In advanced electrolytic polish (AEP) method, a metal wafer (10) acts as an anodic electrodes and another metal plate (65) is used as a cathodic electrode. A voltage differential is applied to the anode and cathode under a predetermined anodic dissolution current density. This causes a reaction that...http://www.google.com.au/patents/US7077725?utm_source=gb-gplus-sharePatent US7077725 - Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus