting wave filter 13 are owing to the light of light source 10 is under the high temperature.Because the risk of breaking is arranged, therefore the perhaps degeneration of optics itself is provided with heat radiation mechanism 14.Heat radiation mechanism 14 cools off polarizing beam splitter 21 and hot line cutting wave filter 13 thus from the outer jet air.For example, when a 250W metal halide lamp was used as light source 10, hot line cutting wave filter 13 was under about 75 ℃ high temperature, and still the experimental example that obtains shows by heat radiation mechanism 14 ejection air, thus temperature is reduced to about 50 ℃.
The linearly polarized photon that polarizing beam splitter 21 guiding are extracted is to polarizing beam splitter 22.At this moment, the light component that is not directed into polarizing beam splitter 22 is run away on the lens tube sidewall in the polarizing beam splitter 21, therefore need apply hot measure in sidewall sections.The as much as possible little gap that is provided with between polarizing beam splitter 21 and 22 is so that make the light propagation loss minimum.
From the light of polarizing beam splitter 21 guiding, also comprising a little light of its electric field intensity beyond front/rear direction, therefore remove it by polarizing beam splitter 22.Further guide described light downwards.And image forms lens 33 and Polarization filter 34 and converts this linearly polarized photon the light of the angle component of the rotation angle with 40 to 50 ° to, and irradiation is fixed/the fixing workpiece 51 of driving mechanism 50 by workpiece.With light component irradiation workpiece 51 by obtaining according to rotation angle vector-decomposition incident linearly polarized photon.It should be noted that in Fig. 2 image forms lens 33 and is arranged between polarizing beam splitter 22 and the Polarization filter 34, but Polarization filter 34 can be arranged on polarizing beam splitter 22 and image forms between the lens 33.Rotating mechanism can suitably be provided with according to a kind of like this mode, makes Polarization filter 34 can easily select to include only the light of certain angle component.
The light component that is used to shine workpiece 51 is by workpiece 51 reflections, and enters polarizing beam splitter 22 by the light component that this reflected light of rotation angle vector-decompositions according to Polarization filter 34 obtains through Polarization filter 34 and image formation lens 33.At this moment, in polarizing beam splitter 22, extracted its electric field intensity direction and be in linearly polarized photon on the light channeling direction, and this linearly polarized photon enters bandpass filter 32.
Bandpass filter 32 is extracted wavelength region may, in this wavelength region may, the reflection light quantity of the superiors' wiring pattern and the reflected light by polyimide insulative layer part produce from the difference maximum between the amount of polarizing beam splitter 22, and the light of the wavelength region may of only extracting to some extent enters the CCD device 31 in the sensor camera 30.
In the present embodiment, the line sensor technology is applied to sensor camera 30.Fig. 3 is the synoptic diagram that the line sensor technology is shown.In other words, in sensor camera 30, entering in the light of CCD device 31 by bandpass filter 32, only corresponding to as the specification of CCD device 31 and the light of the predetermined range of linearity by 31 imagings of CCD device.In Fig. 3, circular irradiation area 71 is represented the zone with the workpiece 51 of light component irradiation.Each above-mentioned range of linearity 72 is set in such a way, the feasible center of passing each irradiation area 71.When fix by the workpiece that is used for workpiece 51/driving mechanism 50 guarantees the flatness of workpiece 51 and with the light component irradiation during as the irradiation area 71 of the part of workpiece 51 in image forms the depth of focus of lens 33, requiredly be taken on the direction optical head or the workpiece of adjusting sensor camera 30 and fixing therein/state of driving mechanism 50 under, CCD device 31 captured images.Correspondingly, sensor camera 30 is carried out imaging to light in the range of linearity 72 of corresponding irradiation area 71.
When in this manner the light in certain range of linearity 72 being carried out imaging, drive workpiece and fix/driving mechanism 50, and workpiece 51 trace are moved, for example, shown in the arrow among Fig. 3, and irradiation area 71 is moved.And, similarly the light in the range of linearity 72 corresponding with irradiation area 71 is carried out imaging.Carry out continuously that trace moves and the imaging of workpiece 51, till the range of linearity 72 covers the whole surface of workpiece 51.And, when the range of linearity 72 of each imaging superposes when obtaining image-forming information about the whole surface of workpiece 51 thus each other, obtain the wiring pattern image, wherein obtained the superiors' wiring pattern information.
Because constituting the wiring pattern minimum of the workpiece 51 of object is 10 μ m, and is very meticulous, use according to the image that picks up to have sensor camera 30 and the image formation lens 33 that high-resolution mode designs optically.Resolution is preferably about 1 to 2 μ m, can fully clearly obtain pattern edge information thus, but the target of this resolution setting is as about 1/9 to 1/10 of the pattern width of object.Owing to imaging viewing field also changes along with device quantity with about the resolution of the CCD device 31 of employed sensor camera 30, therefore abundant research resolution.For example, under the situation of the resolution that realizes 1 μ m by the CCD device 30 with 8000 pixels, imaging viewing field is 8mm.
And, suppose that CCD device 31 is of a size of 7 μ m, then require seven times optics to amplify naturally.The resolution characteristic that obtain this moment is 721p (line to the)/mm on the subject side.In order to realize the resolution of 1 μ m, can not utilize equal brightness captured image, unless according to respect to the area of the resolution of 7 μ m than there being about 50 times light quantity.In optical system, need to have various conditions logic and.
And, in bandpass filter 32, for example, as in the dichroic green filter, use has the wave filter of wavelength region may and high-transmission rate, the difference maximum in described wavelength region may between the reflection light quantity of the reflection light quantity of the superiors' wiring pattern and polyimide insulative layer part.Specifically, when the wavelength that is conceived to as the 550nm of green component, the reflectance spectrum sensitivity of copper is 3%, and the reflectance spectrum sensitivity of polyimide layer is 0.1%, and as obtaining from experiment value, reflects 30 times light.
In other words, owing to depend on copper and polyimide by the intensity of the light component of workpiece 51 reflection, and copper has stronger reflection strength, therefore can partly carry out imaging brightly to the superiors' wiring pattern.When irradiation workpiece 51, polarisation shines wiring pattern and polyimide insulative layer than increasing, and correspondingly more clearly picks up the image of the superiors' wiring pattern.
The wiring pattern data of the wiring pattern image that wherein obtains the superiors' wiring pattern information are by this way outputed to calculation control unit 40, this calculation control unit 40 comprises (not shown) such as personal computer, keyboard, mouse, display, and shows on display.In calculation control unit 40, use output wiring pattern data and standard design wiring pattern data to carry out various calculating, identification and comparison process, and judge whether wiring pattern is satisfactory.Calculation control unit 40 also has the effect of user interface, and its control workpiece is fixed/driving mechanism 50 etc.
Then, with the operation of explanation according to the inspection unit of the wiring pattern checkout facility of the present embodiment that constitutes as mentioned above.
In other words, in inspection unit 100,, light is directed to hot line cutting wave filter 13 through light guide 11 and collector lens 12 when from the 10 emission light time of light source.And the light on long wavelength's one side (for example, 700nm or above wavelength) is interrupted by hot line cutting wave filter 13, and another Shu Guang is directed in the polarizing beam splitter 21.
From the only light at random of light source 10 emission, and in polarizing beam splitter 21 from light extraction linearly polarized photon (the front/rear direction the figure is the electric field intensity direction) at random, and it is directed to polarizing beam splitter 22.It should be noted, do not need to extract 100% linearly polarized photon (the front/rear direction among the figure is the electric field intensity direction), and comprise the light component of the slight amount of the front/rear direction electric field intensity in addition among the figure by polarizing beam splitter 21.
