An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill...http://www.google.com.au/patents/US7948090?utm_source=gb-gplus-sharePatent US7948090 - Capillary-flow underfill compositions, packages containing same, and systems containing same
