Embodiments of the invention provide a method of plating a copper film on a substrate in an electrochemical plating apparatus. The method includes positioning a substrate in an electrolyte solution, applying a current between the substrate and an anode to generate a current density of between about 10...http://www.google.com.au/patents/US20030146102?utm_source=gb-gplus-sharePatent US20030146102 - Method for forming copper interconnects
