A light emitting die package and a method of making the light emitting die package are disclosed. The die package includes a stem substrate having grooves, a wire lead attached to the grooves, and a light emitting diode (LED) mounted on the stem substrate. Also coupled to the substrate are a sleeve,...http://www.google.com.au/patents/US7078254?utm_source=gb-gplus-sharePatent US7078254 - LED package die having a small footprint
