There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible...http://www.google.com.au/patents/US20030160256?utm_source=gb-gplus-sharePatent US20030160256 - Plastic packaging of LED arrays
