In an electronic circuit equipment using a multilayer circuit board on which a semiconductor chip is mounted, a thin film capacitor is provided on the multilayer circuit board. Moreover, a first electrode of the thin film capacitor and a first wiring of the multilayer circuit board are electrically connected...http://www.google.com.au/patents/US6757178?utm_source=gb-gplus-sharePatent US6757178 - Electronic circuit equipment using multilayer circuit board
