Search Images Maps Play YouTube News Gmail Drive More »
Advanced Patent Search | Page images | Web History | Sign in

Patents

  

niniiirimi nintu inn Him mniiiiiiiiii iiiiiiiin mm m mn mi

US005441343A

United States Patent [19] [ii] Patent Number: 5,441,343

Pylkki et al. [45] Date of Patent: Aug. 15, 1995 Page 2

T54] THERMAL SENSING SCANNING PROBE
MICROSCOPE AND METHOD FOR
MEASUREMENT OF THERMAL
PARAMETERS OF A SPECIMEN

[75] Inventors: Russell J. Pylkki, Arcadia; Marc
Schuman, San Francisco; Paul E.
West, Cupertino, all of Calif.

[73] Assignee: Topometrix Corporation, Santa Clara, Calif.

[21] Appl. No.: 127,661
[22] Filed: Sep. 27, 1993

[51] Int. CI.* G01K 7/00; G01K 3/06;

G01N 25/18; G01B 9/04

[52] U.S. CI 374/137; 374/44;

374/124; 374/142; 374/164; 250/307; 73/105;

356/376

[58] Field of Search 374/44, 124, 137, 120,

374/142, 121, 164; 250/330, 306, 307; 73/105;

356/376

[56] References Cited

U.S. PATENT DOCUMENTS

[blocks in formation]
[blocks in formation]

The scanning thermal probe microscope measures a thermal parameter such as thermal conductivity or temperature of surface contours of a specimen with a thermal sensor maintained in thermal communication with the surface of the specimen and maintained at a temperature different than that of the specimen. The thermal sensor is disposed on the free end of a cantilever arm in thermal communication with the probe. A thermal feedback bridge circuit can maintain the thermal sensor at a constant temperature by heating or cooling the sensor, and provides a signal for determining the heat transfer between the probe and the specimen. The cantilever arm includes first and second legs of electrically conductive material, and the thermal sensor comprises a narrowed portion of the conducting material having a relatively high temperature coefficient of resistance.

9 Claims, 4 Drawing Sheets

[graphic]

OTHER PUBLICATIONS

C. C. Williams, et al.; "Photothermal Imaging with
Sub-100-nm Spatial Resolution"; Jul. 27-30, 1987; pp.
364-369 [Photoacoustic and Photothermal Phenomena
Proceedings of the 5th International Topical Meeting,
Heidelberg, Fed. Rep. of Germany].
Y. Marting, et al.; "Tip-Techniques For Microcharac-
terization of Materials"; Oct. 5, 1987; pp. 3-8 ^Scanning
Microscopy, vol. 2, No. 1].

H. K. Wickramasinghe; "Near-Field Thermal Microscopy"; 1991; pp. 214-219 [Scanning Tunneling Microscopy II: Further Applications and Related Scanning Technology}.

C. C. Williams, et al.; "Scanning chemical potential microsope: A new technique for atomic scale surface investigation"; Aug. 20, 1990; pp. 537-540 [/. Vac. Science Technology B 9 (2)].

M. Nonnenmacher, et al.; "Kelvin probe force micros

copy"; Apr. 27. 1991; pp. 2921-2923 [Appl. Phys. Lett 58 (25)].

K. Dransfeld, et al; "The heat transfer between a heated tip and a substrate: fast thermal microscopy"; Aug. 4. 1988; pp. 35-42 [Journal of Microscopy, vol. 152, Pt 1].

Yogesh B. Gianchandani; "A Bulk Silicon Dissolved Wafer Process for Microelectromechanical Devices"; Jun. 30, 1992; pp. 77-85 [Journal of Microelectromechanical Systems, vol. 1, No. 2].

Jianbin Xu, et al.; "On the Energy Dissipation In Field - Emission and Tunneling Microscopy"; 1993; pp. 89-100 [Nanosources and Manipulation of Atoms Under High Field and Temperatures: Applications]. Jianbin Xu; [Heat Transfer between Two metallic Surfaces at Small Distances]Max. 1993; pp. 1-88. TSI, St. Paul, Minn. Manufacturer of hot-wire and hot-film probes; [Hot Film and Hot Wire Anemometry Theory and Application](No Date).

[merged small][merged small][merged small][merged small][graphic]
[merged small][graphic][graphic]
« PreviousContinue »