An improved apparatus for the plating of the projecting, bent contact elements of electronic components encapsulated in ceramic packages--suitably of the type known as C-Dips--is provided with a continuous flexible conveyor belt of stainless steel running in a vertically aligned loop with a web of the...http://www.google.com.au/patents/US4508611?utm_source=gb-gplus-sharePatent US4508611 - Apparatus for electroplating and chemically treating the contact elements of encapsulated electronic components and like devices
