METHOD OF MANUFACTURING A
SURFACE MOUNT PACKAGE
CROSS REFERENCE TO RELATED
APPLICATION 5
This application is a continuation-in-part of application Ser. No. 08/774,699, filed Dec. 26, 1996 and a Continuing Prosecution Application filed Feb. 11,1998, pending, which is a continuation of Ser. No. 08/497,565, filed Jun. 30,1995, now issued as U.S. Pat. No. 5,631,193, which is a continuation of application Ser. No. 07/990,334, filed Dec. 11,1992, now issued as U.S. Pat. No. 5,484,959.
BACKGROUND OF THE INVENTION
15
1. Field of the Invention.
This invention relates to a high density, integrated circuit module, which includes a plurality of vertically or horizontally stacked individual surface mount or ball-grid-array integrated circuit packages. 20
2. Brief Description of the Related Technology.
An example of a fabrication method and apparatus for high density lead-on-package modules by laminating one or more lead frames to standard integrated circuit packages is ^ disclosed in U.S. Pat. No. 5,484,959, assigned to the common assignee of the present invention and incorporated herein by reference. Other methods for providing high density, stacked modules are disclosed in U.S. Pat. Nos. 5,279,029, 5,367,766, 5,455,740, 5,450,959 and 5,592,364, all of which are assigned to the common assignee of the present invention and incorporated herein by reference. The general methods and apparatus disclosed in the referenced patents can be applied to the fabrication of stacked configurations comprised of individual ball-grid-array or surface 3J mount packages. However, the characteristic lead orientation, lead shape and lead content of ball-grid-array or surface mount packages impose a different set of parameters not adequately provided for by prior methods and assemblies.
The present invention provides a novel method and apparatus for manufacturing three-dimensional, high density, integrated circuit modules from standard ball-grid-array or 45 other surface mount integrated circuit packages which provides improved space efficiency and heat dissipation. One way to increase space efficiency is to stack individual packages. Generally speaking, higher density generates more localized heat and thus increases the need for efficient 50 heat dissipation. Improving the thermal transfer characteristics of the individual integrated circuit packages results in better heat dissipation for the module, and improves reliability and durability.
The present invention provides a novel method of fabri- 55 eating a three-dimensional module formed of stacked and aligned surface mount or ball-grid-array packages. BallGrid-Array (BGA) integrated circuit packages typically have leads that extend from the bottom surface of a rectangular solid resin casing in a two-dimensional grid pattern. 60 The external portion of each lead is finished with a ball of solder. Package leads provide electrical and thermal coupling to one or more integrated circuit dies that are embedded within the protective casing. Typically, the protective casing completely surrounds the embedded die but, in some 65 BGA packages, the protective casing does not cover the inactive top surface of the die. Near-chip scale packages
provide 1.0 mm center-to-center lead spacing. Chip scale
packaging such as MICRO BGATM have center-to-center
lead spacing of 0.5 mm. Chip scale packaging offers excellent electrical characteristics including low capacitance and thermal design.
Connectivity to the leads of individual packages in a module is provided by thin substantially planar lead carriers located between adjacent packages. Lead carriers are adhered to adjacent packages with a thermally conductive but electrically insulating adhesive. A lead carrier is comprised of elongated electrically and thermally conductive elements formed in one or more thin planes of conductive material that are separated by high-dielectric material. Typically, each conductive element has at least one aperture, adapted to receive and electrically couple to an individual package ball and at least one interconnect lead that extends away from the module to provide external circuit connectivity to package leads. Preferably, the lead carriers are formed from custom flexible circuits commercially available from 3MTM or other manufacturers. These well known flexible circuits are typically comprised of one or more thin layers of conductive material that are die cut and drilled to form ground planes, signal traces, pads and apertures. The conductive layers are typically embedded in and between electrically-insulating, high-dielectric material such as polyamide, polyester or teflon which results in circuits that are flexible, have dense trace, and provide accurate impedance control.
