A method and apparatus for producing a multichip package comprising semiconductor chip and a substrate. The semiconductor chip includes conventional inner bond pads that are rerouted to other areas on the chip to facilitate connection with the substrate. The inner bonds are rerouted by covering the chip...http://www.google.com.au/patents/US6134118?utm_source=gb-gplus-sharePatent US6134118 - Conductive epoxy flip-chip package and method
