Semiconductor device having a perforated base film sheet

United States Patent m

Yamashita

US005763939A [ii] Patent Number: [45] Date of Patent:

5,763,939 Jun. 9,1998

[54] SEMICONDUCTOR DEVICE HAVING A PERFORATED BASE FBLM SHEET

[75] Inventor: Chikara Yamashita, Tokyo, Japan

[73] Assignee: NEC Corporation, Tokyo, Japan

[21] Appl. No.: 529,341

[22] Filed: Sep. 18,1995

[30] Foreign Application Priority Data

Sep. 30, 1994 [JP] Japan 6-236985

[51] Int. CI.6 H01L 23/495; H01L 23/02

[52] U.S. CI 257/668; 257/686; 257/774

[58] Field of Search 257/668, 686,

257/774

[56] References Cited

U.S. PATENT DOCUMENTS

5,045,914 9/1991 Casta et al 357/70

5,045,921 9/1991 Lin et al 357/74

5,291,062 3/1994 Higgins, HI 257/698

FOREIGN PATENT DOCUMENTS 6268101 9/1994 Japan.

OTHER PUBLICATIONS

Patent Abstract of Japan JP 56 134743 Oct. 21, 1981.

Primary Examiner—Tom Thomas

Assistant Examiner—David Ostrowski

Attorney, Agent, or Firm—Whitham, Curtis & Whitham

[57] ABSTRACT

In a semiconductor device which has a base film sheet to support a semiconductor chip in a center region of the base film sheet, a plurality of via holes are formed within a peripheral region of the base film sheet. The via holes may be used to mount a metal plate on the base film, sheet or to support another semiconductor chip, by forming ball bumps on or in the via holes. A circuit board may be attached to the base film sheet by the use of the bumps or pins extended through the via holes.

12 Claims, 8 Drawing Sheets