In one embodiment, a semiconductor package includes a first insulating body and a first semiconductor chip having a first active surface and a first back surface opposite the first active surface. The first semiconductor chip is disposed within the first insulating body. The first active surface is exposed...http://www.google.com.au/patents/US8093703?utm_source=gb-gplus-sharePatent US8093703 - Semiconductor package having buried post in encapsulant and method of manufacturing the same
