An integrated circuit chip has full trench dielectric isolation of each portion of the chip. Initially the chip substrate is of conventional thickness and has semiconductor devices formed in it. After etching trenches in the substrate and filling them with dielectric material, a heat...http://www.google.com.au/patents/US5757081?utm_source=gb-gplus-sharePatent US5757081 - Surface mount and flip chip technology for total integrated circuit isolation
Surface mount and flip chip technology for total integrated circuit ...
