There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor...http://www.google.com.au/patents/US6097089?utm_source=gb-gplus-sharePatent US6097089 - Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
