A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of such as gold on an upper surface or a...http://www.google.com.au/patents/US7268438?utm_source=gb-gplus-sharePatent US7268438 - Semiconductor element including a wet prevention film
