This invention is directed to a controlled low profile electrodeposited copper foil. In one embodiment this foil has a substantially uniform randomly oriented grain structure that is essentially columnar grain free and twin boundary free and has an average grain size of up to about 10 microns. In one...http://www.google.com.au/patents/US5431803?utm_source=gb-gplus-sharePatent US5431803 - Electrodeposited copper foil and process for making same
