A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated...http://www.google.com.au/patents/US6768064?utm_source=gb-gplus-sharePatent US6768064 - Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