It should be noted that polarizing beam splitter 21 and hot line cutting wave filter 13 is in because under the high temperature that the light of light source 10 produces, and cool off by air by heat radiation mechanism 14 ejections.
From the light of polarizing beam splitter 21 guiding, comprising a little light that contains front/rear direction electric field intensity in addition, therefore remove by polarizing beam splitter 22.And, light is formed lens 33 and Polarization filter 34 guiding to image.In addition, use the linear polarization rayed workpiece 51 that extracts by polarizing beam splitter 22, wherein the predetermined deflection component that obtains through Polarization filter 34 with predetermined angle by workpiece fix/driving mechanism 50 is fixing.
After this, light forms lens 33 by image and forms directional light, and by polarizing beam splitter 22 extract its electric field intensity directions be among the figure the right side/left to linearly polarized photon, afterwards it is directed to bandpass filter 32.
In bandpass filter 32, extract the wavelength region may of the difference maximum between the reflection light quantity of the reflection light quantity wherein make the superiors' wiring pattern and polyimide insulative layer part, and only with the light transmission of the wavelength region may CCD device 31 in the sensor camera 30.Specifically, in the wavelength as the 550nm of green component, the reflectance spectrum sensitivity of polyimide layer is 0.1%, and the reflectance spectrum sensitivity of copper is 3%, and obtains 30 times reflection from experiment value.When the light that extracts by this way during, obtained the image of the wiring pattern of its superiors' wiring pattern information imagery by 31 imagings of CCD device.In other words, owing to depend on copper and polyimide by the intensity of the light component of workpiece 51 reflection, and copper has stronger reflection strength, so the imaging brightly of the superiors' copper pattern part.When irradiation workpiece 51, polarisation shines wiring pattern and polyimide insulative layer than increasing, and correspondingly picks up the clearer image of the superiors' wiring pattern.
This principle will describe with reference to Fig. 4 A and 4B below.That is, extract the linearly polarized photon Y that its electric field intensity direction is in the front/rear direction among Fig. 2
1, and from by the light of light guide 11 guiding to its channeling conduct, wherein light guide 11 is through guiding the light L from light source 10 abreast with the polarization plates of a lot of grades of combinations or polarizing beam splitter.Fig. 4 A and 4B illustrate wherein linearly polarized photon Y
1Example by polarizing beam splitter 21 extractions and guiding.
And, light is directed to polarization plates 65, with respect to linearly polarized photon Y
1Optical axis with the described polarization plates of arbitrarily angled adjusting.Be 45 to spend with respect to the polarization plates best angle of linearly polarized photon Y1 (best angle that is formed by the transmission axle of the front/rear direction of Fig. 2 and polarization plates 65) this moment.Therefore, the effect under 45 degree conditions will be explained below.
In addition, the light that has been adjusted to polarization plates 65 transmission of 45 degree by its optical axis constitute by with
Times resolution of vectors incident linearly polarized photon Y1 and the component that obtains.Use this
Linearly polarized photon Y
2 Shine wiring pattern 69 wherein and be arranged on workpiece 51 in the substrate 67 of polyimide film insulating material etc.
Shown in Fig. 4 A, should when using
Linearly polarized photon Y
2During the wiring pattern 69 of irradiation copper etc., incident is reflected on the surface of the wiring pattern 69 by the copper that formed by copper electroplanting device etc. etc. simply
Linearly polarized photon Y
2And, be reflected
Linearly polarized photon Y
3Once more by polarization plates 65.At this moment, about light Y by polarizing beam splitter 21
4, by what will reflect by workpiece 51
Linearly polarized photon Y
3Carry out once more
The component that resolution of vectors obtains passes through above polarizing beam splitter 21.This light component Y5 is received by CCD device 31 as the component of the information of the wiring pattern 69 with the superiors.
Equally, shown in Fig. 4 B, with being somebody's turn to do
Linearly polarized photon Y
2The transparent basement membrane 67 of irradiation polyimide film insulating material etc.See that this transparent basement membrane 67 has anisotropy on material property.In other words, suggestion as polarized light or at random light be reflected into and be mapped on the transparent basement membrane 67
Linearly polarized photon Y
2, wherein the surface by film changes for it increases angle.Because the light Y of reflection
3' depart from the angle of polarization plates 45 degree, to such an extent as to so the light quantity of light with degree like this compare with 0.5 the relative light quantity that when 45 spend, receives by CCD device 31 and receive light hardly.That is it is poor, to form the light quantity that is received by CCD device 31 between the situation of the transparent basement membrane 67 of the situation of the wiring pattern 69 of irradiation copper etc. and irradiation polyimide insulative part.Should be hardly the information component corresponding to the transparent basement membrane 67 of polyimide film insulating material etc. be directed to CCD device 31.
Therefore,, and when receiving, can be used as image pickup the superiors wiring pattern information and do not reflect the internal layer wiring pattern simultaneously according to the material behavior that forms semiconductor packages and information extraction well when by this way with high-contrast by CCD device 31.
And, Fig. 6 A illustrates an image, this image illustrates the multilayer wiring substrate about semiconductor packages, after obtaining the superiors' wiring pattern information by inspection unit 100, wherein there are three layers of internal layer wiring pattern about the superiors' wiring pattern in an example of the superiors' wiring pattern that is picked up by sensor camera 30 through polyimide insulative layer on described wiring substrate.On the other hand, Fig. 6 B illustrates the image that picks up by camera usually about identical the superiors wiring pattern.
Can confirm optically to obtain the wiring pattern information of the superiors from Fig. 6 A and 6B by inspection unit 100, correspondingly, even under the situation that has three layers of internal layer wiring pattern, also can clearly extract the superiors' wiring pattern.Can extract unique the superiors' wiring pattern and no matter the existence of wiring pattern is irrelevant with the quantity that increases internal layer.
On the other hand, shown in Fig. 6 B, the wiring pattern of all layers of reflection in be generally picture by camera.In addition, because the superiors' wiring pattern has the brightness identical with the internal layer wiring pattern, even therefore for example carrying out also can not separating this figure when scale-of-two is handled.Especially, influence clearly in the part that the superiors' wiring figure and internal layer wiring figure intersect therein, and be not easy to discern the figure that is present in the top side.
And, Fig. 7 A illustrates an image, this image illustrates the multilayer wiring substrate about semiconductor packages, wherein there is one deck internal layer wiring pattern about the superiors' wiring pattern in another example of the superiors' wiring pattern that picks up after obtaining the superiors' wiring pattern information by inspection unit 100, by CCD device 31 through polyimide insulative layer in described wiring substrate.The line that Fig. 7 B illustrates corresponding to the part of the wiring pattern shown in the image among Fig. 7 A distributes.Fig. 8 illustrates by carry out scale-of-two with respect to the image shown in Fig. 7 A and handles the image that obtains.
Find out obviously that from Fig. 8 the superiors' wiring pattern partly becomes clear, and interior layer pattern and the very secretly imaging of polyimide insulative layer part.Like this, the image that is picked up by inspection unit 100 can be further divided into the superiors' wiring pattern and internal layer wiring pattern by the simple image processing that is called as the scale-of-two processing, is not subjected to the influence of internal layer wiring pattern simultaneously.And, cad data (design information) or gratifying workpiece (wherein correctly having formed the workpiece of wiring pattern) set in advance and are the reference master image, and can by compare with binary picture, feature extraction method etc. and the part that will have a difference is judged as defective.
