A semiconductor device 39. The device includes an interposer 31 having two major surfaces. The first surface 311 includes patterned metal conductors and bond pads 351, and the second surface includes an array of solder balls 33. The device includes a semiconductor chip 30 having a top surface and a back...http://www.google.com.au/patents/US20050082649?utm_source=gb-gplus-sharePatent US20050082649 - Package for a semiconductor device
