A process is described for selective removal of unwanted metallization from the surface of a semiconductor device. The process comprises the usual deposition of a configurable image defining layer on the surface of the device upon which a suitable pad limiting metallurgy (PLM) has already been deposited....http://www.google.com.au/patents/US4861425?utm_source=gb-gplus-sharePatent US4861425 - Lift-off process for terminal metals