The present invention utilizes standard manufactured packages to form the multi-package module. Such packages typically have ball irregularities or inconsistencies, particularly ball length and solder coating variations. These variations make automated assembly problematic since the tolerances necessary to accommodate variation in ball length and excess solder, for example, do not permit the packages to be assembled within the more stringent requirements for automated assembly of the module. According to one aspect of the present invention, the leads of the ball-grid-array packages are scythed prior to assembly or as an automated step during the assembly. Scything is a method where a hot razor knife skims off a layer from the distal end of all the leads of a ball-grid-array package, reducing random excess lead length and providing a uniform, closely tolerant lead length. The step of scything allows multiple packages to be added to the module prior to a final heating step where the solder for all the packages is flowed. This method also has the advantage of increasing the minimal tolerances for positioning of ball-grid-array package on the lead carrier. An alternative method that may also be used to compensate for excess solder from the leads is to provide channels formed in the walls or edges of each aperture of the lead carrier that receives the ball so the excess solder, when heated, flows into the channels A channel is a void area in a conductive element which merges into the void area of an aperture. An edge of the channel is in close proximity to the package leads and the void area extends away from the leads. Channels take advantage of the surface tension of molten solder which will pull molten solder away from leads to fill the channel.
Another object of the present invention is to provide an assembly which effectively dissipates heat generated during normal operation. Efficient thermal management increases the operational life of the module, and improves reliability by eliminating the effects of elevated temperature on the electrical characteristics of the integrated circuit and packaging. When packages are not stacked, heat from the embedded integrated circuits, generated through normal operation,
is primarily dissipated by convection from the package's external surfaces to the surrounding air. When modules are formed by stacking packages, the buried packages have reduced surface area exposed to the air. The use of thermally conductive adhesive facilitates the transmission of heat 5 between adjacent packages and is an effective method of taking advantage of the exposed surfaces for removing heat from buried packages.
In the module of the present invention, the package leads are thermally coupled to the lead carrier and provide a path 1Q for heat from the embedded integrated circuits. Thermally conductive adhesive also facilitates transfer of heat from packages to the lead carrier.
In applications where it is desirable to reduce the package and module height, or where package or module warping is a concern, each package may be constructed using any of the various techniques described in U.S. Pat. Nos. 5,369,056, 5,369,058 and 5,644,161, each of which is assigned to the common assignee of the present invention and incorporated herein by reference. These patents describe methods for constructing thin, durable packages and modules with 20 enhanced heat dissipation characteristics and minimal warp age.
A common application of a stacked configuration is memory modules. Most of the leads of each package are electrically connected to corresponding leads of adjacent 25 packages. A method is required to select the individual memory package being read, written or refreshed. One method is to provide a custom manufactured lead carrier for each package. A more cost-effective method is to use a common lead carrier design with extra package interconnect 30 leads which is then modified by clipping off or no-connecting selected interconnect leads to make each lead carrier in a stacked configuration unique. Methods for connecting a unique bit of a data word per package and for uniquely addressing each package in a stacked configuration are described in U.S. Pat. Nos. 5,279,029 and 5,371,866, both which are assigned to the common assignee of the present invention and incorporated herein by reference. While the apparatus and methods of the present invention are described herein with reference to standard, single-size packages, it will be appreciated by those of ordinary skill in 40 the art, that those methods and apparatus are equally applicable to multiple-die packages.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a partial cross-sectional view of two adjacent 45 packages of a module of the present invention;
FIG. 2 is a top planar view of a typical lead carrier of the present invention;
FIG. 3a illustrates the preferred embodiment for an aperture for connection with a package lead of the present 50 invention;
FIG. 3b illustrates an alternative embodiment of an aperture for connection with a package lead of the present invention;
FIG. 4 illustrates a horizontally stacked module of the 55 present invention;
FIG. 5 illustrates a vertically stacked module of the present invention;
FIG. 6 illustrates an alternative embodiment of a horizontally stacked module of the present invention; and 60
FIG. 7 illustrates an alternative embodiment of horizontally stacked module of the present invention.
DETAILED DESCRIPTION OF THE
PREFERRED EMBODIMENTS
Other and further objects, features and advantages will be apparent from the following description of the preferred
embodiments of the invention, given for the purpose of disclosure and taken in conjunction with the accompanying drawings.
The letter of a reference character containing numerics followed by a letter, either identifies the relative placement of the referenced element within a stacked module or it identifies a specific embodiment.
Referring now to FIG. 1, a typical ball-grid-array package 50 is comprised of an integrated circuit 51 surrounded by an essentially rectangular solid resin casing 55. Package leads 52 extend from the bottom surface 54 of the casing in a two-dimensional grid pattern providing electrical and thermal coupling to one or more integrated circuit die 51 that are embedded within the protective casing. The external portion of each package lead 52 includes a coating of solder having a semi-spherical shape. Typically, the protective casing 55 completely surrounds the embedded die but, in some ballgrid-array packages 50, the protective casing 55 does not cover the inactive top surface 53 of the die. Near-chip scale packages 50 provide 1.0 mm center-to-center spacing
between leads 52. Chip scale packaging such as MICRO
BGATM have center-to-center lead spacing of 0.5 mm. Chip scale packaging offers excellent electrical characteristics including low capacitance and thermal design.
