A method for forming a standoff structure for devices, e.g., optical devices, integrated circuit devices, micro-electrical mechanical systems (i.e., MEMS). The method includes providing a substrate (e.g., silicon wafer), which has a first surface region characterized by a <100> crystal orientation, a...http://www.google.com.au/patents/US7109120?utm_source=gb-gplus-sharePatent US7109120 - Profiled standoff structure and method for optical display package