And the optimized image that is used for the pattern inspection is represented that pattern edge wherein is very clear and is not had the state of any influence of surface irregularity.Contrast difference between wiring pattern part and the polyimide insulative layer part must clearly be cut apart, and should be clearly so that make pattern edge.Therefore, must be very big with light quantity of its irradiation workpiece, and workpiece must become clear, so that eliminate the influence of wiring pattern surface irregularity.
The transmission axle that Fig. 9 is illustrated in Polarization filter 34 has changed a histogrammic example of the wiring pattern image under the situation of predetermined angular in the electric field intensity direction of first linearly polarized photon, wherein horizontal ordinate is represented grade point, the quantity of ordinate remarked pixel.The condition of histogram peak excursion on high-grade side is the rotation angle of 40 to 50 degree, and can be sure of that the area of comparing histogrammic peak value with the other anglec of rotation has also reduced on this anglec of rotation.
Polyimide insulative layer part or wiring pattern part in the rate range at this peak value on the other anglec of rotation, have been comprised.Yet wiring pattern partly has greatest level when near best angle.Therefore, the wiring pattern part is separated from the area of peak value, and peak area reduces.Can be sure of also from the image that picks up in each anglec of rotation that equally top condition is the anglec of rotation in the scopes of 40 to 50 degree, wherein wiring pattern partly is very clearly under this top condition, and the contrast difference between wiring pattern part and the polyimide insulative layer part is very big.
On other rotation angle, the grade point of wiring pattern part reduces, and correspondingly, the contrast difference between wiring pattern part and the polyimide insulative layer part reduces.Thereby the grade point of wiring pattern part descends, and the influence of the scrambling on wiring pattern surface also obviously occurs.Therefore, this image is not suitable as the pattern check image.The image of all angles component is shown in Fig. 5 A and 5E.
As mentioned above, in wiring pattern checkout facility according to present embodiment, the influence that can in the multilayer wiring substrate of semiconductor packages, optically remove the internal layer wiring pattern by above-mentioned functions.The result is to pick up the precise image of the superiors' wiring pattern.
In addition, when this image and reference data or reference picture compare, can automatically carry out the inspection of wiring pattern with high reliability.
And, when the line sensor technology is applied to sensor camera 30, compare with the situation that obtains image by application point scanning, captured image at short notice, for example, as among the Jpn.Pat.No.2962565.Therefore, this technology even also be favourable for having large-area the superiors wiring pattern.
In addition,, therefore detection system needn't be set doubly owing to can in the image basis of picking up, check wiring pattern by sensor camera 30, as among the Jpn.Pat.No.2962565, and can simplified construction.In addition, because the data processing of detected value has also reduced, therefore can reduce the load of calculation control unit 40.
Second embodiment
Introduce the second embodiment of the present invention below with reference to Fig. 2 and 10-12.
Relate to improvement according to the wiring pattern checkout facility of present embodiment according to the polarizing beam splitter 21 in the inspection unit 100 of the wiring pattern checkout facility of first embodiment.Therefore,, polarizing beam splitter 21 will only be described here.
That is, in first embodiment of Fig. 2, polarizing beam splitter 21 extracts linearly polarized photon (the front/rear direction among the figure is the electric field intensity direction) from the light at random of light source 10 emissions.Yet wherein the vertical direction among Fig. 2 is that the light component of electric field intensity direction is run away to the side from polarizing beam splitter 21 when extracting, so this side is under the high temperature.
Therefore, in the time of can recovering, be converted to its electric field intensity direction at this light component and be the light component of the front/rear direction among the figure and it is directed to polarizing beam splitter 22, light quantity further increases, and can enlarge the contrast difference between wiring pattern part and the polyimide insulative layer part.
Figure 10 is the skeleton view of an example that the whole structure of the polarizing beam splitter 21 that is used to realize present embodiment is shown.
That is, as shown in figure 10, the polarizing beam splitter 21 of present embodiment comprises polarizing coating 21a, in addition, thin slice prism 23 (#R) and thin slice prism 23 (#L) is set on the opposite flank.Half-wave plate 24 is set up.
That is, when will be at random light when light source 10 is introduced polarizing beam splitters 21, extracting its electric field intensity direction by polarizing beam splitter 21 from light at random is the light component Y of the front/rear direction among the figure, and it is directed to polarizing beam splitter 22.On the other hand, when this extracted, its electric field intensity direction was that the light component T of the vertical direction among Fig. 2 escapes from from the side, and is introduced into thin slice prism 23 (#R).Thin slice prism 23 (#R) reception has escaped from and its electric field intensity direction is the light component T of the vertical direction among Fig. 2, and this component is directed to half-wave plate 24.Half-wave plate 24 is the light component T of electric field intensity direction by half-wavelength conversion its vertical direction from thin slice prism 23 (#R) introducing and Fig. 2.In other words, this component is converted to light component Z, its electric field intensity direction be among the figure the right side/left to, and it is directed to thin slice prism 23 (#L).Thin slice prism 23 (#L) is directed to light component Z in the polarizing beam splitter 21 from the side, wherein from its electric field intensity direction of half-wave plate 24 guiding be the figure the right side/left to.Polarizing coating 21a reflected light component Z, wherein by this way the guiding its electric field intensity direction be among the figure the right side/left to, correspondingly, this component is converted to light component Y, its electric field intensity direction is the front/rear direction among the figure, and this component is guided out polarizing beam splitter 22.
Figure 11 is the skeleton view of example that the unitary construction of the polarizing beam splitter 21 of carrying out identity function is shown.
In structure shown in Figure 11, polarizing beam splitter 21 comprises polarizing coating 21a, in addition, on the side of the polarizing coating 21a of non-reflecting surface one side, completely reflecting mirror 26 (#L) is set, and on the side of the polarizing coating 21a of reflecting surface one side, quarter wave plate 25 and completely reflecting mirror 26 (#R) is set.
That is, will light is incorporated into the polarizing beam splitter 21 at random from light source 10 time, extracting its electric field intensity direction from light at random be the light component Y of the front/rear direction among the figure, and it is directed in the polarizing beam splitter 22.On the other hand, when this extracted, its vertical direction among Fig. 2 was that the light component T of electric field intensity direction escapes from from the side, and through quarter wave plate 25 it is directed to completely reflecting mirror 26 (#R).
Completely reflecting mirror 26 (#R) reflected light component T, its vertical direction among Yin Dao Fig. 2 is the electric field intensity direction by this way, and correspondingly through quarter wave plate 25 this component is incorporated in the polarizing beam splitter 21.Thereby, from polarizing beam splitter 21 escape from and Fig. 2 its vertical direction be that twice of the light component T of electric field intensity direction is by quarter wave plate 25, and therefore enter polarizing beam splitter 21 as light component Z, the electric field intensity direction of described light component Z be among the figure the right side/left to.
In addition, its electric field intensity direction be among Fig. 2 the right side/left to light component Z by polarizing coating 21a, come out once from polarizing beam splitter 21, and arrive completely reflecting mirror 26 (#L).And this component is carried out polarizing beam splitter 21 afterwards once more, and is reflected by polarizing coating 21a by completely reflecting mirror 26 (#L) reflection.Correspondingly, this component is converted to the light component Y that its electric field intensity direction is the front/rear direction among the figure, and it is directed in the polarizing beam splitter 22.
Figure 12 be illustrated in that situation (a), polarizing beam splitter 21 that polarizing beam splitter 21 is set separately comprise that as shown in figure 10 thin slice prism 23 and the situation (b) of half-wave plate 24 and polarizing beam splitter 21 comprises under as shown in figure 11 the completely reflecting mirror 26 and the situation (c) of quarter wave plate 25, in the view data of picking up under the same conditions along the distribution plan of the rank difference of the free-throw line of wiring pattern part.
