With the mounting of a semiconductor chip onto a substrate having a portion of adhesive the bondhead is lowered to a predetermined height H above a support holding the substrate. At the same time, the pick-up tool is fixed in an upper limit position on the bondhead. As soon as the bondhead has reached...http://www.google.com.au/patents/US6648215?utm_source=gb-gplus-sharePatent US6648215 - Method and apparatus for mounting semiconductor chips
