METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/DIELECTRIC/POST ...

(19) United States

(60) Division of application No. 13/192,463, filed on Jul. 28, 2011, Which is a continuation-in-part of application No. 12/616,773, filed on Nov. 11, 2009, Which is a continuation-in-part of application No. 12/616,775, filed on Nov. 11, 2009, said application No. 12/616, 773 is a continuation-in-part of application No. 12/557,540, filed on Sep. 11, 2009, Which is a continuation-in-part of application No. 12/406,510, filed on Mar. 18, 2009, said application No. 12/616,773 is a continuation-in-part of application No. 12/557,541, filed on Sep. 11, 2009, noW Pat. No. 7,948,076, Which is a continuation-in-part of application No. 12/406, 510, filed on Mar. 18, 2009, said application No. 12/ 61 6,775 is a continuation-in-part of application No. 12/557,540, filed on Sep. 11, 2009, Which is a continuation-in-part of application No. 12/406,510, filed on Mar. 18, 2009, said application No. 12/616,775 is a continuation-in-part of application No. 12/557,541, filed on Sep. 11, 2009, noW Pat. No. 7,948,076, Which is a continuation-in-part of application No. 12/406, 510, filed on Mar. 18, 2009.

cation No. 61/064,748, filed on Mar. 25, 2008, provisional application No. 61/150,980, filed on Feb. 9, 2009, provisional application No. 61/ 1 50,980, filed on Feb. 9, 2009, provisional application No. 61/150,980, filed on Feb. 9, 2009.

Publication Classification

(51) Int. Cl. H01L 33/62 (2010.01) H01L 21/58 (2006.01) (52) U.s.Cl. ................. .. 438/26; 438/122;257/E33.057; 257/E21.505 (57) ABSTRACT

A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, Wherein the first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive and is aligned With a first aperture in the first conductive layer, the second post extends from the dielectric base in a second vertical direction into a second opening in the second adhesive and is aligned With a second aperture in the second conductive layer and the dielectric base is sandWiched betWeen and extends laterally from the posts, then floWing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal and selected portions of the conductive layers, Wherein the pad extends beyond the dielectric base in the first vertical direction and the terminal extends beyond the dielectric base in the second vertical direction, providing a heat spreader that includes the posts and the dielectric base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

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