A method of fabricating a chip package structure includes the steps of providing a lead frame having a die pad, plural leads and at least one structure enhancement element. A chip is then disposed on the die pad and plural bonding wires are formed to electrically connect the chip to the leads. Then,...http://www.google.com.au/patents/US7683462?utm_source=gb-gplus-sharePatent US7683462 - Chip package structure