FIGS. 4 through 7 show various specific embodiments of stacked module M of the present invention. The letter M designates the module M formed of a plurality of ball-gridarray packages 50. Typically, the packages 50 are aligned as shown in FIGS. 4, 5 and 7 where the bottom surfaces 54 of each package 50 are facing the same direction. Alternately, the packages 50 may be aligned where one or more of the packages 50 are inverted in relation to the other packages 50 as shown in FIG. 6. In this embodiment, the top package 50d is inverted with respect to the bottom package 50e; the top surface 53 of the top package 50d is in substantially full contact with the adhesive 70 on the top surface 53 of the lower package 50e.
A typical application of one aspect of the present invention is shown in FIG. 1 which illustrates a partial crosssection of any two adjacent packages 50 that comprise a module M. The internals of package 50fc are not shown for simplicity. FIG. 1 shows two packages 50a and 50fc mounted on opposite sides of a lead carrier 60 comprised of a single thin copper plane. Interconnect leads 64 extend away from the module M to provide external circuit connectivity to package leads 52 of the top package 50fc. External connectivity may be provided in different configurations as described in detail below with reference to FIGS. 4-7. A typical layout of a single plane lead carrier 60 is shown in FIG. 2. The lead carrier 60 is made to be flexible for increased reliability and ease of assembly. A lead carrier 60 can be comprised of elongated conductive elements 65 formed from a thermally and electrically conductive thin planer material such as beryllium copper alloy C3 having a thickness of about 3 mils. Each conductive element 65 is defined to include a trace, interconnect pad, via and any other conductive feature of the lead carrier that are electrically coupled. Other preferred alloys for the lead-carrierconductive elements 65 are full hard or hard copper alloys (110 or 197) or olin copper alloy 1094. Preferably, the lead carrier 60 is formed from custom flexible circuits from 3MTM and other manufacturers. These well known flexible circuits are typically comprised of one or more thin (1.4 mils thick) layers of conductive material that are die cut and drilled to form apertures 66, ground planes and conductive elements 65 which include traces, mounting pads and leads. The conductive layers typically are flanked by a thin
5
(typically 1 to 11 mill thick) layer of electrically-insulating, high-dielectric materials such at polyamide, polyester or teflon which results in circuit composites that are flexible. The material and thickness of individual layers that comprise the lead carriers 60 as well as spacing between con- 5 ductive elements 65 and the width of conductive elements 65 can be precisely controlled to provide a accurate and consistent impedance control in select conductive elements 65. Lead carriers 60 formed from custom flexible-circuits can have vias for connecting traces 65 located on different
10
planes and conductive pads (or leads), with solder coating having footprints that are compatible with standards for ball-grid array packages 50 for electrical and mechanical coupling to a printed wiring board 80.
Typically, each conductive element 65 in a lead carrier 60 has at least one aperture 66, adapted to receive an individual 15 package lead 52 and at least one interconnect portion 64 that extends away from the module to provide an external point of electrical connection to package leads 52. Interconnect portions 64 preferably have a spring-like resiliency for increased reliability. Apertures 66 have about the same 20 diameter as a package lead 52 allowing each package lead 52 to extend through the aperture 66 and for the lead carrier 60 to have substantial contact with the bottom surface 54 of a package 50. The application of heat (about 175 degrees centigrade) that is sufficient to cause the solder comprising 25 the package leads 52 to flow will cause the solder to adhere to a thin area of a conductive element 65 on the surface of the lead carrier 60 facing away from the package 50 that surrounds each aperture 66 to form flange 55 that provides excellent electrical and mechanical coupling between pack- 30 age leads 52 and the lead carrier 60. FIG. 3a illustrates the preferred semi-circle shape 66a for the aperture 66 where the conductive element 65 partially surrounds the package ball 52. The semicircle shape 66a, as opposed to a full-circle shape, enables an increased space for routing the conductive 35 elements 65 of the lead carrier 60.