Almost can't see difference at (a) with (b), but can confirm maximum about 20% contrast amplification effect (brightness of wiring pattern part and insulation course part enlarges) at (a) with (c).
In wiring pattern checkout facility according to present embodiment, as mentioned above, not only the light component Y that extracts and have the electric field intensity direction that is the front/rear direction among the figure by polarizing beam splitter 21, and by its vertical direction among Fig. 2 being electric field intensity and to have be that the light component Y that the light component T conversion of electric field intensity direction of the front/rear direction among the figure comes guides polarizing beam splitter 22.Thereby, owing to the light that can be used to expeditiously, therefore can increase light quantity from light source 10.The result is owing to the contrast difference that can enlarge between wiring pattern part and the polyimide insulative layer part, therefore can more clearly carry out imaging to the superiors' wiring pattern.
The 3rd embodiment
To 22B the third embodiment of the present invention is described with reference to Figure 13 below.
Present embodiment relates to the improvement according to the inspection unit 100 of the wiring pattern checkout facility of first embodiment.Therefore,, inspection unit will only be described here.
Figure 13 is the structure key diagram that illustrates according to an example of the inspection unit of the wiring pattern checkout facility of present embodiment.
That is, comprise that according to the inspection unit in the wiring pattern checkout facility of present embodiment directional light guide member 56, light extraction features 58, wavelength alternative pack 60, workpiece fix/driving mechanism 50 and calculation control unit 40.
In addition, as shown in figure 14, directional light guide member 56 comprises light source 10, light guide 11, hot line cutting wave filter 13, collector lens 17, diffusing panel 18, collector lens 19 and fan 20.
Enter collector lens 17 from the light of light source 10 emissions through light guide 11 and hot line cutting wave filter 13.And collector lens 17, diffuser plate 18 and collector lens 19 are converted to even directional light with this light, afterwards it are directed to light extraction features 58.It should be noted that each collector lens 17 and 19 is not limited to single lens, and can be the lens combination that comprises a plurality of lens.
The light that is directed to light extraction features 58 must be even directional light.This is because the characteristic of the optical polarization parts that use in light extraction features 58 very delicately, especially depends on angle of light, and influences desirable wavelength characteristic greatly under the situation with the light light incident in addition that is exerted into firing angle.
For example, when polarizing beam splitter 68 (in the back describe in detail) when putting on light extraction features 58, when incident is tested at 68 pairs 40 degree of the polarizing beam splitter with this 45 metric lattice incident angle, in the wavelength region may of using, obtain the experiment value that 2% light reduces.When test 50 degree incidents, light reduces 38%.Correspondingly, in imaging viewing field, produce gradient curve (shade) with big brightness.
The image that wherein has this big gradient curve is carried out various Flame Image Process and identification processing, and this has caused the increase of the time of the processing of being undertaken by calculation control unit 40.And, when having the defective of same type, for example, owing to have gradient curve and, exist in the risk that creates a difference on the mode of the defective of observing appropriate section or contrast in the middle part and the end of image.Therefore, must give one's full attention to the structure of collector lens 17, collector lens 19 and the diffusing panel 18 of explanation subsequently in such a way, must be even directional light to such an extent as to be directed to the light of light extraction features 58.
Must consider especially all sidedly that heat resisting temperature selects diffusing panel 18, and this diffusing panel 18 is realized being set to uniform function from the emission light quantity distribution of light guide 11.Holographic diffuser is as the most effective optics as diffusing panel, but has difficulty aspect thermotolerance.Therefore, cat's eye is suitable under the situation of superior heat resistance needing.
And, generally speaking, be tending towards deepening from the middle part of the emission light quantity distribution of the end of light guide 11.Obtain effect from experiment,, make the angles of lamp (not shown) inclination 5 to 6 degree in the light source 10 wherein in order to reduce the trend of middle part deepening.
Light extraction features 58 has as at the upstanding portion structure as shown in Figure 15 A any one figure in the 15D.This part is extracted linearly polarized photon (supposing that the front/rear direction the figure is the electric field intensity direction) from the incident light at random by 56 guiding of directional light guide member, further this light is converted to circularly polarized light, shines workpiece 51 afterwards.That is, in 15D,, and be arranged on workpiece 51 below the light extraction features 58 with the circularly polarized light irradiation from the right side of light extraction features 58 guiding incident light at Figure 15 A.
The light extraction features 58 that constitutes shown in Figure 15 A comprises: polarization plates 61, its transmission axle are the front/rear directions among the figure; Half-reflecting mirror 62; Quarter wave plate 64; And polarization plates 66, its transmission axle be among the figure the right side/left to.In this case, its transmission axle is in polarization plates 61 light component that its electric field intensity direction of extraction is the front/rear direction among the figure from the incident light that the right side by figure guides of the front/rear direction among the figure.The light component that its electric field intensity direction is the front/rear direction among the figure is converted to circularly polarized light by quarter wave plate 64 afterwards by half-reflecting mirror 62 reflection downwards in the drawings, thus irradiation workpiece 51.This circularly polarized light is reflected by workpiece 51, and constitutes the circularly polarized light of its sense of rotation counter-rotating.This reflected light by quarter wave plate 64 be converted to its electric field intensity direction be among the figure the right side/left to light component.In addition, by after the half-reflecting mirror 62, the ratio of linear polarization light component further increases owing to polarization plates 66, afterwards light is directed to wavelength alternative pack 60 at light.
Light extraction features 58 shown in Figure 15 B comprises polarizing beam splitter 68 and quarter wave plate 64.In this case, the light component that polarizing beam splitter 68 extracts its electric field intensity direction from the incident light that is guided by the right side the figure be the front/rear direction among the figure, and the light component that is the front/rear direction among the figure with its electric field intensity direction further is incorporated in the quarter wave plate 64.Its electric field intensity direction is that this light component of the front/rear direction among the figure is converted to circularly polarized light by quarter wave plate 64, thus irradiation workpiece 51.This circularly polarized light is reflected by workpiece 51, and constitutes the circularly polarized light of its sense of rotation counter-rotating.This reflected light by quarter wave plate 64 be converted to its electric field intensity direction be among the figure the right side/left to light component.By after the polarizing beam splitter 68, light is directed to wavelength alternative pack 60 further at light.
Light extraction features 58 shown in Figure 15 C comprises polarizing beam splitter 70, polarizing beam splitter 68 and quarter wave plate 64.Close shown in the skeleton view that ties up to Figure 16 position between the polarizing beam splitter 70 and 68.In this case, polarizing beam splitter 70 is from by the light component that to extract its electric field intensity direction in the incident light of right side guiding the figure be the front/rear direction among the figure, and light is directed to polarizing beam splitter 68 further.Polarizing beam splitter 68 these linearly polarized photons of reflection, and allow light to enter quarter wave plate 64.This linearly polarized photon is converted to circularly polarized light by quarter wave plate 64, thus irradiation workpiece 51.This circularly polarized light is reflected by workpiece 51, and constitutes the circularly polarized light of its sense of rotation counter-rotating.This reflected light by quarter wave plate 64 be converted to its electric field intensity direction be among the figure the right side/left to light component.By after the polarizing beam splitter 68, light further is directed to wavelength alternative pack 60 at light.
Light extraction features 58 shown in Figure 15 D comprises polarization plates 61, polarizing beam splitter 68 and quarter wave plate 64.In this case, polarization plates 61 is from by the light component that to extract its electric field intensity direction in the incident light of right side guiding the figure be the front/rear direction among the figure, and light is directed to polarizing beam splitter 68.Polarizing beam splitter 68 these linearly polarized photons of reflection also allow light to enter quarter wave plate 64.In this process, also removed the impure composition that is included in the incident light.Correspondingly, the linearly polarized photon with higher degree is directed to quarter wave plate 64.
