Search Images Maps Play YouTube News Gmail Drive More »
Advanced Patent Search | Page images | Web History | Sign in

Patents

  

llllllllllllll

United States Patent m

Sedberry

US005624708A [ii] Patent Number: [45] Date of Patent:

5,624,708 Apr. 29, 1997

[54] HIGH-DENSITY CIRCUIT AND METHOD OF ITS MANUFACTURE

[75] Inventor: Donald C. Sedberry, Gwynedd, Pa.

[73] Assignee: Max Levy Autograph, Inc.,
Philadelphia. Pa.

[21] Appl. No.: 331,854
[22] Filed: Oct. 31,1994

Related U.S. Application Data

[62] Division of Ser. No. 195,030, Feb. 14, 1994, Pat. No. 5,416.502, which is a division of Ser. No. 928,352, Aug. 12, 1992, Pat. No. 5,317,342, which is a division of Ser. No. 408,529, Sep. 18, 1989, Pat. No. 5,162,191, which is a division of Ser. No. 141,113, Jan. 5, 1988. Pat. No. 4.897, 676.

[51] Int. CI.6 B05D5/12

[52] U.S. CI 427/126.2; 427/314: 427/376.2

[58] Field of Search 427/126.2.314,

427/376.2

[56] References Cited

U.S. PATENT DOCUMENTS

2,932,710 4/1960 Coale 346/155

3,903.594 9/1975 Koneval 346/155

4,076^75 2/1978 Chang 346/155

4,149,171 4/1979 Sato et al 366/76 PH

4,159222 6/1979 Lebow et al 156/632

4,192,698 3/1980 Maheretal 156/89

4,289,364 9/1981 Strom 346/155

4,289,802 9/1981 Michel 346/155

4,298,786 11/1981 Marciniec 346/155

4,304.624 12/1981 Carson 3467155

4,312,897 1/1982 Reimann 346/155

4,322,733 3/1982 Moriguchi et al 346/76 PH

4,339,305 7/1982 Jones 346/155

4,344,817 8/1982 Chambedin 346/155

4,386,116 5/1983 Nair 346/155

4,391,849 7/1983 Bischoff 346/155

4,399,368 8/1983 Bakewell 346/76 PH

4,415,403 11/1983 Bakewell 346/155

4,428,690 1/1984 Mita 346/76 PH

4,439,270 3/1984 Powell 346/155

4,454,014 6/1984 Bischoff 346/155

4,454,167 6/1984 Bemdt 346/155

4,502,917 3/1985 Chambedin 3467155

4.508.753 4/1985 Stephan 346/155

4.508.754 4/1985 Stepan 346/155

4,534,814 8/1985 Volpe et al 346/76 PH

4,552,615 11/1985 Amendola 346/155

4.560,988 12/1985 Moriguchi et al 346/1.1

(List continued on next page.)

OTHER PUBLICATIONS

Mitchell et al., "Silicon Based Prinfhead Design" IBM Disclosure Bulletin, vol. 22. No. 12. May 1980, pp. 5496-5498.

R. D. Jones. Hybrid Circuit Design and Manfacture Marcel
Dekker, Inc. New York. 1982 pp. 17-21, 27-29, 31-36.

Primary Examiner—-Benjamin Utech
Attorney, Agent, or Firm—William H. Eilberg

[57] ABSTRACT

The present invention is a high-density circuit, wherein the circuit conductors, and the spaces between conductors, are preferably less than about 0.005 inches wide, and wherein the lines are disposed over a relatively large area. The circuit is defined by a pattern of grooves in a dielectric substrate, and a conductive material is deposited in the grooves, and heated so as to form a tight bond with the substrate. The resulting circuit is stable, rugged, and capable of withstanding a wide range of adverse environmental conditions. The invention includes the circuit itself, as well as processes used in its manufacture. The invention also includes a highdensity print head, for a thermal or electrostatic printer, made from the circuit described. The rugged, high-density circuit of the present invention can generate a set of very closely-spaced conductors which are then used to produce a high-density image. The invention also includes a multilayered version of the circuit, and a method of making the circuit with multiple layers. The invention permits the production of black and white or color halftone images having very large numbers of grey scale levels, and exceptional resolution.

12 Claims, 13 Drawing Sheets

[graphic]

Page 2

U.S. PATENT DOCUMENTS

4,566.040 1/1986 Itsumi 346/155

4,569,902 2/1986 Saito 346/155

4,574,094 3/1986 DeLuca 346/155

4.581,098 4/1986 Gregor 346/155

4,601,777 7/1986 Hawkins 346/155

4,604,298 8/1986 Shevtchuk et al 427/96

4.606.787 8/1986 PeDigrino 346/155

4.606.788 8/1986 Moran 346/155

4,609,427 9/1986 Inamoto 346/155

4,612,083 9/1986 Yasumoto 346/155

4,614,563 9/1986 Kubo 346/155

4,617,193 10/1986 Wu 346/155

4,622.058 11/1986 Leaty-Renick 346/155

4,623356 11/1986 Brown 346/155

4.636.811 1/1987 Bakewell 346/76 PH

4.636.812 1/1987 Bakewell 346/76 PH

4,651,168 3/1987 Terajima et al 346/76 PH

4,657,778 4/1987 Moran 346/155

4,670,091 6/1987 Thomas 346/155

4,672,737 6/1987 Carson 346/155

4,679,054 7/1987 Yoshikawa et al 346/76 PH

4,681,656 7/1987 Byium 346/155

4,685,998 8/1987 Quinn 346/155

4,690,833 9/1987 Donson 346/155

4,692,205 9/1987 Sachdev 346/155

4,698,125 10/1987 Rhodes 346/155

4,897,676 1/1990 Sedberry 346/155

4,997,698 3/1991 Oboodi et al 428/209

5,162,191 11/1992 Sedberry 430/498

GENERALIZED PROCESS STEPS FOR SINGLE LAYER CIRCUIT CONSTRUCTION
SELECT SUBSTRATE TYPE |- 101

[merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][graphic][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small][merged small]
[graphic][merged small]
« PreviousContinue »