In cases where there are at least some large gaps between edges of a semiconductor die and the inner ends of package conductors defining a die-receiving area, one or more bond wire support structure are disposed in the gap, thereby causing a long bond wire to behave as two or more shorter bond wires....http://www.google.com.au/patents/US5561086?utm_source=gb-gplus-sharePatent US5561086 - Techniques for mounting semiconductor dies in die-receiving areas having support structure having notches
