A semiconductor element mounted on a board is sealed with a sealing resin, The semiconductor element is electrically bonded to the board through a soldering bump. The sealing resin includes a silicone gel as a base resin and a filler filled into a silicone gel. A diameter of the filler is equal to or...http://www.google.com.au/patents/US5349240?utm_source=gb-gplus-sharePatent US5349240 - Semiconductor device package having a sealing silicone gel with spherical fillers
