Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first...http://www.google.com.au/patents/US6319810?utm_source=gb-gplus-sharePatent US6319810 - Method for forming solder bumps
