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US007202602B2
(12) United States Patent ao) Patent No.: Us 7,202,602 B2
Anandan (45) Date of Patent: Apr. 10,2007
(54) METAL SEAL PACKAGING FOR ORGANIC LIGHT EMITTING DIODE DEVICE
(75) Inventor: Munisamy Anandan, Del Valle, TX (US)
(73) Assignee: Organic Lighting Technologies LLC,
Austin, TX (US)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 10/818,042
(22) Filed: Apr. 5, 2004
(65) Prior Publication Data
US 2004/0201348 Al Oct. 14, 2004
Related U.S. Application Data
(60) Provisional application No. 60/461,099, filed on Apr. 8, 2003.
(51) Int. CI.
H0SB 33/00 (2006.01)
(52) U.S. CI 313/512; 313/504; 313/509
(58) Field of Classification Search 313/512,
313/504, 506, 509, 549, 561, 553; 428/917;
257/88, 100; 315/169.3 See application file for complete search history.
(56) References Cited
U.S. PATENT DOCUMENTS
6,573,652 Bl * 6/2003 Graff etal 313/512
6,628,071 Bl* 9/2003 Su 313/512
6,657,382 B2 * 12/2003 Nagai et al 313/512
2004/0119403 Al* 6/2004 McCormick et al 313/506
* cited by examiner
Primary Examiner—Ashok Patel
(57) ABSTRACT
A metal sealed organic light emitting diode device comprising a lid, containing a recessed portion to accommodate large quantity of getter/dessicant, a band of metal stack at the perimeter over which is laid a band of low temperature melting solder alloy, pre-tinned subsequently, and a substrate. The substrate containing organic light emitting diode at the central area with a band of metal stack at the perimeter. The lid and the substrate are placed together in substantial alignment such that the pre-tinned low melting solder band of the lid contacts the metal stack of the substrate and thermally sealed in a controlled atmosphere. Multiples of substrates are sealed with a single lid containing multiplicity of recessed portions with multi-segmented metal stack and pre-tinned solder band to derive a large area device.
11 Claims, 10 Drawing Sheets
