Disclosed is a low-cost high-performance semiconductor chip package enabling a direct chip to printed circuit board connection. The package comprises a semiconductor chip having a front surface and a back surface. The front surface comprises pads for input and output of signals to and from the chip....http://www.google.com.au/patents/US4980753?utm_source=gb-gplus-sharePatent US4980753 - Low-cost high-performance semiconductor chip package
