Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive...http://www.google.com.au/patents/US20030217932?utm_source=gb-gplus-sharePatent US20030217932 - Device providing electrical contact to the surface of a semiconductor workpiece during processing
