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US006955720B2
(12) United States Patent ao) Patent No.: us 6,955,720 B2
Gurer et al. (45) Date of Patent: Oct. 18,2005
(54) PLASMA DEPOSITION OF SPIN CHUCKS TO REDUCE CONTAMINATION OF SILICON WAFERS
(75) Inventors: Emir Gurer, Scotts Valley, CA (US);
Ed C. Lee, Cupertino, CA (US);
Richard Savage, Scotts Valley, CA
(US)
(73) Assignee: ASML Holding N.V. (NL)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 09/874,073
(22) Filed: Jun. 4, 2001
(65) Prior Publication Data
US 2001/0044217 Al Nov. 22, 2001
Related U.S. Application Data
(63) Continuation ol application No. 09/275,360, filed on Mar. 23, 1999, now Pat. No. 6,242,364.
(51) Int. CI.7 H01L 21/00; C23C 16/00
(52) U.S. CI 118/52; 118/724; 118/725;
118/728; 118/500; 156/345.51; 156/345.53;
156/915; 279/3
(58) Field of Search 118/52, 715-730,
118/500; 156/345.51, 345.53, 915; 279/3
(56) References Cited
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FOREIGN PATENT DOCUMENTS
JP 52084964 A * 7/1977 H01L/21/205
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JP 10321545 A * 12/1998 H01L/21/26
* cited by examiner
Primary Examiner—P. Hassanzadel
Assistant Examiner—Ram N Kackar
(74) Attorney, Agent, or Firm—Blakely, Sokoloff, Taylor &
Zafman
(57) ABSTRACT
An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.
11 Claims, 6 Drawing Sheets
