United States Patent m
US005763939A [ii] Patent Number:  Date of Patent:
 SEMICONDUCTOR DEVICE HAVING A PERFORATED BASE FBLM SHEET
 Inventor: Chikara Yamashita, Tokyo, Japan
 Assignee: NEC Corporation, Tokyo, Japan
 Appl. No.: 529,341
 Filed: Sep. 18,1995
 Foreign Application Priority Data
Sep. 30, 1994 [JP] Japan 6-236985
 Int. CI.6 H01L 23/495; H01L 23/02
 U.S. CI 257/668; 257/686; 257/774
 Field of Search 257/668, 686,
 References Cited
U.S. PATENT DOCUMENTS
5,045,914 9/1991 Casta et al 357/70
5,045,921 9/1991 Lin et al 357/74
5,291,062 3/1994 Higgins, HI 257/698
FOREIGN PATENT DOCUMENTS 6268101 9/1994 Japan.
Patent Abstract of Japan JP 56 134743 Oct. 21, 1981.
Primary Examiner—Tom Thomas
Assistant Examiner—David Ostrowski
Attorney, Agent, or Firm—Whitham, Curtis & Whitham
In a semiconductor device which has a base film sheet to support a semiconductor chip in a center region of the base film sheet, a plurality of via holes are formed within a peripheral region of the base film sheet. The via holes may be used to mount a metal plate on the base film, sheet or to support another semiconductor chip, by forming ball bumps on or in the via holes. A circuit board may be attached to the base film sheet by the use of the bumps or pins extended through the via holes.
12 Claims, 8 Drawing Sheets