This linearly polarized photon is converted to circularly polarized light by quarter wave plate 64, thus irradiation workpiece 51.This circularly polarized light is reflected by workpiece 51, and constitutes the circularly polarized light of its sense of rotation counter-rotating.This reflected light by quarter wave plate 64 be converted to its electric field intensity direction be among the figure the right side/left to light component.By after the polarizing beam splitter 68, light further is directed to wavelength alternative pack 60 at light.
Wavelength region may, extinction ratio, the polarisation ratio that applies, the outer shape size that can shine whole work-piece visual field or formation image etc. be must take into full account and these polarization plates 61, half-reflecting mirror 62, quarter wave plate 64, polarization plates 66, polarizing beam splitter 68 and polarizing beam splitter 70 selected.The light component of its irradiation workpiece 51 of no use is run away to the sidewall in the lens tube, and this depends on structure, and therefore refractory plate or air cooling machine structure are set in sidewall sections.
As shown in figure 17, wavelength alternative pack 60 comprises that sensor camera 30, CCD device 31, bandpass filter 32, heart image-side image far away form lens 36 and heart subject side image far away forms lens 38.
That is, use circularly polarized light to form lens 38 irradiation workpiece 51 through heart subject side image far away from light extraction features 58.And, by the reflected light that obtains by workpiece 51 reflection circle polarized lights by light extraction features 58 through heart subject side image far away form lens 38 be converted to its electric field intensity direction be among the figure the right side/left to light component, form lens 36 through heart image-side image far away afterwards and constitute directional light, by light extraction features 58, enter bandpass filter 32 then.
It should be noted, in the present invention, be not limited to the wholecircle polarized light with its light that shines workpiece, and also can use elliptically polarized light, as long as mainly observe the wiring pattern of the superiors of workpiece.
Then, the operation according to the inspection unit of the wiring pattern checkout facility of present embodiment that constitutes will be described as mentioned above below.
That is, in inspection unit, when from light source 10 visible emitting or laser, light is directed to collector lens 17 through light guide 11 and hot line cutting wave filter 13.In addition, after light is converted to even parallel beam by collector lens 17, diffusing panel 18 and collector lens 19, light is directed to light extraction features 58.
Although light guide 11 is carried air by fan 20, and cooled off guide before the temperature that arrives functional deterioration by the light heating from light source 10.
The light that is directed to light extraction features 58 further is converted to circularly polarized light, thereby irradiation workpiece 51 wherein extracts linearly polarized photon (the front/rear direction among the figure is the electric field intensity direction) from the described light that is directed to light extraction features 58 in light extraction portion parts 58.
Form this circularly polarized light irradiation workpiece 51 of lens 38 usefulness through heart subject side image far away, and light is by workpiece 51 reflections.After forming lens 38 by heart subject side image far away, reflected light by light extraction features 58 be converted to its electric field intensity direction be among the figure the right side/left to light component, and form lens 36 through heart image-side image far away and be converted into directional light.By after the polarizing beam splitter 22, light is directed to bandpass filter 32.
In bandpass filter 32, extract the wavelength region may of the difference maximum between the reflection light quantity of the reflection light quantity wherein make the superiors' wiring pattern and polyimide insulative layer part, and only the light of this wavelength region may is incorporated in the CCD device 31 in the sensor camera 30.Specifically, in the wavelength as the 550nm of green component, the reflectance spectrum sensitivity of polyimide layer is 0.1%, and the reflectance spectrum sensitivity of copper is 3%, and obtains 30 times of reflections from experiment value.
Therefore, when by 30 pairs of incident light imagings of sensor camera, obtain the image of wiring pattern, wherein obtained the superiors' wiring pattern information.That is, owing to depend on copper and polyimide by the circular polarization light intensity of workpiece 51 reflection, and copper has stronger reflection strength, so the imaging brightly of the superiors' wiring pattern part.It should be noted that when with circularly polarized light irradiation workpiece 51, polarisation shines wiring pattern and polyimide insulative layer, and correspondingly, more clearly picks up the image of the superiors' wiring pattern than increasing.
This principle describes with reference to Fig. 4 C and 4D.In other words, extract the linearly polarized photon y of the front/rear direction of its electric field intensity direction in Fig. 2
1, and it being guided from the light by light guide 11 guiding, described smooth guide 11 is through guiding the light L from light source 10 abreast with the polarization plates of multistage combination or polarizing beam splitter.Fig. 4 C and 4D illustrate wherein linearly polarized photon y
1Example by quarter wave plate 64 extractions and guiding.
Linearly polarized photon y
1By quarter wave plate 64, and because optical characteristics and correspondingly be converted into circularly polarized light y
2, and with this circularly polarized light y
2Irradiation comprises the wiring pattern 69 of the substrate 67 of polyimide film insulating material.
Shown in Fig. 4 C, when with this circularly polarized light y
2During the wiring pattern 69 of irradiation copper etc., reflect simply as circularly polarized light y
3Incident circularly polarized light y
2, this circularly polarized light y
3Sense of rotation reverse by the surface of the wiring pattern 69 of the copper that forms by copper electroplanting device etc. etc.And, as the circularly polarized light y of reflection
3During once more by quarter wave plate 64, light is converted to linearly polarized photon y
4, this linearly polarized photon y
4On the optical characteristics with incident linearly polarized photon y
1Intersect vertically.The linearly polarized photon y of conversion
4On the optical characteristics of polarizing beam splitter 21, pass through up, and as the component y with the superiors' wiring pattern information
5Receive by CCD device 31.
Equally, shown in Fig. 4 D, with this circularly polarized light y
2The transparent basement membrane 67 of irradiation polyimide film insulating material etc.See that transparent basement membrane 67 has anisotropy on material behavior.That is, reflection is as the circularly polarized light y in the transparent basement membrane 67 of being incorporated into of elliptically polarized light y3 '
2, the phase differential of this elliptically polarized light produces on the surface of described film.And, when elliptically polarized light y3 ' once more when the quarter wave plate 64, according to the ellipticalness of elliptically polarized light, light be converted to have azimuthal linearly polarized photon y4 '.This linearly polarized photon y4 ' is owing to the optical characteristics (in fact, only being transmitted in the vector-decomposition component y5 ' that passes through polarizing beam splitter 21 tops from the component that is converted to linearly polarized photon y4 ' by quarter wave plate 64) of polarizing beam splitter 21 is passed through from the top hardly.In other words, will be directed to CCD device 31 corresponding to the information component of the transparent basement membrane 67 of polyimide film insulating material hardly.
Therefore, when by this way according to the material behavior information extraction well that forms semiconductor packages, and receive the light time by CCD device 31, do not reflect any internal layer wiring pattern, and can be used as image pickup the superiors wiring pattern information with high-contrast.
Figure 18 A illustrates an image, this image illustrates the multilayer wiring substrate about semiconductor packages, wherein there is one deck internal layer wiring pattern with respect to the superiors' wiring pattern in the example of the superiors' wiring pattern that is picked up by sensor camera 30 after obtaining the superiors' wiring pattern information by inspection unit 100 through polyimide insulative layer on described substrate.On the other hand, Figure 18 B illustrates an image, and this image illustrates the example of the superiors' wiring pattern that the multilayer wiring substrate about semiconductor packages picks up equally, has three layer patterns on described substrate.
Obviously find out from Figure 18 A and 18B, even under the situation that has one deck internal layer wiring pattern, or exist under three layers the situation, can be sure of only to extract brightly the superiors' wiring pattern.In other words, the quantity of inner tube layer is not only extracted the superiors' wiring pattern.
