(12) United States Patent ao) Patent No.: us 6,538,312 Bi
Peterson et al. (45) Date of Patent: Mar. 25,2003
(54) MULTILAYERED MICROELECTRONIC DEVICE PACKAGE WITH AN INTEGRAL WINDOW
(75) Inventors: Kenneth A. Peterson, Albuquerque, NM (US); Robert D. Watson, Tijeras, NM (US)
(73) Assignee: Sandia Corporation, Albuquerque, NM (US)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 10/061,419
(22) Filed: Feb. 1, 2002
Related U.S. Application Data
(62) Division of application No. 09/571,335, filed on May 16, 2000, now Pat. No. 6,384,473.
(51) Int. CI.7 H01L 23/02
(52) U.S. CI 257/680; 257/778; 257/682;
257/693; 257/698; 257/704; 257/737; 257/738;
(58) Field of Search 257/680, 778,
257/682, 693, 698, 704, 737, 738, 779,
(56) References Cited
U.S. PATENT DOCUMENTS
5,357,056 A * 10/1994 Nagano 174/52.4
* cited by examiner
Primary Examiner—Albert W. Paladini
Assistant Examiner—Luan Thai
(74) Attorney, Agent, or Firm—Robert D. Watson (57) ABSTRACT
An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or hightemperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.
14 Claims, 7 Drawing Sheets