The present invention discloses a method for mounting multiple integrated circuit (IC) chips on a top surface of a substrate. The method includes a step forming a first footprint to include a plurality of electrical contacts on the top surface for mounting a first IC chip thereon. The method further...http://www.google.com.au/patents/US6677668?utm_source=gb-gplus-sharePatent US6677668 - Configuration for testing a substrate mounted with a most performance-demanding integrated circuit
