(12) United States Patent ao) Patent No.: us 6,169,295 Bi
Koo (45) Date of Patent: Jan. 2,2001
(54) INFRARED TRANSCEIVER MODULE AND METHOD FOR MAKING SAME
(75) Inventor: Ronald B. Koo, Mt. View, CA (US)
(73) Assignee: Maxim Integrated Products, Inc.
( * ) Notice: Under 35 U.S.C. 154(b), the term of this patent shall be extended for 0 days.
(21) Appl. No.: 09/087,384
(22) Filed: May 29, 1998
(51) Int. C I. H01L 33/00
(52) U.S. CI 257/81; 257/82; 257/84
257/85; 257/98; 257/99; 257/100; 257/432 257/433; 438/25; 438/26; 438/27; 438/28
438/29
(58) Field of Search 257/80, 81, 82,
257/84, 85, 98, 99, 100, 432, 433, 434;
438/25, 26, 27, 28, 29
(56) References Cited
U.S. PATENT DOCUMENTS
3,881,113 * 4/1975 Rideout et al 250/551
4,058,821 * 11/1977 Miyoshi et al 357/19
4,851,695 * 7/1989 Stein 250/551
4,906,839 * 3/1990 Lee 250/239
5,382,810 * 1/1995 Isaksson 257/81
5,506,445 4/1996 Rosenberg 257/666
5,668,383 9/1997 Krieger 257/80
5,753,928 * 5/1998 Krause 250/551
5,920,587 * 7/1999 Narai et al 372/50
FOREIGN PATENT DOCUMENTS
363016682 * 1/1988 (IP) .
363065683 * 3/1988 (IP) .
363073678 * 4/1998 (IP) .
410242506 * 9/1998 (IP) .
* cited by examiner
Primary Examiner—-William Mintel
(74) Attorney, Agent, or Firm—Hickman Coleman & Hughes, LLP
(57) ABSTRACT
An IR transceiver module includes a lead frame, a sensor, an emitter, and a body encapsulating the sensor and emitter, where the body has an integrally formed lens aligned with both the sensor and with the emitter. The sensor is supported proximate to a support surface of the lead frame and has a sensing area which is generally parallel to the support surface. The emitter is supported proximate to the sensor and within a vertical projection of the sensing area, i.e. it is vertically aligned with the sensor. In embodiments of the invention, a recess is formed into the sensing surface of the sensor that is provided with a reflective material to form a reflective cup for the emitter. In other embodiments, a transceiver is also supported proximate to the lead frame and is electrically coupled to both the sensor and the emitter. By providing a module having both the emitter and sensor aligned with a single lens, a very small form factor can be achieved.
18 Claims, 7 Drawing Sheets