And, Figure 19 A illustrates an image, this image illustrates about the superiors' wiring pattern by picking up the example of the superiors' wiring pattern that the multilayer wiring substrate of semiconductor packages obtains through polyimide insulative layer by inspection unit, wherein has one deck internal layer wiring pattern on described substrate.On the other hand, Figure 19 B illustrates by the image to Figure 19 A and carries out the image that scale-of-two is handled acquisition.
As finding out from Figure 19 B, when the image that is picked up by inspection unit further is called as the simple process of binarization, the superiors' wiring pattern imaging gets brighter, and that interior layer pattern and the imaging of polyimide insulative membrane portions get is darker, can obtain its superiors' wiring pattern and the other clear image of distinguishing of part.This binarization has another advantage: can reduce image data amount, and can carry out high speed image and handle.
And, in advance cad data (design information) or gratifying workpiece (wherein correctly forming the workpiece of wiring pattern) are set to reference to master image, and the part with difference can be judged as defective by compare with the binarization image, feature extraction method etc.
In addition, the optimized image of pattern inspection is represented that pattern edge wherein is very clear and is not had the state of any influence of surface irregularity.Contrast difference between wiring pattern part and the polyimide insulative layer part must clearly be cut apart, so that make pattern edge clear.Therefore, must be very big with light quantity of its irradiation workpiece, and workpiece must become clear, so that eliminate the influence of wiring pattern surface irregularity.
Figure 20 be illustrated in shown in Figure 15 C and 16 polarizing beam splitter 70 and the situation (curve among the figure (d)) of polarizing beam splitter 68 tandem compounds like that and shown in Figure 15 D like that polarizing beam splitter 68 with 61 combinations of lateral wave polarization plates so that the situation (curve among the figure (e)) that improves the polarization efficiency in the light extraction features 58 example distributing of the line of imaging viewing field Width down.
As from the curve the figure (d) is seen, the incident angle of end departs from 45 degree with respect to the polarizing beam splitter with incident angle 45 degree indexs.In other words, under the situation of such polarizing beam splitter 70 and polarizing beam splitter 68 tandem compounds shown in Figure 15 C, and collector lens 12 does not form completely parallel incident light like that shown in Figure 21 A, for example, shown in Figure 21 B, in the opposite ends of polarizing beam splitter 68 incident angle depart from 45 the degree (Figure 21 B illustrates, as an example, incident light enters the upper end of polarizing beam splitter 68 with the angles of 49 degree, and the incident light situation that enters the bottom with the angles of 41 degree).The opposition side of imaging viewing field Width is dark in the extreme owing to rely on incident angle, and must say that in this state the binarization by single threshold value is difficult.When the distance between collector lens 12 and the polarizing beam splitter 68 increased, the side-play amount with respect to the incident angle that applies in opposite ends increased.Therefore, when between collector lens 12 and polarizing beam splitter 68, polarizing beam splitter 70 being set, owing in opposite ends, be tending towards increasing with respect to the skew of the incident angle that applies dependence to incident angle.
On the other hand, when the thin polarization plates 61 of ratio polarization beam splitter 70 being set replacing polarizing beam splitter 70 shown in Figure 15 D, shown in Figure 22 A and 22B, can reduce the distance between collector lens 12 and the polarizing beam splitter 68.Therefore, even do not form completely parallel incident light by collector lens 12, compare with using polarizing beam splitter 70, the skew with respect to the incident angle that applies in opposite ends is not very big.Therefore, as from the curve the figure (e) is seen, descend and be subjected in opposite ends influence with respect to the skew of the incident angle that applies by using polarization plates 61 can improve grade point.Figure 22 A illustrates the situation that forms completely parallel incident light by collector lens 12.Figure 22 B illustrates by collector lens 12 and does not form completely parallel incident light, but with respect to the skew of the incident angle that an applies example under the very little situation in the opposite ends of polarizing beam splitter 68.
It should be noted,, also can carry out clearly imaging by a wiring pattern the superiors even use Polarization filter 34 (polarization plates) replaces the quarter wave plate shown in Figure 15 A and 15D.
The front with reference to description of drawings be used to implement best mode of the present invention, but the invention is not restricted to this structure.Any those skilled in the art can expect various modifications and variations in the scope of the invention technical conceive of Patent right requirement, and should be appreciated that these modifications and variations belong to technical scope of the present invention.
Industrial applicibility
According to the present invention, optically eliminated internal layer from the multilayer wiring substrate of semiconductor packages The impact of wiring pattern, and can imaging go out the height precise image of the superiors' wiring pattern.
As mentioned above, can realize checkout facility, inspection method, the checkout equipment of wiring pattern And detection method, highly reliably automatic inspection wiring pattern.
And, when the line sensor technology puts on imaging device, even for having large tracts of land Also captured image at short notice of the superiors' wiring pattern, and can simplified construction.
Claims (27)
1, a kind of wiring pattern checkout equipment, this equipment optically detects the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises:
Light source;
The directional light guiding device is used for the light guiding from light source is substantially parallel light;
First extraction element is used for extracting first linearly polarized photon from the light of directional light guide means guide, and the electric field intensity direction of this first linearly polarized photon and the channeling direction of described light intersect vertically;
The circularly polarized light conversion equipment, first linearly polarized photon that is used for being extracted by first extraction element is converted to circularly polarized light;
Irradiation unit is used to the circularly polarized light irradiation workpiece by the conversion of circularly polarized light conversion equipment;
Second extraction element is used for extracting second linearly polarized photon from the reflected light that is obtained by the circularly polarized light of irradiation unit emission by described workpiece reflection, and the electric field intensity direction and first linearly polarized photon of this second linearly polarized photon intersect vertically;
Selecting arrangement is used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Selected wavelength light is divided amount guide device, is used for guiding the light component in the wavelength region may of being selected by selecting arrangement; And
Image pick-up device is used for second linearly polarized photon that is extracted by second extraction element is carried out imaging.
2, a kind of wiring pattern checkout equipment, this equipment optically detects the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises:
Light source;
The directional light guiding device is used for and will be basically directional light from the guiding of the light of light source;
Polarizing beam splitter, be used for from by extracting first linearly polarized photon the light of directional light guide means guide, the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically, and first linearly polarized photon that guiding is extracted on this polarizing beam splitter direction of also being used for intersecting vertically at the light channeling direction with the electric field intensity direction of first linearly polarized photon;
Quarter wave plate will be converted to circularly polarized light by first linearly polarized photon of polarizing beam splitter guiding;
Irradiation unit is used to the circularly polarized light irradiation workpiece by the quarter wave plate conversion;
Selecting arrangement is used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Selected wavelength light is divided amount guide device, is used for guiding the light component in the wavelength region may of being selected by selecting arrangement; And
Image pick-up device,
Wherein the circularly polarized light by the irradiation unit emission is reflected by workpiece, thereby make the sense of rotation counter-rotating, transmit by quarter wave plate afterwards, extract second linearly polarized photon that its electric field intensity direction and first linearly polarized photon intersect vertically by polarizing beam splitter, and second linearly polarized photon that extracts is carried out imaging by image pick-up device.
