A method for separating chips from a diamond wafer comprising a substrate, a chemically vapor-deposited diamond layer, and microelectronic elements, with the microelectronic elements protected from thermal damage and degradation caused by the thermally decomposed cuttings produced during the processing...http://www.google.com.au/patents/US6805808?utm_source=gb-gplus-sharePatent US6805808 - Method for separating chips from diamond wafer
