A tape for use in tape-automated-bonding of integrated circuits is disclosed. A series of interconnection arrays ("frames") are arranged along the tape, each array being formed by a number of interconnection beams 3. A terminal ("bump") 6 is located on each beam 3 for bonding to a respective interconnection...http://www.google.com.au/patents/US5223321?utm_source=gb-gplus-sharePatent US5223321 - Tape-automated bonding of integrated circuits