3, a kind of wiring pattern checkout equipment, this equipment can optically detect the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises:
Light source;
The directional light guiding device, it is substantially parallel being used for the light guiding from light source;
First polarizing beam splitter is used for from by extracting first linearly polarized photon the light of directional light guide means guide, and the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically;
Second polarizing beam splitter, first linearly polarized photon that guiding is extracted by first polarizing beam splitter on the direction that intersects vertically at described smooth channeling direction with the electric field intensity direction of first linearly polarized photon;
Quarter wave plate will be converted to circularly polarized light by first linearly polarized photon of second polarizing beam splitter guiding;
Irradiation unit is used to the circularly polarized light irradiation workpiece by the quarter wave plate conversion;
Selecting arrangement is used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Selected wavelength light is divided amount guide device, is used for guiding the light component in the wavelength region may of being selected by selecting arrangement; And
Image pick-up device,
Wherein the workpiece reflection is by the circularly polarized light of irradiation unit emission, thereby make the sense of rotation counter-rotating, transmit by quarter wave plate afterwards, extract second linearly polarized photon that its electric field intensity direction and first linearly polarized photon intersect vertically by second polarizing beam splitter, and second linearly polarized photon that extracts is carried out imaging by image pick-up device.
4, a kind of wiring pattern checkout equipment, this equipment can optically detect the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises:
Light source;
The directional light guiding device, it is substantially parallel being used for the light guiding from light source;
Polarization plates is used for from by extracting first linearly polarized photon the light of directional light guide means guide, and the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically;
Polarizing beam splitter, first linearly polarized photon that guiding is extracted by polarization plates on the direction that intersects vertically at described smooth channeling direction with the electric field intensity direction of first linearly polarized photon;
Quarter wave plate will be converted to circularly polarized light by first linearly polarized photon of polarizing beam splitter guiding;
Irradiation unit is used to the circularly polarized light irradiation workpiece by the quarter wave plate conversion;
Selecting arrangement is used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Selected wavelength light is divided amount guide device, is used for guiding the light component in the wavelength region may of being selected by selecting arrangement; And
Image pick-up device,
Wherein the workpiece reflection is by the circularly polarized light of irradiation unit emission, thereby make the sense of rotation counter-rotating, transmit by quarter wave plate afterwards, extract second linearly polarized photon that its electric field intensity direction and first linearly polarized photon intersect vertically by polarizing beam splitter, and second linearly polarized photon that extracts is carried out imaging by image pick-up device.
5, a kind of wiring pattern checkout equipment, this equipment optically detects the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises:
Light source;
The directional light guiding device, it is substantially parallel being used for the light guiding from light source;
First extraction element is used for extracting first linearly polarized photon from the light by the directional light guide means guide, and the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically;
The polarized component extraction element is used for obtaining the predetermined polarisation component through the polarization plates with predetermined angular from first linearly polarized photon that is extracted by first extraction element;
Irradiation unit is used to the polarized component irradiation workpiece that is obtained by the polarized component extraction element;
Second extraction element, be used for extracting second linearly polarized photon from reflected light, the electric field intensity direction and first linearly polarized photon of this second linearly polarized photon intersect vertically, and described reflected light is to obtain by the polarized component of described workpiece reflection by the irradiation unit emission;
Selecting arrangement is used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Selected wavelength light is divided amount guide device, is used for guiding the light component in the wavelength region may of being selected by selecting arrangement; And
Image pick-up device is used for second linearly polarized photon that is extracted by second extraction element is carried out imaging.
6, a kind of wiring pattern checkout equipment, this equipment optically detects the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises:
Light source;
The directional light guiding device, it is substantially parallel being used for the light guiding from light source;
Polarizing beam splitter, be used for from by extracting first linearly polarized photon the light of directional light guide means guide, the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically, and first linearly polarized photon that guiding is extracted on this polarizing beam splitter direction of also being used for intersecting vertically at described smooth channeling direction with the electric field intensity direction of first linearly polarized photon;
The polarized component extraction element is used for obtaining the predetermined polarisation component through the polarization plates with predetermined angular from first linearly polarized photon by the polarizing beam splitter guiding;
Irradiation unit is used to the polarized component irradiation workpiece that is obtained by the polarized component extraction element;
Selecting arrangement is used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Selected wavelength light is divided amount guide device, is used for guiding the light component in the wavelength region may of being selected by selecting arrangement; And
Image pick-up device,
Wherein extract second linearly polarized photon that its electric field intensity direction and first linearly polarized photon intersect vertically from reflected light by polarizing beam splitter, described reflected light is obtained by the polarized component of described workpiece reflection by the irradiation unit emission, and by image pick-up device second linearly polarized photon that extracts is carried out imaging.
7, a kind of wiring pattern checkout equipment, this equipment can optically detect the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises:
Light source;
The directional light guiding device, it is substantially parallel being used for the light guiding from light source;
First polarizing beam splitter is used for from light extraction first linearly polarized photon by the directional light guide means guide, and the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically;
Second polarizing beam splitter, first linearly polarized photon that guiding is extracted by first polarizing beam splitter on the direction that intersects vertically at described smooth channeling direction with the electric field intensity direction of first linearly polarized photon;
The polarized component extraction element is used for obtaining the predetermined polarisation component through the polarization plates with predetermined angular from first linearly polarized photon by the guiding of second polarizing beam splitter;
Irradiation unit is used to the polarized component irradiation workpiece that is obtained by the polarized component extraction element;
Selecting arrangement is used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Selected wavelength light is divided amount guide device, is used for guiding the light component in the wavelength region may of being selected by selecting arrangement; And
Image pick-up device,
Wherein extract second linearly polarized photon that its electric field intensity direction and first linearly polarized photon intersect vertically from reflected light by second polarizing beam splitter, described reflected light is obtained by the polarized component of workpiece reflection by the irradiation unit emission, and by image pick-up device second linearly polarized photon that extracts is carried out imaging.
8, a kind of wiring pattern checkout equipment, this equipment optically detects the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this equipment comprises:
Light source;
The directional light guiding device, it is substantially parallel being used for the light guiding from light source;
Polarization plates is used for from by extracting first linearly polarized photon the light of directional light guide means guide, and the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically;
Polarizing beam splitter, first linearly polarized photon that guiding is extracted by polarization plates on the direction that is used for intersecting vertically at described smooth channeling direction with the electric field intensity direction of first linearly polarized photon;
The polarized component extraction element is used for obtaining the predetermined polarisation component through the polarization plates with predetermined angular from first linearly polarized photon by the polarizing beam splitter guiding;
Irradiation unit is used to the polarized component irradiation workpiece that is obtained by the polarized component extraction element;
Selecting arrangement is used to select wavelength region may, the difference between the reflection light quantity of the pattern in described wavelength region may beyond the reflection light quantity of the superiors' wiring pattern and the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Selected wavelength light is divided amount guide device, is used for guiding the light component in the wavelength region may of being selected by selecting arrangement; And
Image pick-up device,
Wherein extract second linearly polarized photon that intersects vertically with first linearly polarized photon from reflected light, described reflected light is obtained by the polarized component of workpiece reflection by the irradiation unit emission, and by image pick-up device second linearly polarized photon that extracts is carried out imaging.
9, according to each described wiring pattern checkout equipment in the claim 1 to 8,
Wherein image pick-up device comprises line sensor, and this line sensor is to the predetermined range of linearity continuous imaging in the workpiece, and the range of linearity of continuous terrain imaging is connected to each other, and the plane domain to workpiece carries out imaging thus.
10, according to each described wiring pattern checkout equipment in the claim 1 to 8, wherein the directional light guiding device comprises:
The light guide, guiding is from the light of light source;
Diffusing panel makes the light diffusion from light source keep intensity distributions constant simultaneously;
The parallelization device is used to make the light by the diffusing panel diffusion substantially parallel; And
Be used to guide the device of the directional light that produces by the parallelization device.
