Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal...http://www.google.com.au/patents/US20040048202?utm_source=gb-gplus-sharePatent US20040048202 - Metal bump with an insulating sidewall and method of fabricating thereof
