IIIH
US006229711B1
(12) United States Patent ao) Patent No.: us 6,229,711 Bi
Yoneda (45) Date of Patent: May 8,2001
(54) FLIP-CHIP MOUNT BOARD AND FLIP-CHIP MOUNT STRUCTURE WITH IMPROVED MOUNTING RELIABILITY
(75) Inventor: Yoshihiro Yoneda, Kawasaki (JP)
(73) Assignee: Shinko Electric Industries Co., Ltd.,
Nagano (JP)
( * ) Notice: Subject to any disclaimer, the term ol this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 09/257,035
(22) Filed: Feb. 25, 1999
(30) Foreign Application Priority Data
Aug. 31, 1998 (JP) 10-246225
Int. C I. I105K 7/02
U.S. CI 361/760; 361/767; 361/807
361/808; 257/778; 257/780; 257/737; 257/738 174/52.1; 174/52.2; 174/259; 174/260
174/262
Field of Search 361/760, 765,
361/767, 748, 807, 808; 257/778, 779, 780, 737, 738, 739; 174/52.2, 52.1, 259, 260, 262, 253, 254; 228/180.22
(56) References Cited
U.S. PATENT DOCUMENTS
4,413,309 * 11/1983 Takahashi et al 361/774
5,400,950 * 3/1995 Myers et al 228/180.22
5,428,505 * 6/1995 Sakemi et al 361/777
5,477,933 * 12/1995 Nguyen 174/262
5,517,756 * 5/1996 Shirai et al 29/847
5,528,001 * 6/1996 Roberts 174/268
5,535,101 * 7/1996 Miles et al 367/808
5,547,740 * 8/1996 Higdon et al 428/209
5,611,481 * 3/1997 Akamaatsu et al 228/180.22
5,615,477 * 4/1997 Sweitzer 29/840
5,878,942 * 3/1999 Kodama et al 228/180.22
5,973,404 * 10/1999 Akram et al 257/778
FOREIGN PATENT DOCUMENTS
354161269A * 12/1979 (JP) H01L/23/50
* cited by examiner
Primary Examiner—-Jeffrey GafEn
Assistant Examiner—David Foster
(74) Attorney, Agent, or Firm—Staas & Halsey LLP
(57) ABSTRACT
A flip-chip mount board includes a circuit board provided with a plurality ol conductor patterns to which a plurality ol bumps provided on an electronic component can be connected via a connection medium provided on the conductor patterns. The conductor pattern includes at least one wiring pattern and a connection pad, the wiring pattern serves as an interconnection, the connection pad is provided at a position corresponding to one ol the bumps, the at least one wiring pattern and the connection pad are provided in an integrated manner, and a width (Wl) ol the connection pad is formed so as to be greater than a width (W2) ol the wiring pattern (W1>W2).
20 Claims, 9 Drawing Sheets
