A method and composition for removing silicon-containing sacrificial layers from Micro Electro Mechanical System (MEMS) and other semiconductor substrates having such sacrificial layers is described. The etching compositions include a supercritical fluid (SCF), an etchant species, a co-solvent, and optionally...http://www.google.com.au/patents/US20050118813?utm_source=gb-gplus-sharePatent US20050118813 - Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations
