A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging...http://www.google.com.au/patents/US20060055061?utm_source=gb-gplus-sharePatent US20060055061 - Semiconductor device and a method of assembling a semiconductor device
