A resin-molded semiconductor device applying an insulation plate unit mounted on a metal die-stage of a metal lead-frame. On the insulating plate unit, an integrated circuit semiconductor chips or a plurality of integrated circuit semiconductor chips are mounted and a plurality of relay-pads for relaying...http://www.google.com.au/patents/US4903114?utm_source=gb-gplus-sharePatent US4903114 - Resin-molded semiconductor