11, wiring pattern checkout equipment according to claim 10 comprises:
Infrared filter, this infrared filter is removed infrared component from the light from light source, and this infrared filter is arranged between light source and the light guide, perhaps between light guide and diffusing panel.
12, according to each described wiring pattern checkout equipment in the claim 1 to 8, also comprise:
Be used to cool off the cooling device of directional light guiding device.
13, according to each described wiring pattern checkout equipment in the claim 1 to 8, wherein selected wavelength light divides amount guide device to comprise one or two or more lens, and the light component guiding in described wavelength region may that described lens will be selected by selecting arrangement is parallel with image pick-up device.
14, according to each described wiring pattern checkout equipment in the claim 1 to 8, wherein basement membrane is formed by polyimide resin, and wiring pattern is formed by copper, and selecting arrangement selects to comprise the wavelength region may of 550nm, and image pick-up device comprises CCD.
15,, wherein substitute circularly polarized light irradiation workpiece with elliptically polarized light according to each described wiring pattern checkout equipment in the claim 1 to 4.
16, according to each described wiring pattern checkout equipment in the claim 1 to 8, wherein light source comprises white light source.
17, a kind of wiring pattern checkout facility, comprise: testing fixture, be used for image that is picked up by the image pick-up device according to each described wiring pattern checkout equipment of claim 1 to 16 and the gratifying image of being scheduled to are compared, check thus whether described the superiors wiring pattern is satisfactory.
18, a kind of wiring pattern detection method, this method optically detects the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this method comprises:
The light guiding is substantially parallel directional light guiding step;
From guide first extraction step of light extraction first linearly polarized photon that guides the step at directional light, the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically;
To be converted to the circularly polarized light switch process of circularly polarized light by first linearly polarized photon that first extraction step extracts;
Use irradiating step by the circularly polarized light irradiation workpiece of changing in the circularly polarized light switch process;
Extract second extraction step of second linearly polarized photon from reflected light, the electric field intensity direction and first linearly polarized photon of this second linearly polarized photon intersect vertically, and described reflected light is obtained by the circularly polarized light that workpiece is reflected in the irradiating step emission;
Select the selection step of wavelength region may, the difference in described wavelength region may between the reflection light quantity of the reflection light quantity of the superiors' wiring pattern and the pattern except that the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Guiding is by the selected wavelength light component guiding step of the light component in the wavelength region may of selecting step to select; And
The image pickup step that second linearly polarized photon that is extracted by second extraction step is carried out imaging.
19, a kind of wiring pattern detection method, this method optically detects the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this method comprises:
Be used for the light guiding is substantially parallel directional light guiding device;
From the step by light extraction first linearly polarized photon of directional light guide means guide, the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically by polarization plates;
Use the step of first linearly polarized photon that guiding on the direction that polarizing beam splitter intersects vertically at described smooth channeling direction with the electric field intensity direction of first linearly polarized photon extracted by polarization plates;
Utilize quarter wave plate will be converted to the step of circularly polarized light by first linearly polarized photon of polarizing beam splitter guiding;
Use step by the circularly polarized light irradiation workpiece of quarter wave plate conversion;
Select the selection step of wavelength region may, the difference in described wavelength region may between the reflection light quantity of the reflection light quantity of the superiors' wiring pattern and the pattern except that the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Guiding is by the selected wavelength light component guiding step of the light component in the wavelength region may of selecting step to select; And following steps,
Be transmitted into the circularly polarized light of workpiece so that the sense of rotation counter-rotating by the workpiece reflection, afterwards by quarter wave plate transmission polarized light, thereby and extract second linearly polarized photon by polarizing beam splitter second linearly polarized photon that extracts carried out imaging, the electric field intensity direction and first linearly polarized photon of this second linearly polarized photon intersect vertically.
20, a kind of wiring pattern detection method, this method optically detects the superiors' wiring pattern of workpiece, and this workpiece is included in the multilayer wiring substrate that has the semiconductor packages of wiring pattern on the front/rear at least surface of printing opacity basement membrane, and this method comprises:
The light guiding is substantially parallel directional light guiding step;
From guided first extraction step of light extraction first linearly polarized photon of step guiding by directional light, the electric field intensity direction and the light channeling direction of this first linearly polarized photon intersect vertically;
From first linearly polarized photon that extracts by first extraction step, obtain the polarized component extraction step of predetermined polarisation component through polarization plates with predetermined angular;
Irradiating step with the polarized component irradiation workpiece that obtains by the polarized component extraction step;
Extract second extraction step of second linearly polarized photon from reflected light, the electric field intensity direction and first linearly polarized photon of this second linearly polarized photon intersect vertically, and described reflected light is to obtain by the polarized component of workpiece reflection by the irradiating step emission;
Select the selection step of wavelength region may, the difference in described wavelength region may between the reflection light quantity of the reflection light quantity of the superiors' wiring pattern and the pattern except that the superiors' wiring pattern in second linearly polarized photon greater than predetermined value;
Guiding is by the selected wavelength light component guiding step of the light component in the wavelength region may of selecting step to select; And
The image pickup step that second linearly polarized photon that is extracted by second extraction step is carried out imaging.
21, according to each described wiring pattern detection method in the claim 18 to 20, comprise the steps:
Use line sensor that the predetermined range of linearity in the workpiece is carried out imaging continuously, and the range of linearity of continuous imaging is connected to each other, the plane domain to workpiece carries out imaging thus.
22, according to each described wiring pattern detection method in the claim 18 to 20, wherein directional light guiding step comprises:
Make light diffusion keep the constant diffusion step of intensity distributions simultaneously;
Make by the substantially parallel parallelization step of the light of diffusion step diffusion; And
Guiding is by the step of the directional light of parallelization step generation.
23, wiring pattern detection method according to claim 22,
Wherein directional light guiding step also comprises: the infrared ray of removing infrared composition before the diffusion step from described light is removed step.
24, according to each described wiring pattern detection method in the claim 18 to 20, wherein basement membrane is formed by polyimide resin, wiring pattern is formed by copper, select step to select to comprise the wavelength region may of 550nm, and the image pickup step is come captured image by CCD.
25,, comprise the step that substitutes circularly polarized light irradiation workpiece with elliptically polarized light according to claim 18 or 19 described wiring pattern detection methods.
26, according to each described wiring pattern detection method in the claim 18 to 20, wherein light source comprises white light source.
27, a kind of wiring pattern inspection method, whether comprise the steps: and will compare by image that picks up according to each described wiring pattern detection method in the claim 18 to 26 and the gratifying image of being scheduled to, be gratifying to check described the superiors wiring pattern.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP315833/2002 | 2002-10-30 | ||
| JP2002315833 | 2002-10-30 | ||
| JP162861/2003 | 2003-06-06 |
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| CN1708685A CN1708685A (en) | 2005-12-14 |
| CN100504363C true CN100504363C (en) | 2009-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2003801024272A Expired - Fee Related CN100504363C (en) | 2002-10-30 | 2003-10-29 | Inspection apparatus of wiring pattern, inspection method, detection apparatus, detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7006224B2 (en) * | 2002-12-30 | 2006-02-28 | Applied Materials, Israel, Ltd. | Method and system for optical inspection of an object |
| CN104568765B (en) * | 2014-12-25 | 2017-02-22 | 武汉颐光科技有限公司 | Miniature spectroscopic ellipsometer device and measuring method |
| CN106680298A (en) * | 2016-12-16 | 2017-05-17 | 南京协辰电子科技有限公司 | Printed circuit board (PCB) detection device and PCB detection method |
| CN109813720B (en) * | 2019-02-21 | 2024-04-02 | 苏州市安派精密电子有限公司 | CCD detection device |
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