A MEMS fabrication process eliminates through-wafer etching, minimizes the thickness of silicon device layers and the required etch times, provides exceptionally precise layer to layer alignment, does not require a wet etch to release the moveable device structure, employs a supporting substrate having...http://www.google.com.au/patents/US20040060898?utm_source=gb-gplus-sharePatent US20040060898 - Process for high yield fabrication of MEMS devices
