In a semiconductor device, a first semiconductor chip is stacked on a wiring substrate and has first electrode pads disposed at predetermined positions on an upper surface thereof. A second semiconductor chip is stacked on the first semiconductor chip through an insulating member in an offset manner...http://www.google.com.au/patents/US20090096111?utm_source=gb-gplus-sharePatent US20090096111 - Semiconductor device and method of manufacturing the same
