(19) United States
(12) Patent Application Publication (io) Pub. No.: US 2003/0162463 Al
Hayashi et al. (43) Pub. Date: Aug. 28,2003
(54) ELEMENT TRANSFER METHOD, ELEMENT ARRANGMENET METHOD USING THE SAME, AND IMAGE DISPLAY
(76) Inventors: Kunihiko Hayashi, Kanagawa (JP);
Yoshiyuki Yanagisawa, Kanagawa (JP);
Toshiaki Iwafuchi, Kanagawa (JP);
Hisashi Ohba, Kanagawa (JP)
Correspondence Address:
BELL, BOYD & LLOYD, LLC
P. O. BOX 1135
CHICAGO, IL 60690-1135 (US)
(21) Appl. No.: 10/297,872
(22) PCT Filed: Apr. 9, 2002
(86) PCT No.: PCT/JP02/03549
(30) Foreign Application Priority Data
Apr. 11, 2001 (JP) 2001-112401
Jun. 5, 2001 (JP) 2001-169857
Jun. 27, 2001 (JP) 2001-194890
A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is disclosed. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer is heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be certainly, efficiently, and accurately transferred without exerting adverse effect on other parts.