The present invention utilizes standard manufactured packages 50 to form the multi-package module M. Such packages 50 typically have package lead 52 irregularities or inconsistencies, particularly, lead length and solder coating 40 variations. These variations make automated assembly problematic since the tolerances necessary to accommodate variation in lead 52 length, for example, do not permit the packages 50 to be assembled within the more stringent requirements for automated assembly of the module M. The 45 package leads 52 typically have excess solder that can cause electrical shorts between package leads 52. According to one aspect of the present invention, the leads 52 of the ball-gridarray packages 50 are scythed prior to assembly or as an automated step during the assembly after the lead carrier 60 50 is attached. Scything is the preferred method of reducing the length by which package leads 52 extend from the package 50. Scything is a method where a hot razor knife skims off the distal portion of all package leads 52.
Referring again to FIG. 1, lead carriers 60 are adhered to 55 adjacent packages 50 with a thermally conductive but electrical-insulating adhesive 70. The adhesive 70 may be epoxy, such as Rogers Corp. R/flex 8970 which is B-staged phenolic butyryl epoxy, that may be laminated at a temperature of 130 degrees centigrade and cured at a temperature of 60 about 175 degrees centigrade. The preferred method is to use a 2 mil thick sandwich of polyamide film 70, such as KaptonTM which includes a 0.5 mil thick layer of adhesive on both sides (a three-layer system). A thermally conductive filled adhesive 70 may be used to enhance the transfer of 65 heat between adjacent packages 50, and between the packages 50 and carrier 60.
6
Referring now to FIG. 4, a horizontally oriented embodiment of the present invention is illustrated. Typically, a module M is preassembled and then attached to a PWB 80 or other circuit carrying substrate. Alternately, the preassembled module M may be inserted into an integrated circuit socket.
In FIG. 4, a plurality of integrated circuit packages 50, each with an attached lead carrier 65, are stacked in a horizontally-oriented module M. In this configuration, each lead carrier 65 has an external interconnect portion 64 which extends from both sides of the module M to provide interconnection to an electrically and thermally conductive external interconnect structure 40. Structure 40 provides mechanical rigidity to the module M and is adhered to the upper surface 41 of the uppermost package 50. Structure 40 also includes circuit board interconnection portions 43 which may be formed for industry-standard socketability with an electrical socket carried in circuit board substrate 80.
A vertically-oriented configuration of module M is illustrated in FIG. 5. In this embodiment, lead carriers 60 are formed with external interconnect portions 64 all extending to one side which requires the conductive elements 65 to be more densely spaced. In this embodiment, external interconnect portions 64 are spaced in row and column configuration for socketing or soldering to circuit connections on circuit board substrate 80.
Another embodiment of module M is illustrated with reference to FIG. 6. In this embodiment, module M is formed in a two-high stack comprised of packages 50e and 50d. In this embodiment, package 50e has its package leads 52 mounted directly to corresponding array of external circuit connect pads carried in substrate 80. Upper package 50d is inverted with respect to package 50e and mounted to package 50d with thermally conductive adhesive layer 70. Surface 54 of package 50d includes package leads 52. A lead carrier 60, formed as described above, is adhered to surface 54 of package 50d with thermally conductive adhesive 70. External circuit interconnect portions 64 provide electrical connectivity for upper package 50d to circuit connection pads carried in substrate 80.
Referring now to FIG. 7, module M is shown in an alternative three-high configuration comprised of individual packages 50a, 50fc and 50c. A lead carrier 60 is adhered to the package lead surface 54 of each package. For clarity, package leads 52 are not shown as to packages 50a and 50fc. Lead carriers 60 for packages 50a and 50fc include external circuit connect portions 64b which are formed to nest together to provide mechanical rigidity and electrical and thermal conductivity for the module M. Lower package 50c has lead carrier 60c adhered to its lower surface 54 in the manner described above with thermally conductivity, electrically insulating adhesive. In this embodiment, circuit connection portions 64a of lead carrier 60c are selectively interconnected to connection portions 64b. Package leads 52 of lower package 50c are connected to external circuit connections carried in substrate 80 in a standard ball-gridarray pattern.
According to one specific method of the present invention, a method for manufacture a module M involves the following steps: (1) mounting an adhesive 70a to the bottom surface 56 of a package 50; (2) aligning and mounting a lead carrier 60 to the adhesive 70 wherein apertures 66 receive the package leads 52; (3) scything of the distal end of all package leads 52; (4) applying heat (about 175 degrees centigrade) to cure adhesive 70 and flow the package lead 52 solder coating; (5) mounting a second thin layer of adhesive
|
